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DESIGN, ASSEMBLY AND CHARACTERIZATION OF COMPOSITE ...

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The above discussion is mainly focused on the sintering behavior of LFBT. On<br />

the other hand, sintering of Ni particles in the composite structure proceeds differently.<br />

As Ni particles are insoluble in the ZnO-B2O3-Li2O liquid phase, and have a sintering<br />

temperature of 900 °C, densification of Ni matrix should follow the solid state sintering<br />

model. Neck formation of the percolating Ni particle network is likely to occur at the<br />

early stage of the sintering process. This is obvious by comparing the specimens fired at<br />

800 °C. The BT:Ni=3:37 Ni'(m) lattice demonstrates a significant sintering strain,<br />

indicating that neck formation of Ni particle network had already occurred at a lower<br />

temperature. Neck formation of Ni particles in lattices of BT:Ni=1:4 and 3:7 Ni'(m) must<br />

have occurred, but their sintering strain is resisted by a higher refractory BT inclusion.<br />

Nevertheless, the expected result is the formation of interlocked Ni particle network in<br />

these lattice specimens. Hence, the structure of Ni'(m) components with a high Ni content<br />

in a composite structure is relatively fixed as compared to the LFBT components, and<br />

stress relaxation during densification must largely be accomplished by particle<br />

rearrangement in the LFBT components.<br />

6.3.4. Fabrication of BT-Ni Composites<br />

Heterogeneous BT-Ni composite structures have been successfully fabricated<br />

with the use of the LFBT ink for ceramic components, and either the BT:Ni=1:4 or 3:7<br />

Ni'(m) ink for metal components. A thorough screen of all possible compositions is not<br />

done, but presumably any composition between BT:Ni=1:4 and 3:7 is compatible to the<br />

LFBT ink. All these composite structures have slight deformation compared to the<br />

original CAD designs, due to the pulling effect by the moving nozzle tips during ink-<br />

printing process and the internal stresses involved throughout the sintering process. The<br />

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