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Tutorial: EMC & Signal Integrity using SPICE, page 44 - IEEE EMC ...

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papers and presentations on <strong>EMC</strong> and signal<br />

integrity related subjects in the US, in<br />

Europe and in Asia. He was a co-recipient<br />

of the best paper award at the 1996 <strong>IEEE</strong><br />

<strong>EMC</strong> Symposium. He is a past <strong>IEEE</strong> <strong>EMC</strong><br />

Society Distinguished Lecturer and currently<br />

serves on the <strong>IEEE</strong> <strong>EMC</strong> Society<br />

Respected Speakers Bureau. He has also<br />

served on the <strong>IEEE</strong> <strong>EMC</strong> Society TC-9<br />

Computational Electromagnetics committee,<br />

the <strong>IEEE</strong> <strong>EMC</strong> Society TC-10 <strong>Signal</strong><br />

<strong>Integrity</strong> committee, and the SAE <strong>EMC</strong><br />

Modeling Task Force committee. On March<br />

9, Dr. Sergiu Radu of Sun Microsystems, a<br />

2009-2010 <strong>IEEE</strong> <strong>EMC</strong> Society Distinguished<br />

Lecturer, was the guest speaker for<br />

the Santa Clara Valley Chapter. After networking<br />

time and a light dinner, Dr. Radu<br />

gave a very informative lecture entitled,<br />

“An Overview of Chip Level <strong>EMC</strong> Problems.”<br />

The CPUs and the VLSI chips are<br />

the primary sources of electromagnetic<br />

noise in all electronic equipment. Reducing<br />

electro magnetic noise at the source<br />

level is usually the best and the most economical<br />

solution. The presentation discussed<br />

typical interference mechanisms<br />

associated with CPU/VLSI, as well as miti-<br />

gation methods at the die-level and package<br />

level. Among the aspects discussed<br />

were some power distribution issues, ondie<br />

decoupling, package capacitors, routing<br />

aspects, the impact of back-bias and forward-bias,<br />

and the impact of die-shrinks on<br />

the EMI performance of the VLSI chips.<br />

Dr. Sergiu Radu is currently Principal<br />

Engineer at Sun Microsystems, leading the<br />

<strong>EMC</strong> design group in Menlo Park, Califor-<br />

nia. His role at Sun includes the development<br />

and implementation of architectural<br />

frameworks for <strong>EMC</strong> design through<br />

design guidelines and best practices, and to<br />

provide forward looking solutions, root<br />

cause analysis of significant <strong>EMC</strong> problems,<br />

design methodologies involving software<br />

simulations and better prediction<br />

techniques. Sergiu Radu received a M.S.<br />

and a Ph.D. in Electrical Engineering<br />

(Electronics) from the Technical University<br />

of Iasi, Romania, and until 1996 he was an<br />

Associate Professor at the same university,<br />

involved in electromagnetic compatibility<br />

teaching and research. From 1996 until<br />

1998 he was a Visiting Scholar, as part of<br />

the Electromagnetic Compatibility Laboratory,<br />

at the University of Missouri-Rolla,<br />

currently Missouri University of Science<br />

and Technology. In 1998 he joined the<br />

<strong>EMC</strong> engineering group at Sun Microsystems.<br />

Sergiu holds seven US patents for<br />

EMI reduction techniques in electronic<br />

systems and has many papers published in<br />

research journals, symposia, and magazines.<br />

He is a reviewer for <strong>IEEE</strong> Transactions on<br />

<strong>EMC</strong>. He is also a Distinguished Lecturer<br />

for the <strong>IEEE</strong> <strong>EMC</strong> Society.<br />

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Dr. Sergiu Radu of Sun Microsystems<br />

shed light on the topic on Chip Level<br />

<strong>EMC</strong> for the Santa Clara Valley Chapter.<br />

13

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