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Tutorial: EMC & Signal Integrity using SPICE, page 44 - IEEE EMC ...

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Letter from the Editor<br />

<strong>EMC</strong> Newsletter Editor-in-Chief Janet O’Neil is joined by Heyno<br />

Garbe, the new Transactions on <strong>EMC</strong> Editor-in-Chief, at the<br />

annual <strong>IEEE</strong> Panel of Editors meeting in New Jersey. Professor<br />

Garbe took the helm on January 1, 2010, succeeding Perry Wilson.<br />

I attended the annual <strong>IEEE</strong> Panel of Editors meeting on April 23-24,<br />

2010 in New Brunswick, New Jersey. This meeting is held for the editors<br />

of all <strong>IEEE</strong> publications to learn about the latest developments in <strong>IEEE</strong><br />

publications, new publication policies and services available, as well as<br />

where the <strong>IEEE</strong> stands competitively in the global publications arena.<br />

This year, my colleague Heyno Garbe, the new Transactions on <strong>EMC</strong><br />

editor, joined me at the meeting. It may have been a bit overwhelming<br />

for Professor Garbe to attend this meeting for the first time. After all,<br />

the meeting room is set for some 300 people classroom style with a<br />

large stage and screen at the front of the room. Most people attend with<br />

their laptop to follow the presentations on their computer since a CD<br />

is provided of all presentations. There is a table microphone for every<br />

four seats. With the internet access also available, it is one wired meeting!<br />

Breakout sessions are held for the separate publications so Transactions<br />

Editors and Newsletter Editors can meet separately and talk with<br />

their peer editors in order to learn best practices and the like. In the<br />

Peter Tuohy, Director - Periodicals Production Services for <strong>IEEE</strong>,<br />

gives a presentation at the Panel of Editors meeting regarding the<br />

challenges facing the <strong>IEEE</strong> traditional newsletter print model.<br />

continued on <strong>page</strong> 88<br />

FIELD OF INTEREST<br />

The Field of Interest of the Electromagnetic Compatibility (<strong>EMC</strong>) Society involves engineering<br />

related to the electromagnetic environmental effects of systems to be compatible with itself and<br />

their intended operating environment. This includes: standards, measurement techniques and test<br />

procedures, instrumentation, equipment and systems characteristics, interference control techniques<br />

and components, education, computational analysis, and spectrum management, along<br />

with scientific, technical, industrial, professional or other activities that contribute to this field.<br />

Newsletter Staff<br />

Editor-in-Chief<br />

Janet Nichols O’Neil<br />

ETS-Lindgren<br />

1301 Arrow Point Drive<br />

Cedar Park, TX 78613<br />

425.868.2558<br />

e-mail: j.n.oneil@ieee.org<br />

Associate Editors<br />

ABSTRACTS<br />

Professor Osamu Fujiwara<br />

Dept. of Elec. & Comp. Engineering<br />

Nagoya Institute of Technology<br />

Gokiso-cho, Showa-ku, Nagoya<br />

466-8555 Japan<br />

+81.52.735.5421<br />

fax: +81.52.735.5<strong>44</strong>2<br />

e-mail: fujiwara@odin.elcom.nitech.ac.jp<br />

BOOK REVIEWS<br />

Antonio Orlandi<br />

UAq <strong>EMC</strong> Laboratory, EE Dept.<br />

University of L’Aquila<br />

I-67040 Poggio di Roio<br />

L’Aquila ITALY<br />

+39-0862-3<strong>44</strong>779 (211)<br />

fax: +39-0862-3<strong>44</strong>527<br />

e-mail: antonio.orlandi@univaq.it<br />

CHAPTER CHATTER<br />

Todd Robinson<br />

CKC Laboratories, Inc.<br />

5473A Clouds Rest<br />

Mariposa, CA 95338<br />

209.966.5240 x207<br />

fax: 209.742.6133<br />

e-mail: todd.robinson@ckc.com<br />

COMPLETED CAREERS<br />

Donald N. Heirman<br />

143 Jumping Brook Road<br />

Lincroft, NJ 07738-1<strong>44</strong>2<br />

732.741.7723<br />

fax: 732.530.5695<br />

e-mail: d.heirman@worldnet.att.net<br />

<strong>EMC</strong> DESIGN TIPS<br />

Bruce Archambeault<br />

IBM, P. O. Box 12195<br />

Department 18DA B306<br />

Research Triangle Park,<br />

NC 22709<br />

919.486.0120<br />

e-mail: bruce.arch@ieee.org<br />

COVER PHOTO/DESIGN ©<br />

Kenneth Wyatt<br />

www.wyattphoto.com<br />

Technical Editor<br />

Flavio Canavero<br />

Department of Electronics<br />

Polytechnic of Turin<br />

Corso Duca degli Abruzzi 24<br />

10129 Torino, Italy<br />

+39 (011) 564 4060<br />

fax: +39 (011) 564 4099<br />

e-mail: canavero@ieee.org<br />

<strong>EMC</strong> PERSONALITY PROFILE<br />

William G. Duff<br />

SENTEL, 7601 South Valley Drive<br />

Fairfax Station, VA 22039<br />

e-mail: wmduff@cox.net<br />

Frank Sabath<br />

WIS, Humboldstrasse<br />

D-29633 Munster, Germany<br />

+49.4172.988083<br />

Fax: +49.4172.988083<br />

e-mail: frank.sabath@ieee.org<br />

<strong>EMC</strong> STANDARDS ACTIVITIES<br />

Donald N. Heirman<br />

143 Jumping Brook Road<br />

Lincroft, NJ 07738-1<strong>44</strong>2<br />

732.741.7723<br />

fax: 732.530.5695<br />

e-mail: d.heirman@worldnet.att.net<br />

<strong>EMC</strong>S BoD ACTIVITIES<br />

Janet Nichols O’Neil<br />

ETS-Lindgren<br />

1301 Arrow Point Drive<br />

Cedar Park, TX 78613<br />

425.868.2558<br />

fax: 425.868.0547<br />

e-mail: j.n.oneil@ieee.org<br />

<strong>EMC</strong>S EDUCATION<br />

COMMITTEE<br />

Tom Jerse, Professor<br />

The Citadel – Dept. of ECE<br />

171 Moultrie Street<br />

Charleston, SC 29409<br />

843.953.7499<br />

e-mail: Jerset@Citadel.edu<br />

<strong>EMC</strong> SOCIETY HISTORY &<br />

50th ANNIVERSARY<br />

Dan Hoolihan<br />

Hoolihan <strong>EMC</strong> Consulting<br />

P. O. Box 367<br />

Lindstrom, MN 55045<br />

651.213.0966<br />

fax: 651.213.0977<br />

e-mail: d.hoolihan@ieee.org<br />

Advertising Susan E. Schneiderman<br />

Business Development Manager, <strong>IEEE</strong> Magazines<br />

<strong>IEEE</strong> Media<br />

<strong>44</strong>5 Hoes Lane,<br />

Piscataway NJ 08854 USA<br />

Tel: +1-732-562-3946; Fax: +1-732-981-1855<br />

www.ieee.org/ieeemedia ss.ieeemedia@ieee.org<br />

<strong>IEEE</strong> <strong>EMC</strong> Society Newsletter Publication Schedule<br />

Publication Editorial Advertising<br />

Dates Deadlines Deadlines<br />

Summer July 1 July 12<br />

Fall October 1 October 11<br />

Winter January 1 January 14<br />

Spring April 1 April 11<br />

<strong>IEEE</strong> <strong>EMC</strong> SOCIETY NEWSLETTER (ISSN 1089-0785) is published quarterly<br />

by the Electromagnetic Compatibility Society of the Institute of Electrical<br />

and Electronic Engineers, Inc., 3 Park Avenue, 17th Floor, New York, NY<br />

10016-5997. One dollar ($1.00 USD) per member per year (included in the<br />

Society fee) for each member of the <strong>EMC</strong> Society. Periodicals postage paid at<br />

New York, NY and additional mailing offices. This newsletter is printed in<br />

the USA. Postmaster: Send address changes to <strong>IEEE</strong> <strong>EMC</strong> Society Newsletter<br />

to <strong>44</strong>5 Hoes Lane, Piscataway, NJ 08854.<br />

© 2010 <strong>IEEE</strong>. Permission to copy without fee all or part of any material<br />

without a copyright notice is granted provided that the copies are not made<br />

or distributed for direct commercial advantage, and the title of the publication<br />

and its date appear on each copy. To copy material with a copyright<br />

notice requires specific permission. Please direct all inquiries or requests to<br />

<strong>IEEE</strong> Copyrights Office.<br />

ISSN 1089-0785<br />

<strong>IEEE</strong> prohibits discrimination, harassment, and bullying. For more information,<br />

visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html.<br />

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