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METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR PRINTED WIRING BOARD" 01Application Trade Name Bath Composition FeatureOPC - 370 CONDICLEAN M100 ml/l*Excellent cleaning and conditioning effects.*Improve adsorption of catalyst.*Especially good adsorption of catalyst to glass cloth.Cleaner / ConditionerOPC - 380 CONDICLEAN M50 ml/l*Excellent cleaning and conditioning effects.*Improve adsorption of catalyst.*Alkaline type cleaner / conditioner.OPC - 390 CONDICLEAN M100 ml/l*Excellent cleaning and conditioning effects.*Improve adsorption of catalyst.*Suitable for application to plating on flexible boards.OPC CONDICLEAN GG - 1 : 50 ml/lG - 2 : 35 ml/l*2 solutions type alkaline cleaner / conditioner.*Especially, improve adsorption of catalyst.ConditionerOPC-350 CONDITIONER30 ml/l*Improve adsorption of catalyst to P. W. Boards.*Improve covering power of plating to hole wall.OPC-400 SOFT ETCH150 ml/lMU : 10 ml/l35% Hydrogen Peroxide : 100 ml/l*Improve adhesion between laminated copper film and electroless copper plating film.*Sulfuric Acid / Hydrogen Peroxide base soft etching agent.Soft Etching AgentOPC-450 SOFT ETCH50 ml/l98% Sulfuric Acid : 70 ml/l35% Hydrogen Peroxide : 100 ml/l*Sulfuric Acid / Hydrogen Peroxide base soft etching agent.*Suppress decomposition of Hydrogen Peroxide.*Give uniform etching surface.OPC-480 SOFT ETCH150 g/l98% Sulfuric Acid : 10 ml/l*Powder form soft etching agent.*Compared with Sulfuric Acid / Hydrogen Peroxide type, can give finer etching surface.*Suitable for application as pre-treatment of leveller.*Less local erosion of blind holes.OPC-SAL180 g/l35% Hydrochloric Acid : 30 ml/l*Effective pre-dipping agent for low-HCl type catalyst.Pre-Dipping AgentOPC-SAL M260 g/l*Effective pre-dipping agent for HCl-free type catalyst.*Suitable for application to multi-layer boards.OPC PRE-DIP 4910 ml/l98% Sulfuric Acid : 1.5 ml/l*Pre-dipping agent for alkaline type catalyst.OPC-80 CATALYST50 ml/lSAL M : 260 g/l*Excellent bath stability and catalyzing effects.*Can be applied with HCl-free bath.*Make through-hole plating smooth.CatalyzerOPC-80 CATALYST MOPC-90 CATALYST45 ml/lSAL M : 260 g/l30 ml/lSAL M : 260 g/l*Excellent bath stability and applicable for long period.*Suitable for application to multi-layer boards.*Excellent bath stability.*As low stannous type, can extend bath life of accelerator.OPC-50 INDUCERA : 50 ml/lC : 50 ml/l*Alkaline type catalyzer, and excellent wetting effects.*Suitable for application to small hole boards or multi-layer boards.
METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR PRINTED WIRING BOARD" 02Application Trade Name Bath Composition FeatureOPC-500 ACCELERATORMXMX-1 : 100 ml/l*Fluoride-free acid type accelerator.*Activate catalyst and make adhesion strong.*Make deposition of electroless plating uniform.AcceleratorOPC-505 ACCELERATORA : 100 ml/lB : 10 ml/l*Fluoride-free acid accelerator.*Activate catalyst and make adhesion strong.*High acceptable limit of tin and long bath life.OPC-555 ACCELERATOR MM : 100 ml/l*Fluoride type acid accelerator.*Activate catalyst strongly and make adhesion strong.Accelerator for Alkaline CatalystOPC-150 CRYSTERMU : 150 ml/l*Reduce palladium strongly and improve deposition effects of plating.OPC-700 ELECTROLESSCOPPER MM-A : 100 ml/lM-B : 100 ml/lM-C : 2 ml/l*Excellent bath stability and covering power.*Excellent color tone of the deposits.*Formalin-Rochells Salt type.OPC-750 ELECTROLESSCOPPER MM-A : 100 ml/lM-B : 100 ml/lM-C : 2 ml/l*Excellent bath stability.*Can be applied for long period continuously.*Formalin-EDTA type.Electroless Copper PlatingSolutionOPC COPPER H(High Speed Type)H-1 : 60 ml/lH-2 : 8 ml/lH-3 : 250 ml/l37% Formalin : 6 ml/l*High speed thick film type electroless copper plating solution for Semi-Additive Method.*Formalin type.*Can be applied as primary panel copper plating.OPC COPPER TT-1 : 60 ml/lT-2 : 12 ml/lT-3 : 100 ml/l*High speed thick film type electroless copper plating solution for ceramic.*Excellent film properties, especially excellent high frequency wave properties.OPC COPPER JJ-1 : 80 ml/lJ-2 : 55 ml/lElectroless Copper R-H : 25 ml/l*Excellent adhesion and deposition effects to holes.*Excellent bath stability.*Can be applied for long period by replenishment.TOP LUCINA 81-HL2.5 ml/lMU : 10 ml/lCurrent Density : 3 A/dm 2*Excellent throwing power and film properties.*Suitable for application to high aspect ratio boards.TOP LUCINA H-300SW2.5 ml/lCurrent Density : 7 A/dm 2*Can be applied at high current density to 10 A/dm 2 .*Additive for high speed type acid copper plating.TOP LUCINA H-3802.5 ml/lCurrent Density : 5 A/dm 2*Additive for middle ~ high speed through-hole acid copper plating bath by jet flow system.*Shorten plating time and improve productivity.Acid Copper PlatingBrightenerTOP LUCINA HAR1 : 5 ml/l2 : 1 ml/lMU : 10 ml/lCurrent Density : 2 A/dm 2*Excellent throwing power and brightness at low current density area.*Suitable for application to small hole boards or high aspect ratio boards.TOP LUCINA LSA : 2.5 ml/lB : 1 ml/lMU : 5 ml/lCurrent Density : 2.5 A/dm 2*Low internal stress in the deposits.*Suitable for application to plating on flexible boards.TOP LUCINA SFSF-M : 5 ml/lCurrent Density : 3 A/dm 2*Excellent throwing power and low stress in deposits.*Suitable for application to flexible boards or others which is afraid to form deformation ordimention change by residual internal stress in the deposits.
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