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DESIGN, ASSEMBLY AND CHARACTERIZATION OF COMPOSITE ...

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a higher electric conductivity), a manipulation of material processing for composite<br />

structures assembled with BT:Ni=2:3 Ni(m) ink and pure BT ink is performed. A 300 °C<br />

temperature is used in the binder removal step. After 6 hours of thermal treatment in air,<br />

the Ni phase grows a thin layer of oxide on surface so that this oxide surface layer<br />

modifies the sintering kinetics of Ni(m) ink and enables co-sintering with pure BT.<br />

Figure 5.9 Co-sintered compositional graded bow-tie stripe network of BT:Ni=4:1 Ni(m)<br />

(20Ni80BT) and pure BT before annealing.<br />

A weight increase of 0.133 g (1.456% by weight) is observed due to oxidation<br />

when 9.135 g of Ni powder has been heated at 300 °C for 6 hours in air; by calculation,<br />

5.3% of Ni has been oxidized to NiO on the Ni particle surface with negligible linear<br />

expansion. NiO has a melting temperature of 1955 °C. When sintering atmosphere is<br />

appropriate, the NiO may increase the onset temperature for sintering of Ni particles and<br />

158

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