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CH1-silicon wafer & Si epitaxy - KTH

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2B1242 SPRING 2006<br />

Surface reaction controlled regime:<br />

Deposition not (very) sensitive to geometrical arrangement of <strong>wafer</strong>s in reactor.<br />

However, low growth rates!<br />

Can be solved by reducing total pressure which affects D G and extends surfacereaction<br />

limited region to higher T:<br />

(Plummer Fig 9-13)<br />

Mikael Östling <strong>KTH</strong>

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