Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
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(96) An engineering Approach for Secure <strong>and</strong><br />
Safe wireless Sensor <strong>and</strong> Actuator<br />
Networks for Industrial Automation Systems<br />
St. peter, o. Stecklina, p. langendörfer<br />
14 th Ieee International Conference on<br />
emerging technologies <strong>and</strong> Factory<br />
Automation (etFA 2009), Mallorca,<br />
September 22 - 26, 2009, Spain<br />
(97) reconfiguring Crypto Hardware<br />
Accelerators on wireless Sensor Nodes<br />
St. peter, o. Stecklina, J. portilla,<br />
e. de la torre, p. langendörfer, t. Riesgo<br />
Ieee SeCon 2009, Rome,<br />
June 21 - 26, 2009, Italy<br />
(98) Sicherheits-engineering am Beispiel von<br />
drahtlos angebundenen Sensor / Aktor-<br />
Systemen in der Automatisierungstechnik<br />
St. peter, F. Vater, p. langendörfer<br />
SpS / IpC / Drives, elektrische Automatisierung,<br />
Fachmesse und Kongress, nürnberg,<br />
november 24 - 26, 2009, Germany<br />
(99) tinydSM: A Highly reliable Cooperative<br />
data Storage for wireless Sensor Networks<br />
K. piotrowski, p. langendörfer, St. peter<br />
Distributed Collaborative Sensor networks<br />
Workshop (DCSn 2009), Baltimore,<br />
May 18 - 22, 2009, uSA<br />
(100) An oFdM Baseb<strong>and</strong> receiver for Shortrange<br />
Communication at 60 GHz<br />
M. piz, M. Krstic, M. ehrig, e. Grass<br />
Ieee International Symposium on Circuits <strong>and</strong><br />
Systems 2009 (ISCAS), taipei,<br />
May 24 - 27, 2009, taiwan<br />
V o r t r ä G e – p r e S e N t A t I o N S<br />
(101) Next-Generation wireless oFdM System<br />
for 60-GHz Short-range Communication at<br />
a data rate of 2.6 GBit / s<br />
M. piz, e. Grass, M. Marinkovic, R. Kraemer<br />
14 th International oFDM-Workshop<br />
(InoWo‘09), Hamburg,<br />
September 02 - 03, 2009, Germany<br />
(102) raman Metrology for Advanced CMoS<br />
devices - Advantages <strong>and</strong> Challenges<br />
l.o. Reilly, K. Horan, p.J. Mcnally, p.J. timans,<br />
J. Reyes, S. prussin, n.S. Bennett,<br />
n.e.B. Cowern, J. Gelpey, S. McCoy, W. lerch,<br />
S. paul, D. Bolze<br />
International Workshop on InSIGHt in Semiconductor<br />
Device Fabrication, Metrology <strong>and</strong><br />
Modeling (InSIGHt 2009), napa,<br />
April 26 - 29, 2009, uSA<br />
(103) plasma Chemical etching of High-k<br />
dielectric Hfo 2 Films for technological<br />
Applications<br />
H.H. Richter, M. Fraschke, M. lukosius, Ch.<br />
Wenger, D. Wolansky, J. Berthold,<br />
S. Marschmeyer, I. Costina<br />
17 th International Colloquium on plasma<br />
processes, Marseille,<br />
June 23 - 26, 2009, France<br />
(104) plasma etching of High-k dielectric Hfo 2<br />
Films for technological Applications<br />
H.H. Richter, M. Fraschke, M. lukosius,<br />
Ch. Wenger, D. Wolansky, J. Berthold,<br />
S. Marschmeyer, I. Costina<br />
DpG Frühjahrstagung, Greifswald,<br />
March 30, 2009, Germany<br />
A n n u A l R e p o R t 2 0 0 9
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