BUFFING COMPOUND

METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR ELECTRONICS AND ENGINEERING PARTS" 02CHEMICALS FOR ELECTROLESS PLATINGApplication Trade Name Bath Composition FeatureElectroless Nickel-Boron AlloyPlating SolutionTOP CHEM ALLOY B-1TOP CHEM ALLOY 66Concentration as supplied66 - M : 60 ml/l66 - 1 : 60 ml/l66 - 2 : 60 ml/l*Excellent deposition effects.*High in hardness of the deposits as plate.*Suitable for plating ceramic or others.*Boron Content : 0.2~0.6%.*Excellent deposition effects.*High in hardness of the deposits as plate.*Suitable for plating to ceramic or others.*Boron Content : 0.2~0.6%.*Continuous replenishment type.Electroless Tin Plating SolutionSUBSTAR SN-5SN - 5 A : 60 ml/lSN - 5 B : 500 ml/lSN - 5 C : 120 g/l*Fluoride-free type electroless tin plating solution.*Excellent deposition effects.*Can be applied for long period by replenishment.Electroless RhodiumPlating SolutionELECTROLESS RHODIUMRH-1RH - 1 A : 500 ml/lRH - 1 B : 150 ml/lRH - 1 C : 100 ml/l*Excellent hardness, abrasion resistance and chemical resistance.*Uniform deposition to complicated shape articles and inside of pipe.Electroless RutheniumPlating SolutionELECTROLESS RUTHENIUMRURU - 1 : 500 ml/lRU - 2 : 50 ml/lRU - 3 : 50 ml/l*Excellent hardness, abrasion resistance and chemical resistance.*Less change in contact resistance even under the circumstance of corrosive gas.Electroless PalladiumPlating SolutionMUDEN NOBLE PDPD - 1 : 50 ml/lPD - 2 : 50 ml/lPD - 3 : 100 ml/l*Excellent corrosion resistance and solderability.*As cyanide-free, easy in waste water treatment.*Good in bath stability, and fine deposition film.*Can be applied for long period.PALLA TOPA : 100 ml/lB : 100 ml/l*Neutral auto-catalytic type, give over 99.9% purity film.*Excellent corrosion resistance, solderability at high temperature and hydrogen permeability.OPC MUDEN GOLD100 ml/l*Substitution type electroless gold plating solution.*Excellent adhesion to under-lying electroless nickel plating film, and wide applicable range.OPC MUDEN GOLD 2525 - M : 200 ml/l25 - 1 : 200 ml/l25 - 2 : 150 ml/l*Can control film thickness, as auto-catalytic type.*Excellent bonding effects and fine deposition.Electroless Gold Plating SolutionMUDEN NOBLE AUAU - 1 : 500 ml/lAU - 2 : 200 ml/lAU - 3 : 100 ml/lSodium Aurous Sulfite (as Au) : 2 g/l*Additive for neutral cyanide-free substitution type electroless gold plating.*As neutral bath, less influence to resist film.SELF GOLD OTKOTK - 1 : 200 ml/lOTK - 2 : 200 ml/lSodium Aurous Sulfite (as Au) : 2 g/l*Additive for neutral reduction type thick film type electroless gold plating.*Good bath stability and less influence to resist film.FLASH GOLD NB100 ml/l*Substitution type.*Excellent adhesion to under-lying electroless Ni-B plating film electroless Ni-P plating film and electrolytic Ni plating film.