Burn-in & Test Socket Workshop - BiTS Workshop

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Values in this table pertain to center contact with ground contacts on two sides Contact Pressure Contact Width Recommended Ball Sizes Recommended Size Pad Min. Contact Compliance DC Resistance Leakage Return Loss Impedance Zo Electrical Length Max. Current Carrying Capacity Capacitance Inductance Physical Length Effective Dielectric Constant, ε eef Contactor Type & Pitch 3 GHz 10 GHz 18GHz Along the Length of Contacts @ 10 GHz in Degrees Center Contact to Ground For leaded packages/LCC Note 1 Note 2 Note 3 Note 4 Note 5 Note 6 YieldPro 1.25 mm 40 gr 0.020" 0.007" 12 dB >8 dB 26.3 Ohm 18 3 A 0.190 pF 0.131 nH 0.927 mm / 0.0365" 2.65 Note 7 70 gr max YieldPro 0.8 mm 25 gr, 0.015" 0.007" 9.5 dB >5.9 dB 22 Ohm 18 2 A 0.227 pF 0.11 nH 0.927 mm / 0.0365" 2.65 Note 7 40 gr max YieldPro 0.5mm 20 gr, 0.010" 0.007" 7.25 dB >4.5 dB 17.6 Ohm 18 1 A 0.284 pF 0.088 nH 0.927 mm / 0.0365" 2.65 Note7 28 gr max YieldPro 0.4mm 15 gr, 0.007" 0.007" 9.45 dB >6.15 dB 21 Ohm 18 0.75 A 0.238 pF 0.105 nH 0.927 mm / 0.0365" 2.65 20 gr max For CSP: BGA/LGA Packages YieldPro Ultra 30 gr, 0.6-0.762 0.5 x 0.5 0.011" 17.8 dB >14 dB 38.5 Ohm 22 2 A 0.159 pF 0.235 nH 1.438 mm / 0.0566" 1.65 BGA/LGA 1.0mm 50 gr max mm mm YieldPro Ultra 25 gr, 0.48-0.54 0.35x0.35 0.011" 11.5 dB >8 dB 28.6 Ohm 22 2 A 0.213 pF 0.175 nH 1.438 mm / 0.0566" 1.65 BGA/LGA 0.8mm 40 gr max mm mm YieldPro Ultra 20 gr, 0.3-0.42 0.2 x 0.2 0.007" 15 dB >11.2 dB 34.5 Ohm 22 1 A 0.177 pF 0.211 nH 1.438 mm / 0.0566" 1.65 BGA/LGA 0.5mm 28 gr max mm mm Note 1: Resistance measured on a clean contactor. Note 2: Leakage current measured w ith 10V applied to signal contact. Note 3: Assumes 50 Ohm environment. Note 4: Apply current only after making contact. Note 5: Capacitance and Inductance are distributed over the contact length. Note 6: Physical length is show n fully compressed. Note 7: Agilent YieldPro contactors for leaded/LCC packages support: SOT, SOIC, SSOP, TSSOP, MSOP, QFN, TQFP, MLF, and MLP device package requirements. Julius Botka BITS.ppt 10/31/01 Page 29
Economic Benefits: • Increase the yield by not rejecting good parts. Smaller guard bands can be used because of less uncertainty in the measurement • Contacts are made of precious metal and will not oxidize. Good performance is maintained due to lack of corrosion • The longer life of the contactor reduces cost per parts tested Julius Botka BITS.ppt 10/31/01 Page 30
Page 1 and 2: Burn-in & Test Socket Workshop IEEE
Page 3 and 4: Burn-in & Test Socket Workshop Tech
Page 5 and 6: Discussion Topics ▼ Modeling & it
Page 7 and 8: Designing Load Boards for Optimal P
Page 9 and 10: Load Board Effects ▼ Things to im
Page 11 and 12: Crosstalk Improvements ▼ Increase
Page 13 and 14: Load Board Pad Size and Placement 1
Page 15 and 16: Return Loss (dB) 0 -5 -10 -15 -20 -
Page 17 and 18: Model Validation & Performance Exam
Page 19 and 20: Model Validation & Performance Exam
Page 21 and 22: Return Loss (dB) 0 -5 -10 -15 -20 -
Page 23 and 24: Conclusion ▼ Modeling trends can
Page 25 and 26: Brief History • Semiconductor man
Page 27 and 28: Today’s evolution of the business
Page 29 and 30: Design Considerations Problem: Lack
Page 31 and 32: Problem: Excessive and undefined co
Page 33 and 34: Problem: Damage to the bottom of th
Page 35 and 36: Problem: After 100,000 plunges, exc
Page 37 and 38: Problem: Plating will wear away, ox
Page 39 and 40: Problem: Usability issues revolving
Page 41 and 42: Coplanar waveguide substrate with g
Page 43 and 44: Fixture time domain is computed fro
Page 45 and 46: S 11 Gated, coplanar substrate elec
Page 47 and 48: Model of Contacts with Effects of H
Page 49 and 50: S 11 of contact region from model C
Page 51: Accounting for housing effects * *
Page 55 and 56: Introduction This presentation summ
Page 57 and 58: Socket Requirements for Testing RF
Page 59 and 60: Qualification Process: Determine pa
Page 61 and 62: Qualification Process: Test Sockets
Page 63 and 64: Mechanical Analysis: Pogo-style soc
Page 65 and 66: Mechanical Analysis: S-contact sock
Page 67 and 68: Mechanical Analysis: Low-profile in
Page 69 and 70: Mechanical Analysis: Conductive ela
Page 71 and 72: Qualification Process: Test socket
Page 73 and 74: Qualification Process: Test socket
Page 75 and 76: Electrical Performance Simulations
Page 77 and 78: Electrical Performance Simulations
Page 79: Recognition of Support John Blondi

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