Tutorial: EMC & Signal Integrity using SPICE, page 44 - IEEE EMC ...
Tutorial: EMC & Signal Integrity using SPICE, page 44 - IEEE EMC ...
Tutorial: EMC & Signal Integrity using SPICE, page 44 - IEEE EMC ...
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Letter from the Editor<br />
<strong>EMC</strong> Newsletter Editor-in-Chief Janet O’Neil is joined by Heyno<br />
Garbe, the new Transactions on <strong>EMC</strong> Editor-in-Chief, at the<br />
annual <strong>IEEE</strong> Panel of Editors meeting in New Jersey. Professor<br />
Garbe took the helm on January 1, 2010, succeeding Perry Wilson.<br />
I attended the annual <strong>IEEE</strong> Panel of Editors meeting on April 23-24,<br />
2010 in New Brunswick, New Jersey. This meeting is held for the editors<br />
of all <strong>IEEE</strong> publications to learn about the latest developments in <strong>IEEE</strong><br />
publications, new publication policies and services available, as well as<br />
where the <strong>IEEE</strong> stands competitively in the global publications arena.<br />
This year, my colleague Heyno Garbe, the new Transactions on <strong>EMC</strong><br />
editor, joined me at the meeting. It may have been a bit overwhelming<br />
for Professor Garbe to attend this meeting for the first time. After all,<br />
the meeting room is set for some 300 people classroom style with a<br />
large stage and screen at the front of the room. Most people attend with<br />
their laptop to follow the presentations on their computer since a CD<br />
is provided of all presentations. There is a table microphone for every<br />
four seats. With the internet access also available, it is one wired meeting!<br />
Breakout sessions are held for the separate publications so Transactions<br />
Editors and Newsletter Editors can meet separately and talk with<br />
their peer editors in order to learn best practices and the like. In the<br />
Peter Tuohy, Director - Periodicals Production Services for <strong>IEEE</strong>,<br />
gives a presentation at the Panel of Editors meeting regarding the<br />
challenges facing the <strong>IEEE</strong> traditional newsletter print model.<br />
continued on <strong>page</strong> 88<br />
FIELD OF INTEREST<br />
The Field of Interest of the Electromagnetic Compatibility (<strong>EMC</strong>) Society involves engineering<br />
related to the electromagnetic environmental effects of systems to be compatible with itself and<br />
their intended operating environment. This includes: standards, measurement techniques and test<br />
procedures, instrumentation, equipment and systems characteristics, interference control techniques<br />
and components, education, computational analysis, and spectrum management, along<br />
with scientific, technical, industrial, professional or other activities that contribute to this field.<br />
Newsletter Staff<br />
Editor-in-Chief<br />
Janet Nichols O’Neil<br />
ETS-Lindgren<br />
1301 Arrow Point Drive<br />
Cedar Park, TX 78613<br />
425.868.2558<br />
e-mail: j.n.oneil@ieee.org<br />
Associate Editors<br />
ABSTRACTS<br />
Professor Osamu Fujiwara<br />
Dept. of Elec. & Comp. Engineering<br />
Nagoya Institute of Technology<br />
Gokiso-cho, Showa-ku, Nagoya<br />
466-8555 Japan<br />
+81.52.735.5421<br />
fax: +81.52.735.5<strong>44</strong>2<br />
e-mail: fujiwara@odin.elcom.nitech.ac.jp<br />
BOOK REVIEWS<br />
Antonio Orlandi<br />
UAq <strong>EMC</strong> Laboratory, EE Dept.<br />
University of L’Aquila<br />
I-67040 Poggio di Roio<br />
L’Aquila ITALY<br />
+39-0862-3<strong>44</strong>779 (211)<br />
fax: +39-0862-3<strong>44</strong>527<br />
e-mail: antonio.orlandi@univaq.it<br />
CHAPTER CHATTER<br />
Todd Robinson<br />
CKC Laboratories, Inc.<br />
5473A Clouds Rest<br />
Mariposa, CA 95338<br />
209.966.5240 x207<br />
fax: 209.742.6133<br />
e-mail: todd.robinson@ckc.com<br />
COMPLETED CAREERS<br />
Donald N. Heirman<br />
143 Jumping Brook Road<br />
Lincroft, NJ 07738-1<strong>44</strong>2<br />
732.741.7723<br />
fax: 732.530.5695<br />
e-mail: d.heirman@worldnet.att.net<br />
<strong>EMC</strong> DESIGN TIPS<br />
Bruce Archambeault<br />
IBM, P. O. Box 12195<br />
Department 18DA B306<br />
Research Triangle Park,<br />
NC 22709<br />
919.486.0120<br />
e-mail: bruce.arch@ieee.org<br />
COVER PHOTO/DESIGN ©<br />
Kenneth Wyatt<br />
www.wyattphoto.com<br />
Technical Editor<br />
Flavio Canavero<br />
Department of Electronics<br />
Polytechnic of Turin<br />
Corso Duca degli Abruzzi 24<br />
10129 Torino, Italy<br />
+39 (011) 564 4060<br />
fax: +39 (011) 564 4099<br />
e-mail: canavero@ieee.org<br />
<strong>EMC</strong> PERSONALITY PROFILE<br />
William G. Duff<br />
SENTEL, 7601 South Valley Drive<br />
Fairfax Station, VA 22039<br />
e-mail: wmduff@cox.net<br />
Frank Sabath<br />
WIS, Humboldstrasse<br />
D-29633 Munster, Germany<br />
+49.4172.988083<br />
Fax: +49.4172.988083<br />
e-mail: frank.sabath@ieee.org<br />
<strong>EMC</strong> STANDARDS ACTIVITIES<br />
Donald N. Heirman<br />
143 Jumping Brook Road<br />
Lincroft, NJ 07738-1<strong>44</strong>2<br />
732.741.7723<br />
fax: 732.530.5695<br />
e-mail: d.heirman@worldnet.att.net<br />
<strong>EMC</strong>S BoD ACTIVITIES<br />
Janet Nichols O’Neil<br />
ETS-Lindgren<br />
1301 Arrow Point Drive<br />
Cedar Park, TX 78613<br />
425.868.2558<br />
fax: 425.868.0547<br />
e-mail: j.n.oneil@ieee.org<br />
<strong>EMC</strong>S EDUCATION<br />
COMMITTEE<br />
Tom Jerse, Professor<br />
The Citadel – Dept. of ECE<br />
171 Moultrie Street<br />
Charleston, SC 29409<br />
843.953.7499<br />
e-mail: Jerset@Citadel.edu<br />
<strong>EMC</strong> SOCIETY HISTORY &<br />
50th ANNIVERSARY<br />
Dan Hoolihan<br />
Hoolihan <strong>EMC</strong> Consulting<br />
P. O. Box 367<br />
Lindstrom, MN 55045<br />
651.213.0966<br />
fax: 651.213.0977<br />
e-mail: d.hoolihan@ieee.org<br />
Advertising Susan E. Schneiderman<br />
Business Development Manager, <strong>IEEE</strong> Magazines<br />
<strong>IEEE</strong> Media<br />
<strong>44</strong>5 Hoes Lane,<br />
Piscataway NJ 08854 USA<br />
Tel: +1-732-562-3946; Fax: +1-732-981-1855<br />
www.ieee.org/ieeemedia ss.ieeemedia@ieee.org<br />
<strong>IEEE</strong> <strong>EMC</strong> Society Newsletter Publication Schedule<br />
Publication Editorial Advertising<br />
Dates Deadlines Deadlines<br />
Summer July 1 July 12<br />
Fall October 1 October 11<br />
Winter January 1 January 14<br />
Spring April 1 April 11<br />
<strong>IEEE</strong> <strong>EMC</strong> SOCIETY NEWSLETTER (ISSN 1089-0785) is published quarterly<br />
by the Electromagnetic Compatibility Society of the Institute of Electrical<br />
and Electronic Engineers, Inc., 3 Park Avenue, 17th Floor, New York, NY<br />
10016-5997. One dollar ($1.00 USD) per member per year (included in the<br />
Society fee) for each member of the <strong>EMC</strong> Society. Periodicals postage paid at<br />
New York, NY and additional mailing offices. This newsletter is printed in<br />
the USA. Postmaster: Send address changes to <strong>IEEE</strong> <strong>EMC</strong> Society Newsletter<br />
to <strong>44</strong>5 Hoes Lane, Piscataway, NJ 08854.<br />
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