Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Today’s evolution of the<br />
bus<strong>in</strong>ess:<br />
• Size and pitch keep gett<strong>in</strong>g smaller, number of<br />
contacts <strong>in</strong>creas<strong>in</strong>g<br />
• Move from leaded to leadless BGA/LCC packages (Ball<br />
Grid Array and Leadless Chip Carrier)<br />
Leaded YieldPro Contactor<br />
YieldPro Array Contactor<br />
USP#6,299,459<br />
Julius Botka<br />
BITS.ppt 10/31/01<br />
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