Coater/Developer Evolution or Revolution? - Sematech

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Post Litho Process Costs: Non Resist Core SWT vs. Resist Core SWT Cost Per Patterning ($) BARC Trim SiO 2 Deposition Exposure Track Etch Clean CVD Non Resist Core SWT Resist Core SWT SiO 2 Etch‐back Core Strip 14% Savings H/M Etch CT PR Wet Slimming
Process Costs: Dual‐Tone Development Overview Reference: Exploration of …Dual tone Development; C. Fonseca 1.26NA, Dipole (K 1 = 0.21) Current Status 16nm 100X diluted TMAH, PEB2: 150C/60s 64nm Pitch Mask Pitch: 128nm • Demonstrated image modulation • Resolution below single exposure & develop 1.35NA scanner capability
Page 1 and 2: Double Patterning Coater/Developer
Page 3 and 4: i-line KrF / ArF Immersion Evolutio
Page 5 and 6: 1 st Exposure 1 st Etch 2 nd Exposu
Page 7 and 8: Key Coater/Developer DP Concerns Pr
Page 9 and 10: PR Line Slimming & LWR Reduction Po
Page 11 and 12: TEL FIRM Impact on Pattern Collapse
Page 13: Key Coater/Developer DP Concerns Pr
Page 17 and 18: Tool Productivity: LITHIUS Pro V OE
Page 19 and 20: Tool Productivity: Wafers Per Day (
Page 21: • TEL: Acknowledgements - S. Shim

Coater/Developer Evolution or Revolution? - Sematech

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