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CH1-silicon wafer & Si epitaxy - KTH

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2B1242 SPRING 2006<br />

Oxygen in CZ- <strong>Si</strong><br />

Oxygen dissolves from quartz crucible during CZ growth<br />

~10 18 cm -3 !<br />

Three effects during circuit processing :<br />

+ <strong>Si</strong>-O-<strong>Si</strong> bindings resulting in higher mechanical strength<br />

- Oxygen donors (<strong>Si</strong>O 4). 10 16 cm -3 form at 400-500 ° C<br />

- Bulk precipitation (<strong>Si</strong>O 2) (but can be controlled by gettering)<br />

Mikael Östling <strong>KTH</strong>

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