Medical Applications Guide (Rev. B - Mouser Electronics

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64➔Medical ImagingComponent Recommendations for MRI ApplicationsComponent Recommendations (Continued)Component Description Key Features Benefits Other TI SolutionsPower Management ProductsPTH04T240 Power Module 10A, 2.2V to 5.5V V IN , adjustable V OUT , with TurboTrans Complete power supply designed to meet ultra-fast PTH04T241transient requirementsPTH08T220 Power Module 16A, 4.5-V to 14V V IN , adjustable V OUT , with TurboTrans Complete power supply designed to meet ultra-fast PTH08T221transient requirementsPTQA430033 Isolated DC/DC Module 100W, 1500VDC isolation, differential remote sense High efficiency, industry-standard pin-compatible PTQB425080TPS3307 Voltage Supervisor Triple processor supervisor Two fixed and one adjustable supervisor for TPS3808system flexibilityTPS40020 DC/DC Controller 2.25V to 5.5V IN , synchronization pin, enable Eliminate beat noise/ceramic caps/FPGA/regulationfrom main power supplyTPS40075 DC/DC Controller 4.5V to 28V IN , synchronization pin, enable Eliminate beat noise/ceramic caps/FPGA/regulation TPS40057from main power supplyTPS74401 Single-channel LDO 3.0A ultra-low dropout linear regulator Split bias and supply pin minimize heat generation TPS74301TPS54317 DC/DC Converter 3.0V to 6.0V IN 3A DC/DC with integrated switch FET, Eliminate beat noise/ceramic caps/FPGA/integration TPS54610/TPS54910synchronization pin, enableTPS54350 DC/DC Converter 4.5V to 20V IN 3A DC/DC with integrated switch FET, Eliminate beat noise/ceramic caps/FPGA/integration TPS54550synchronization pin, enablePreview products are listed in bold blue.New products are listed in bold red.Medical Applications Guide Texas Instruments 2Q 2007
Medical ImagingDigital X-Ray65➔Digital X-RayDigital X-Ray Imaging is revolutionizing diagnostic radiology. In conventionalx-ray systems, the signal degradation that occurs with eachcomponent consumes more than 60% of the original x-ray signal. Ateach stage of the system, the x-ray signal is degraded to some extent,even if the individual components are optimized for the application. Asa result, typically less than 40% of the original image information isavailable for use in image production. In digital x-ray imaging, byadding a digital detector, the potential exists to capture over 80% ofthe original image information and equip the user with a wide rangeof post-processing tools to further improve the signal. Other keyadvantages of digital x-ray technology include processing image datato highlight regions of interest and suppress irrelevant information,combining image data with other pertinent patient informationavailable from RIS/HIS systems, quickly transmitting the informationanywhere over the networking connections and archiving all thisinformation in minimal space.There are two different approaches to digital x-ray technology, directand indirect.In direct conversion, flat-panel selenium detectors absorb x-raysdirectly and convert them into electrical charges at individual pixels.In indirect conversion, x-ray signals are converted first to light, whichin turn are converted to electric charges. Both tiled CCD arrays andcomputed tomography use indirect conversion technology. Tiled CCDtransitional technology employs multiple CCDs coupled to a scintillatorplate via fiber optics. Computed tomography involves trapping electronson photo stimulated plates and then exposing them to generateimage data. In both approaches, charges proportional to x-ray intensityseen by the pixel is stored in the storage cap of a Thin Film Transistor(TFT). A number of such pixels form the Flat Detector Panel (FDP). Thecharges are read from the FDP by read-out electronics and turned intodigital data.The following block diagram shows the readout electronics requiredto convert the charge in the FDP to digital data. It has two chains:the acquisition chain and the biasing chain. In the acquisition chain,the front end consists of an analog front end, which is capable ofmultiplexing the charge on different storage caps of FDP (channels)and converting the charge into voltage. These voltages need to becorrelated double sampled (CDS). The difference voltages of the signallevel and reset level from the CDS block are converted to digital databy an analog-to-digital converter. The biasing chain generates biasvoltages for the TFT array through intermediate bias and gate controlcircuitry. Digital control and data conditioning is made with an FPGA,which also manages high-speed serial communication with theexternal image processing unit through a high-speed interface(serialized, LVDS, optical). Temperature sensors, DACs, amplifiersand high input voltage capable switching regulators are other keyX-RaySourceBufferMUXandCDSDriverADCBufferREFBufferBias andControlCircuitryBufferMDACDigitalControlClockingBufferREFHigh-SpeedInterfaceTMPPowerImage andMotionProcessingUnitDigital x-ray block diagram.Texas Instruments 2Q 2004www.ti.com/medicalMedical Applications Guide
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Medical Applications Guide (Rev. B - Mouser Electronics

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