CH-TRAMPAC - Waste Isolation Pilot Plant - U.S. Department of ...

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CH-TRAMPAC Document Rev. 2, May 2005Table 4.3-4 – Allowable Materials for Waste Material Types II.1 and II.2 Solid Inorganic MaterialsAbsorbents/adsorbents (e.g., Celite ® , Florco ® , Oil-Dri ® , diatomite, perlite, vermiculite) AsbestosAsh (e.g., ash bottoms, fly ash, soot)Batteries, dry (e.g., flashlight)Ceramics (e.g., molds and crucibles)Clays (e.g., bentonite)Concrete/Portland cement (surface contaminated only)Fiberglass, inorganicFilter media, inorganicFirebrickGlass (e.g., borosilicate glass, labware, leaded glass, Raschig rings)Graphite (e.g., molds and crucibles)GritHeel (e.g., ash heel; soot heel; firebrick heel; sand, slag, and crucible heel)Insulation, inorganicMagnesium alloyMetal oxides (e.g., slag)Metals (e.g., aluminum, cadmium, copper, steel, tantalum, tungsten, zinc)Nitrates (e.g., ammonium nitrate, sodium nitrate)Salts (e.g., calcium chloride, calcium fluoride, sodium chloride)Sand/soil, inorganicOther inorganic materialsNotes: Other chemicals or materials not identified in this table are allowed provided that they meet the requirements ofSection 4.3.1. All materials in the final waste form must be inert (nonreactive), be in a nonreactive form, orhave been rendered nonreactive. Dry absorbents/adsorbents and other dry desiccants are allowed if they contain no absorbed or adsorbed liquids.4.3-6
CH-TRAMPAC Document Rev. 2, May 2005Table 4.3-5 – Allowable Materials for Waste Material Type II.3 Homogeneous Solid Inorganic Materials with Unbound Absorbed AmbientMoisture (≤6% by weight)Any material in Waste Material Types II.1 and II.2 (Table 4.3-4) and water as unbound absorbed ambientmoisture (≤6% by weight).Note: Other chemicals or materials not identified in this table are allowed provided that they meet the requirements ofSection 4.3.1. All materials in the final waste form must be inert (nonreactive), be in a nonreactive form, orhave been rendered nonreactive.4.3-7
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CH-TRAMPAC - Waste Isolation Pilot Plant - U.S. Department of ...

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