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DESIGN, ASSEMBLY AND CHARACTERIZATION OF COMPOSITE ...

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4.3.2. Preparation of Nickel Ink<br />

Surface chemistry of ENP800 Ni powder in water favors PEI-25K as dispersant.<br />

The isoelectric point (IEP) of nickel particles in water is debatable due to the evolution of<br />

nickel hydroxylates on the particle surface. 135, 137, 142-144 Despite these discrepancies,<br />

nickel ink preparation is performed at a basic pH ≥ 8.0. ENP 800 nickel powder and<br />

water are observed reach an equilibrium pH ≈ 8.0 at ambient temperature (~23 °C). A<br />

rise in pH above neutral conditions with the addition of an insoluble metal oxide indicates<br />

the adsorption of H + ion from solution due to a negatively charged surface. That is, the<br />

change in pH moves in the direction to neutralize the surface. In the presence of PEI-25K<br />

addition, ENP 800 nickel suspension has an equilibrium pH ≈ 8.2. This pH range favors<br />

adsorption of positively charged PEI (IEP = 10.8) on nickel, and then bridging<br />

flocculation by negatively charged PAA (IEP = 3.5 - 4). 105<br />

4.3.3. Rheological measurement<br />

The rheological behavior of Ni gels is shown to depend strongly on the ratio of<br />

Darvan 821A:PEI-25K (or A:C to signify anionic to cationic polyelectrolyte ratio). As<br />

shown in Figure 4.4, the as-prepared Ni colloidal ink with A:C=5:2 displays rheological<br />

behaviors similar to ceramic colloidal gels 32, 105 for Robocasting, while less Darvan<br />

addition leads to weaker elastic response. A plateau region of shear elastic modulus<br />

around 300 kPa with yield stress τy ≈ 154.4 Pa is observed in this Ni ink with φsolids=0.472.<br />

The yield stress is taken to be the stress at which the elastic shear modulus drops to 90%<br />

of its plateau value. Both shear elastic modulus and yield stress decreases as Darvan<br />

concentration deceases, indicating less inter-particle linking in the concentrated particle<br />

121

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