BUFFING COMPOUND

METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR PRINTED WIRING BOARD" 03Application Trade Name Bath Composition FeatureNeutral CleanerOPC CLEAN 65500 ml/l*Remove copper oxide film, resist residue and dirts.OPC-180 CLEANER200 ml/l*Suitable for cleaning and surface conditioning between electroless copper and acid copper platings.Alkaline CleanerOPC-250 CLEANER M50 g/l*Remove oil and finger prints at copper surface and inside hole, and give wettability.*Weak alkaline type cleaner.Acid CleanerOPC-120 CLEANEROPC ACID CLEAN 115100 ml/l200 ml/l*Excellent removal effects of finger prints and light degree oil or rust on copper surface.*Suitable for cleaning and surface conditioning between electroless copper and acid copper platings.OPC CLEAN 9180 ml/l*Excellent removal of finger prints, light degree oil or rust and others on copper surface with etching effects.Etching Type Acid CleanerOPC CLEAN 95100 ml/l*Remove oxid film, dirts and others on copper surface with etching effects.*Suitable to apply before electroless nickel plating also.OPC ETCH CLEANNo.1 : 100 ml/lNo.2 : 1 ml/l*Spray type acid cleaner.*Suitable for cleaning of copper surface of flexible boards.Electrolytic CleanerPRECLEAM M50 g/lAnodic Current Density : 1 A/dm 2*Alkaline type electrolytic cleaner.*Excellent removal of finger prints and oxide film.*Suitable for cleaning and surface conditioning after electroless copper plating.OPC PERSORRY50 ml/lSodium Hydroxide : 35 g/l*Additive for alkaline soluble resist stripping solution.*Suppress erosion of tin or solder plating films.OPC PERSORRY 1025 ml/lSodium Hydroxide : 35 g/l*Additive for alkaline soluble resist stripping solution.*Suppress erosion of tin or solder plating films.*Suppress de-coloring of copper pattern.Special Treatment AgentOPC DEFENSOR8 ml/l*Anti-tarnishing agent for copper plating films.*Can be removed by acids easily.BUBBRAT R-30.1 ~ 2 ml/l*Nonionic surfactant base de-foaming agent.*Excellent durability and de-foaming effects at stripping and developing of dry film by small quantity addition.BUBBRAT R-60.1 ~ 2 ml/l*Low foaming type nonionic non-silicate type surfactant base alkaline resisting de-foaming agent.*Excellent de-foaming effects to resist stripping solution.Solder CleanerOPC BOARD CLEANConcentration as supplied*Halogen-free type surface conditioner for solder plating.*Excellent removal effects of dirts inside through-holes.