E0286 – VLSI Test VLSI Test

Different Techniques Beyond Production Test
Techniques
Technology: Cell hardening.
Physical design rules.
Margins: Additional design margins.
Margin mode testing.
DFT partitioning:
Scan partitioning. Clock skewing / staggering. Test res.part. x x
ATPG: Parametric tests. Defect based tests. Bus BIST. x x
Power aware test.
Power management: Power grid partitioning / over-design.
Power isolation switches. Retention.
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Device configurability:
Pre-shipment calibration. Memory repair. Module isolation. x
On-chip test / measurement:
Self-test. Self-calibration. Self-repair. Adaptivity.
Die test: Over-test. Stress test.
Under-test. Binning. Adaptive test.
System test:
Field test. Periodic testing.
Tolerance: Error checking and correction.
Redundancy and reconfiguration.
Yield Reliability Power
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