PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

More documents

Recommendations

Info

PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2Mechanical Dimensions of the PowerPC 750 360 CBGA PackageFigure 17. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA PackageTop ViewDD1CHIPCAPACITORE3E22X0.2ANOTES:1. DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.2. DIMENSIONS IN MILLIMETERS.3. TOP SIDE A1 CORNER INDEX IS AMETALIZED FEATURE WITH VARIOUSSHAPES. BOTTOM SIDE A1 CORNER ISDESIGNATED WITH A BALL MISSING FROMTHE ARRAY.MILLIMETERSDIM Minimum MaximumEE1E2E3A 2.65 3.20A1 0.80 1.00A2 1.10 1.30b 0.82 0.93D25.00 BSCD1 5.443D2D3D2D3D2 2.48D3 6.3e1.27 BSC2X0.2BA01 Corner LocatorA01 CornerE25.00 BSCE1 8.075E2 2.48E3 7.43C19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 10.15 CWVUX-ray view of ballsfrom top of package(18x)TRPNMLKJHGFEDCBAe(18x)There is no ball in the A01 position360X b0.3 C A B0.15 CA01 CornerAA2A1Not To ScaleNote: All caps on the SCM are lower in height than the processor die.9/6/2002 Version 2.0 Page 36
PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2Figure 18. 360 CBGA Decoupling CapacitorsC4C3GNDGND0.51 (typical)1.85 (typical)0.83 (typical)V DDOV DD3.45 typicalC5GNDV DDGNDC2L2OV DDCHIPOV DDC6GNDVDDGNDC1L2OV DDSee note 1.GNDC7GNDC8A0 CornerChip Carrier (pins down)Notes:1. For PID8 - 750 dd2.x, this capacitor is connected to V DD . For dd3.x, this capacitor is connected to AV DD .2. For dd3.x, AV DD is no longer brought to the BGA pin.3. All installed caps are 47 nF.Page 37 Version 2.0 9/6/2002
Page 1 and 2: PowerPC 740 and PowerPC 750Micropro
Page 5 and 6: PowerPC 740 and PowerPC 750 Micropr
Page 35: PowerPC 740 and PowerPC 750 Micropr

PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?