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METAL FINISHING DEPARTMENT PRODUCTS GUIDE 06ADDITIVE FOR NICKEL PLATINGAUXILIARY ADDITIVE AND IMPURITIES REMOVING AGENT FOR NICKEL PLATINGApplication Trade Name Composition FeatureLeveling ImproverTOP LEVELER1 ml/l*Excellent leveling and give mirror finish nickel plating film. *Effective to applying of plating in short time.NICKEL ADAPTOR1 ~ 3 ml/l*Improve covering power and suppress influence of impurities (zinc group) of bright nickel plating.Auxiliary AdditiveMU-21 ~ 5 ml/l*Excellent auxiliary effects of primary brightener of bright nickel. *Effective to improve poor brightness and poor properties of the deposits at high current density area.NICKEL CARRIER1 ~ 5 ml/l*Give excellent brightness and leveling by using with normal brightener (espacially, butyne-diol-free type) in bright nickel plating.Zinc Impurities InhibitorZINC IMPURITIES INHIBITOR0.5 ~ 1 ml/l*Suppress temporally troubles caused by dragging-in of zinc impurities in bright nickel plating solution.Pit Preveting Agent forSUPER ZENA 43 ml/l*Suppress pitting at high load factor bath, weak agitation position and at replenishment of brighteners.Bright Nickel PlatingPIT PREVENTING AGENT1 ~ 3 ml/l*Reduce surface tension and prevent pitting in bright nickel plating.Metal Impurities RemoverTOP SCUT CL0.5 ~ 4 ml/l*Remove metal impurities (especially copper) in bright nickel plating solution.Additive for High Corrosion ResistanceTOP NSA-38 ml/l, Acna H : 3 ml/l*Give excellent corrosion resistance by applying striking between semi-bright and bright nickel platings.Special Treatment AgentTOP SURFCON BR50 ~ 150 ml/l*Color tarnish preventing agent for nickel plating. *Prevent red rust and color tarnish after barre nickel plating.Activated CarbonACTIVATED CARBON1~5 g/l*Excellent adsorption effects. *Dry type and wet type are available.ADDITIVE FOR SPECIAL NICKEL PLATINGApplication Trade Name Composition FeatureSpecial AdditiveTOP SELENA 73XTOP SELENA 95X73X : 5 ml/l, MU-2 : 5 ml/lMU : 15 ml/l*Give uniform plating in wide current density area. *Excellent ductility and suitable for post-processing.*Additive giving only brightening effects by suppressing leveling. *Wide addition amount and workable ranges.High Speed Nickel Plating BrightenerTURBO LIGHT1 : 10 ml/l, 2 : 0.5 ml/l*Brightener for hoop nickel plating, and can be applied as additive to improve brightness at high current density.SMPC-1 : 10 ml/l, SMPC-2 : 0.2 ml/lAdditive for Seal Nickel PlatingSMPC SERIESSMPC-3 : 4 ml/l, SMPC-4 : 0.5 g/l*By adding to nickel plating solution, co-deposit powder with nickel and make micro-porous chromium plating, and improve corrosion reistance remarkably.SMPC-AD : 2 ml/l,TREATMENT CHEMICALS FOR CHROMIUM PLATINGADDITIVEPRE-AND POST-TREATMENT CHEMICALS FOR CHROMIUM PLATINGApplication Trade Name Composition FeatureAdditive for Chromium PlatingLC-12025 ~ 75 ml/l*Additive to improve covering power of chromium plating. *Can be applied at low concentration and low bath temperature.Mist Preventing AgentTOP SHUT0.5 ~ 1 g/l*Prevent scattering of chromium mist, and improve work efficiency and work environment.Black Color Chromium PlatingSUPER MACRON450 g/l, Adjusting Agent : 10 ml/l*Give uniform black color chromium plating film with high heat-resistance and high corrosion resistance in wide ranges of bath temperature and current density.
METAL FINISHING DEPARTMENT PRODUCTS GUIDE 07CHEMICALS FOR PLATING ON PLASTICSCHEMICALS FOR TOP METALATE PROCESSApplication Trade Name Composition FeatureAir-Pocket Preventing AgentTOP PLACON10 ml/l, H2SO4 : 200 g/l*Eliminate poor adhesion by air accumulation. *To be used with sulfuric acid.Coating for PlatingMAGICOAT PTUConcentration as supplied*Special thermoplastic paint applied by spray coating at plating on non-conductive materials having poor adhesion.NeutralizerADDITIVE FOR TMP NEUTRALIZER10 ml/l, HCl : 10 ml/l*Reduce chromic acid sticked on resin surface at chemical etching, prevent bad influences of chromic acid at the following step,improve adsorption effects of catalyzer and eliminate skipping.B-200 NEUTRALIZER200 ml/l*Strengthen adsorption of catalyst at plating on other resins except ABS Resin (such as PP, Noryl), and make deposition of electroless plating smooth.Surface ConditionerCONDIRISER SPCONDIRISER FR CONC150 ml/l50 ml/l*Condition resin surface after etching and make deposition good. *For super engineering plastics.*Improve adsorption of catalyst to other engineering plastics except ABS Resin, fibers or others.SensitizerSENSITIZER100 ml/l*Adsorb reducing agent on wettable resin surface after etching.ActivatorACTIVATOR50 ml/l*Deposit catalyzing metal on non-conductive material surface.A-30 CATALYST140 ml/l, HCl : 140 ml/l*Strong acidic solution containing catalyzing metal. *Excellent stable and no formation of star-dusts. *Can be applied for long period by replenishment method.CatalyzerA-40 CATALYSTCATALYST C50 ml/l, HCl : 180 ml/l60 ml/l, HCl : 150 ml/l*No formation of star-dusts and excellent resistance to chromic acid.*As high concentration type, less dragging-out at replenishment. *Excellent bath stability and improve covering power.CATALYSY HI-CONC30 ml/l, HCl : 150 ml/l*Extremely high concentration type having good bath balance, as less dragging-out amount at replenishment.AcceleratorACCELERATOR XACCELERATOR KN0.5 g/l, H2SO4 : 100 ml/l5 ml/l, H2SO4 : 100 ml/l*Prevent skipping and improve covering power at electroless plating, and extend bath life by using with sulfuric acid.*Long bath life and less formation of rough deposition.Copper Substitution AgentANC ACTI10 ml/l, MU : 2 ml/l, H2SO4 : 30 ml/l*After treatment, electrolytic acid copper plating can be applied directly. *Less formation of burning-out at racking points.Alkaline Electroless Copper PlatingSolutionELECTROLESS COPPER NEW 100ELECTROLESS COPPER 500A : 100 ml/l, B : 100 ml/lC : 25 ml/lA : 125 ml/l, B : 125 ml/l*Fine particle and less formation of pitting and rough deposition in deposited copper.*Can be applied for long period by replenishment method.*Excellent bath stability. *Can be applied for long period by replenishment method.Formalin-Free ElectrolessCopper Plating SolutionCOPPER LPMU : 250 ml/l, B : 150 ml/l*As weak alkaline type, give almost no aging or etching base materials, and less formalin odor.*Less scratching to deposition film and good bath stability. *Can be applied for long period by replenishment method.TMP ELECTROLESS NICKELA : 160 ml/l, B : 160 ml/l*Economical as it is not necessary to throw away solution at replenishment owing to powder form.Alkaline ElectrolessNickel Plating SolutionPOWDER FORM NEW ELECTROLESSNICKEL RTTMP ELECTROLESS NICKEL CONCFor ReplenishmentFor Replenishment*High concentration type of TMP Electroless Nickel, which is used at exclusively replenishment.*As less dragging-out at replenishment, good in waste water treatment and running costs.ELECTROLESS NICKEL HR-TA : 150 ml/l, B : 150 ml/l*Excellent bath stability and low internal stress of the deposits.
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