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UNIVERSIT . . AT BONN Physikalisches Institut - Prof. Dr. Norbert ...

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2.5. Direct converting sensor materials 15<br />

2.5 Direct converting sensor materials<br />

The selection of the direct converting sensor material plays an important role on the<br />

detector performance. Therefore this section will introduce three different sensor materials,<br />

which were used in this work. A special focus will be placed on the discussion of material<br />

related effects.<br />

2.5.1 Silicon<br />

Silicon is a widely used and well understood elementary semiconductor material. This<br />

and the lack of unwanted material effects make it a very good reference for the testing of<br />

hybrid pixel detector concepts.<br />

Concerning its physical properties, Si is a tetravalent metalloid with an atomic number of<br />

14, i.e. it is situated in the carbon group of the periodic table of elements. In its crystalline<br />

form Si is arranged in a face-centered cubic lattice with the base � (0, 0, 0), ( 1 /4, 1 /4, 1 /4) � .<br />

This structure is also called a diamond lattice. The relevant material properties of Si are<br />

given in Tab. 2.4. At room temperature the free charge carrier density in high purity<br />

Si is approximately 10 10 cm 3 . Compared to the other sensor materials in Tab. 2.4 this<br />

constitutes a relatively low resistance, which is also the reason why Si sensors have to be<br />

doped. In the doping process elements with three (p-dopant e.g. In) and five (n-dopant<br />

e.g. As) valence electrons are implanted into the Si crystal, resulting in additional acceptor<br />

(p-dopant) and donator (n-dopant) energy levels in the band gap. The combination of<br />

such p- and n-doped zones then establishes a p-n junction whose schematic representation<br />

is shown in Fig. 2.9. The major feature of this junction is the depletion zone, which<br />

is created by the diffusion of majority carriers from one zone into the oppositely doped<br />

region. In this context, the term majority carriers refers to electrons in the n-doped zone<br />

and holes in the p-doped zone. The diffusion of the charge carriers causes the build-up<br />

of a positive space charge inside the n-type Si and a negative space charge in the p-type<br />

section. This introduces an electric field, which counteracts the diffusion process and thus<br />

causes a thermal equilibrium across the junction. Fig. 2.9(b) gives a schematic view of the<br />

space charge distribution with NA (p-type) and ND (n-type) describing the acceptor and<br />

Element Si CdTe CZT<br />

Atomic number Z 14 48,52 48,30,52<br />

Average Z 14 50 49.1<br />

Density [g/cm 3 ] 2.33 5.85 5.78<br />

Band gap [eV] 1.12 1.50 1.57<br />

e − - h + creation energy [eV] 3.61 4.43 4.64<br />

Typ. resistance [Ωcm] 2.3 · 10 5 10 9 >10 10<br />

Radiation length X0 [cm] 9.36 1.52 1.52<br />

Dielectric constant [As/Vm] 11.7 11 10.9<br />

Mobility e − [cm 2 /Vs] 1400 1000 1000-1300<br />

Mobility h + [cm 2 /Vs] 480 100 50-80<br />

Average lifetime e − [s] 10 −3 3 · 10 −6 3 · 10 −6<br />

Average lifetime h + [s] 2 · 10 −3 2 · 10 −6 10 −6<br />

µτ e − [cm 2 /V] 1.4 3.3 · 10 −3 (3 − 5) · 10 −3<br />

µτ h + [cm 2 /V] 1 2 · 10 −4 5 · 10 −5<br />

Tab. 2.4: Material constants of Si, CdTe and CdZnTe.

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