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METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR ELECTRONICS AND ENGINEERING PARTS" 04VARIOUS TREATMENT CHEMICALSELECTROLYTIC PLATING CHEMICALSApplication Trade Name Bath Composition FeatureNickel PlatingTOP SELENA 73XTOP SELENA 95X73X : 5 ml/lMU - 2 : 5 ml/l95X - MU : 15 ml/l*Uniform deposition at wide current density area, and excellent ductility.*Suitable for application of after processing.*Give brightness by suppressing of leveling.*Wide addition amount range and workable range.Tin PlatingTOP FLOONAMU : 20 ml/lR : 8 ml/l*Additive for sulfuric acid type tin plating.*Excellent leveling, throwing power and solderability.Nickel-Tin Alloy PlatingNISTALLOYTN - 1 : 20 g/lTN - 2 : 3 ml/l*Pyro-phosphate bath having high current efficiency and excellent thowing power.*Give stainless steel tone brightness.*Easy waste water treatment.Nickel-Phosphorus Alloy PlatingNICKELINA - 1 : 200 ml/l orB - 1 : 200 ml/l*Excellent magnetic properties, chemical resistance, wear resistance and corrosion resistance.*Easy bath maintenance and waste water treatment.Tin-Lead Alloy PlatingTOP TEENA MSMS Sn : 120 ml/lMS Pb : 20 ml/lMS : 100 ml/lBright Bath:Brightener No.1:20ml/l,Brightener No.2:30ml/l,*Organic sulfonate bath. *As fluoride ion free, waste water treatment is easy.Semi Bright Bath:No.10:30ml/l*Good uniformity and solderability.Tin-Copper Alloy PlatingTOP FLEAD SC(Bright Barrel Bath)SC - M : 2 ml/lSC - R : 3 ml/lSC - S : 1 g/lSC - 1 : 40 ml/lSC - 2 : 2 ml/l*As sulfuric acid bath, low costs and waste water treatment is easy.(Applicable in hoop and rack bath.)*Tin - copper alloy plating for lead-free solder.*Can get bright film containing 1-3% of coppe .Palladium PlatingPRECIA PDPRECIA PDSConcentration as suppliedConcentration as supplied*Excellent brightness and covering power.*Excellent solder wettability and bonding effects, in special.Palladium-Nickel Alloy PlatingPRECIA PN-HSHigh Speed Bath(Hoop)PRECIA PN-HSStandard Bath(Rack, Barrel)PN-HS Base : 80 g/lPD Salt : 50 g/lPN-HS Conc : 150 ml/lPN-HSR : 50 ml/lPN-HS Base : 80 g/lPD Salt : 25 g/lPN-HS Conc : 75 ml/lPN-HSR : 100 ml/l*Excellent brightness.*Give deposition with stable alloy ratio.*Applicable in high speed plating.*Excellent brightness.*Give deposition with stable alloy ratio.*Applicable in barrel plating.STRIPPING AGENTSFor Electroless Nickel Plating FilmTOP RIP AZTOP RIP PF-1AZ - 1 : 40 g/lAZ - 2 : 500 ml/lSodium Hydroxide : 30 g/lF - 85 : 90 g/lPF - 1 : 180 ml/l*Cyanide-free stripping agent for electroless nickel plating film on copper or copper alloys.*Cyanide-free stripping agent for electroless nickel plating film on exclusive steel base.*Less self-consumption of oxidizing agent and erosion of base.For Tin Plating FilmTOP RIP WSWS - 2 : 400 ml/l62% Nitric Acid : 300 ml/l*Nitric acid type stripping agent for tin plating film on copper base.*Applicable continuously by spray method.
METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR ELECTRONICS AND ENGINEERING PARTS" 05TREATMENT CHEMICALS FOR LEAD-FRAMEHOOP MATERIALTREATMENT CHEMICALS FOR STEEL42 ALLOYSApplication Trade Name Bath Composition FeatureSoak CleanerTLF-130040 g/l*Low COD phosphate type cleaner for lead-frame or hoop materials of steel42 alloys.Rust Removing AgentTLF-52003000 ml/l*Effective to removal for rust and scale of steels.*Suitable for pre-treatment of TLF-4000.Chemical Polishing AgentTLF-4000400 ml/l35%-Hydrogen Peroxide : 300 ml/lTREATMENT CHEMICALS FOR LEAD-FRAMEHOOP MATERIALNeutral Rust RemoverUltra High Speed NickelBrightener for Hoop PlatingTLF-5500TURBOLIGHT200 ml/l1 : 7~13 ml/l2 : 0.2~0.8 ml/lTREATMENT CHEMICALS FOR COPPERCOPPER ALLOYSSoak CleanerElectrolytic CleanerTLF-1800TLF-1900TLF-390040 g/l40 g/l60 g/l*Give uniform chemical polishing to steel and 42 alloys.*Neutral rust removal agent for steels, copper, brass and others. *Less erosion of base at rust removal*Additive for ultra high speed continuous nickel plating on brass, steels and others.*Excellent brightness and leveling, and less formation of burning.(Current Density : 90 A/dm 2 , 50 - 75)*Strong cleaning power and less de-coloring of base material.*Cleaner for copper type lead-frame, hoop material.*Cleaner for copper type lead-frame and hoop material, having good de-foaming effects.*Applicable to normal copper type materials.*As low alkalinity, has wide applicable range of electrolysis time.Oxide Film RemoverTLF-6100TLF-8300100 ml/l500 ml/l*Phosphate type and good cleaning power.*Remove oxide film of copper type materials uniformly.*Oxide film remover for copper type materials.*Effective to remove resist residues.Chemical Polishing AgentTLF-4900TLF-ETCHBRUST300 ml/l35% Hydrogen Peroxide : 300 ml/l300 ml/l*Suitable for mirror finish polishing for copper type materials.*Spray type etching agent for copper type materials.TREATMENT CHEMICALS FOR ELECTRO-MAGNETIC SHIELDTREATMENT CHEMICALS FOR TOP SHIELD PROCESSElectroless Copper PlatingTSP-810ELECTROLESS COPPER1 : 30 ml/l2 : 15 ml/l3 : 1 ml/l4 : 200 ml/l*Excellent bath stability, and deposition film is fine and has good ductility.*Deposition speed is 4 m/h at standard bath.*Long bath life and continuous replenishment type electroless copper plating solution.Multiple Electrolytic Nickel PlatingTSP-48 NICKELA : 100 ml/lC : 200 ml/l*Weak acidic plating solution. *As applying of small current at the intial stage, deposition film has good corrosionresistance and less formation of stain spots by corrosion.(Current Density : 0.2 A/dm 2 )Paste for Partial PlatingTSP PASTE NITSP Paste NI : 650 ml/lTSP Thinner NI : 350 ml/l*Electro-conductive nickel paste.*Small particle diameter, and good appearance after plating.*Thinner has 2 types, for summer and for winter.
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