BUFFING COMPOUND

METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR ELECTRONICS AND ENGINEERING PARTS" 05TREATMENT CHEMICALS FOR LEAD-FRAMEHOOP MATERIALTREATMENT CHEMICALS FOR STEEL42 ALLOYSApplication Trade Name Bath Composition FeatureSoak CleanerTLF-130040 g/l*Low COD phosphate type cleaner for lead-frame or hoop materials of steel42 alloys.Rust Removing AgentTLF-52003000 ml/l*Effective to removal for rust and scale of steels.*Suitable for pre-treatment of TLF-4000.Chemical Polishing AgentTLF-4000400 ml/l35%-Hydrogen Peroxide : 300 ml/lTREATMENT CHEMICALS FOR LEAD-FRAMEHOOP MATERIALNeutral Rust RemoverUltra High Speed NickelBrightener for Hoop PlatingTLF-5500TURBOLIGHT200 ml/l1 : 7~13 ml/l2 : 0.2~0.8 ml/lTREATMENT CHEMICALS FOR COPPERCOPPER ALLOYSSoak CleanerElectrolytic CleanerTLF-1800TLF-1900TLF-390040 g/l40 g/l60 g/l*Give uniform chemical polishing to steel and 42 alloys.*Neutral rust removal agent for steels, copper, brass and others. *Less erosion of base at rust removal*Additive for ultra high speed continuous nickel plating on brass, steels and others.*Excellent brightness and leveling, and less formation of burning.(Current Density : 90 A/dm 2 , 50 - 75)*Strong cleaning power and less de-coloring of base material.*Cleaner for copper type lead-frame, hoop material.*Cleaner for copper type lead-frame and hoop material, having good de-foaming effects.*Applicable to normal copper type materials.*As low alkalinity, has wide applicable range of electrolysis time.Oxide Film RemoverTLF-6100TLF-8300100 ml/l500 ml/l*Phosphate type and good cleaning power.*Remove oxide film of copper type materials uniformly.*Oxide film remover for copper type materials.*Effective to remove resist residues.Chemical Polishing AgentTLF-4900TLF-ETCHBRUST300 ml/l35% Hydrogen Peroxide : 300 ml/l300 ml/l*Suitable for mirror finish polishing for copper type materials.*Spray type etching agent for copper type materials.TREATMENT CHEMICALS FOR ELECTRO-MAGNETIC SHIELDTREATMENT CHEMICALS FOR TOP SHIELD PROCESSElectroless Copper PlatingTSP-810ELECTROLESS COPPER1 : 30 ml/l2 : 15 ml/l3 : 1 ml/l4 : 200 ml/l*Excellent bath stability, and deposition film is fine and has good ductility.*Deposition speed is 4 m/h at standard bath.*Long bath life and continuous replenishment type electroless copper plating solution.Multiple Electrolytic Nickel PlatingTSP-48 NICKELA : 100 ml/lC : 200 ml/l*Weak acidic plating solution. *As applying of small current at the intial stage, deposition film has good corrosionresistance and less formation of stain spots by corrosion.(Current Density : 0.2 A/dm 2 )Paste for Partial PlatingTSP PASTE NITSP Paste NI : 650 ml/lTSP Thinner NI : 350 ml/l*Electro-conductive nickel paste.*Small particle diameter, and good appearance after plating.*Thinner has 2 types, for summer and for winter.