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Development of a Oxygen Sensor for Marine ... - DTU Nanotech

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44 CHAPTER 5. FABRICATION<br />

Thermometer), Ag (Reference Electrode), and Au (Contacts) are deposited.<br />

Why these 3?<br />

As discussed previously Pt and Ag have been used almost exclusively <strong>for</strong><br />

Clark <strong>Sensor</strong>s, and referenced as the best suited metals from a dissolved oxygen<br />

sensor[37].<br />

Where as Au gold provides an excellent surface <strong>for</strong> bonding to wirebond, as<br />

well as being able resist some exposure to saltwater.<br />

Figure 5.7: Illustration <strong>of</strong> the wafer with the three metals added.<br />

Figure 5.8: Alignment marks after the metals are added. From left to right,<br />

ignoring the first one, it is Pt(brown), Ag(light brown), Au(red).<br />

Each metal have double alignment marks, two boxes and a crisscross<br />

pattern. This is mainly to have a little extra safety when<br />

aligning the masks, so that there is always another alignment<br />

mark to check with.<br />

Pt will be put on first <strong>for</strong> two reasons; It is the metal with the smallest<br />

structure, and hence the metal where the lithography step is most sensitive,<br />

and there<strong>for</strong>e where it is most like to go wrong. Also since the Au-Contacts<br />

and the Pt-Thermometer crosses, having the PT buried beneath the Au will<br />

ensure an unbroken line (Especially as the Au, 3000 ˚A, layer is over 10 times<br />

as thick as the Pt, 200 ˚A, layer).<br />

A minor problem however is that a lot <strong>of</strong> metals have poor adhesion to<br />

many <strong>for</strong>ms <strong>of</strong> Silicon (including Silicide), hence a titanium layer is added

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