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METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR PRINTED WIRING BOARD" 05Application Trade Name Bath Composition FeaturePalladium / Nickel Alloy PlatingSolutionPRECIA PN-HSHigh Speed Bath(Hoop)PRECIA PN-HSStandard Bath(Barrel, Rack)PN-HS Base : 80 g/lPD Salt : 50 g/lPN-HS Conc : 150 ml/lPN-HS R : 50 ml/lPN-HS Base : 80 g/lPD Salt : 25 g/lPN-HS Conc : 75 ml/lPN-HS R : 100 ml/l*Excellent brightness and stable alloy ratio in the deposits.*High speed plating is possible.*Suitable for application to electronics parts and decoration.*Excellent brightness and stable alloy ratio in the deposits.*Barrel plating can be applied.*Suitable for application to electronics parts and decoration.TOP RIP LT-2300 ml/l62% Nitric Acid : 300 ml/l*Fluoride-free, Hydrogen Peroxide-free dipping type stripping agent for solder and tin films.*No erosion of copper and copper alloys substrate.TOP RIP LT-2(S)300 ml/l98% Sulfric Acid : 100 ml/l62% Nitric Acid : 100 ml/l*Fluoride-free, Hydrogen Peroxide-free spray type stripper for tin film on copper substrate.*Easily remove tin migration layer.Tin / Nickel / Solder Stripping AgentTOP RIP BTConcentration as supplied35% Hydrogen Peroxide : 40 ml/l*Dipping type stripping agent for nickel plating resist film on copper substrate.TOP RIP WSWS-2 : 400 ml/l62% Nitric Acid : 300 ml/l*Fluoride-free, Hydrogen Peroxide-free spray type stripper for tin plating resist film on copper substrate.OPC RIP SOLDER TConcentration as supplied*Solder and tin stripping agent for terminal plating.*No attack to copper substrate.OPC-B101 PRE ETCH500 ml/l*Condition Epoxy Resin surface and make etching easy.*As swelling power is slightly week, suitable for resins which are etched easily.OPC-B102 PRE ETCH500 ml/l*Condition Epoxy Resin surface and make etching easy.*As swelling power is strong, suitable for resins which are etched hardly.OPC-B103 PRE ETCH300 ml/lSodium Hydroxide : 13 g/l*Condition Epoxy Resin surface and make etching easy.*As swelling power is moderate, suitable for resins which are etched hardly.OPC-B201 EPO ETCH60 ml/lPotassium Permanganate : 45 g/l*Electroless nickel plating solution for ICP process.*Less generation of skipping and bridge phenomenon.Chemicals for Build-UpBoards Treatment(OPC-B Series)OPC-B303 NEUTRALIZEROPC-B41 CONDICLEAN200 ml/l100 ml/l*Electroless nickel plating solution for ICP process.*Excellent chemical resistance and corrosion resistance.*Electroless nickel plating solution for ICP process.*Especially, excellent chemical resistance and corrosion resistance.OPC-B61 CATALYST30 ml/lSAL M : 260 g/l*Excellent to adhesion effects.*Can get the stable deposition with the wide range of material.*Applicable for build-up board.OPC-B71 ACCELERATOR200 ml/l*Non-fluoride acidic liquid.*Catalyst metal is activated, and close adhesion is made strong.BUILD COPPER1 : 30 ml/l2 : 15 ml/lMU : 200 ml/l*Excellent bath stability.and deposition to blind via-hole is excellent.*It is especially suitable for build-up circuit board.
METAL FINISHING DEPARTMENT PRODUCTS GUIDE "CHEMICALS FOR PRINTED WIRING BOARD" 06Application Trade Name Bath Composition FeatureICP CLEAN HAC100 ml/l*Acid cleaner for finger prints or light degree oil.*Suppress spreading of electroless nickel plating.ICP CLEAN S-135200 ml/l*Acid cleaner and clean fine pattern copper circuit.ICP ACCERA200 ml/l*Surface activator for application of electroless nickel plating on isolared circuit of P. W. B.Chemicals for Plating onIsolated Circuit Board(TOP ICP Process)ICP NICORON UICP NICORON USDU-M : 100 ml/lU-10 : 50 ml/lUDS-M : 100 ml/lUSD-1 : 50 ml/l*Electroless nickel plating solution for ICP process.*Less generation of skipping and bridge phenomenon.*Electroless nickel plating solution for ICP process.*Excellent chemical resistance and corrosion resistance.ICP NICORON DKDK-M : 100 ml/lDK-1 : 50 ml/l*Electroless nickel plating solution for ICP process.*Especially, excellent chemical resistance and corrosion resistance.ICP NICORON GM (S)GM-HS : 120 ml/lGM-1 : 50 ml/l*Excellent solder wettability and soldering reliability.*Can be applied at 80FLASH GOLD 2000150 ml/lPotassium Aurous Cyanide : 2.25 g/l*Substitution type electroless gold plating solution.*Give fine gold plating film having excellent adhesion.OPC-1050 CONDITIONER300 ml/lSodium Hydroxide : 15 g/l*Condition epoxy board surface and clean the hole wall.*As less self-consumption, economical.Chromium-Free SmearRemoving Process(OPC-1000 Process Ds)OPC-1200 EPO ETCHOPC-1300 NEUTRALIZER100 ml/lPotassium Permanganate : 45 g/l200 ml/l*Roughen the surface of epoxy resin or BT resin without attacking laminated copper.*Remove residue of manganese oxide on board surface.*Excellent osmosis effects and can treat up to small holes in a short time.OPC-1400 NEUTRALIZER200 ml/l1400 Neutralizer AD : 25 ml/l*Neutralizer for desmear tretment in horizontal line.*Remove residue of manganese oxide adsorbed on board surface and hole wall.DP-15 CONDICLEAN50 ml/l*Exclusive cleaner for DYLEX Process.*Remove dirts on board surface and improve adsorption of DP-46 Conductor.DP-3 FOUNDATION30 ml/l*Give wettability to boards, improve osmosis effects to holes and accelerate adsoprtion of DP-46 Conductor.Chemicals for DirectAcid Copper Plating(Dylex Process)DP-46 CONDUCTORDP-5 STABILIZER150 ml/lConductor MU : 50 ml/l100 ml/l*Electro-conductor for direct acid copper plating.*Excellent adsorption effects, and cover inside wall of holes completely.*Reduce electro-conductor adsorped on hole wall, and make acid copper plating possible.DP-6 NEUTRALIZER100 ml/l35% Hydrogen Peroxide : 100 ml/l*Clean conductive film in the holes and improve covering of acid copper plating.*Remove conductive film on laminated copper and make adhesion between acid copper plating andlaminated copper strong.
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