Development of a Oxygen Sensor for Marine ... - DTU Nanotech

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58 CHAPTER 7. EVALUATION OF RESULTS AND MEASUREMENTS process step, in case problems with the rest of the process should arise. There was one small problem with the Pt, the exposure time in the photolithography was originally set to 7 seconds instead of 4. As a result this, both the working array and the temperature sensor had huge gaps, or were missing entire as seen on Figure 7.1. However once the exposure time was lowered to 4, the problem was solved, and the fine structure and small dots of Pt was clearly evident, as seen on Figure 7.2. Figure 7.2: Pt are no longer missing and both the dots in the working and the lines in the temperature sensor looks fine. Beyond this however there was no real problem in fabricating the chip, except for the problems already mentioned, also while the recipe for the titanium silicide was new, it formed successfully. 7.2 Temperature Sensor The temperature sensor was tested to see if it had the required linear dependency, and to see if the TCR (Temperature Coefficient of Resistance) varied from the standard and if so, how much it did. This is done in order to know how much that needs to be compensated, since there is a titanium strip beneath the platinum, and the gold contacts can also be expected to change it a bit. The experiment was done using 2 multimeter’s, a probestation, and a heating plate. The chip measured on was placed in the probestation, and the 2 multimeter’s was connected, one measuring the temperature of the chip, and the other measuring the resistance through the temperature sensor. The heating plate was then used to raise the temperature to around 50 o C, after which it was cooled down. Measurements was made both while heating and cooling.
7.2. TEMPERATURE SENSOR 59 Figure 7.3: Graphs showing the relative temperature against the resistance, TCR is equal to the slope of the lines. As can be seen from Figure 7.3 the measured TCR’s (3.33×10 −3 , 4.09×10 −3 , 4.09×10 −3 , 4.11×10 −3 )are very close to the standard[46] 3.8×10 −3 for platinum.
Page 1 and 2:
Development of a Oxygen Sensor for
Page 3:
Abstract This thesis described the
Page 7 and 8:
Contents 1 Introduction 1 1.1 Disso
Page 9 and 10:
CONTENTS vii B Fabrication Process
Page 11 and 12:
Chapter 1 Introduction Roughly 70 %
Page 13 and 14:
1.1. DISSOLVED OXYGEN LEVEL 3 K = a
Page 15 and 16:
1.2. THESIS OUTLINE 5 In Chapter 8
Page 17 and 18: Chapter 2 Optodes and ISFET There a
Page 19 and 20: 2.2. ISFET (ION SELECTIVE FIELD EFF
Page 21 and 22: 2.3. SUMMARY 11 of oxygen molecules
Page 23 and 24: Chapter 3 Theory of the Clark Senso
Page 25 and 26: 3.1. CHEMISTRY OF THE CLARK SENSOR
Page 33 and 34: 3.2. THE POTENTIOSTAT 23 Reference
Page 35 and 36: 3.2. THE POTENTIOSTAT 25 Working El
Page 37 and 38: Chapter 4 System Design The sensor
Page 39 and 40: 4.2. ACTUAL DESIGN 29 seen on figur
Page 41 and 42: 4.2. ACTUAL DESIGN 31 The third des
Page 43 and 44: 4.3. TEMPERATURE SENSOR 33 Figure 4
Page 45 and 46: 4.3. TEMPERATURE SENSOR 35 a Pt300,
Page 47 and 48: 4.4. PACKAGING 37 Figure 4.11: Clos
Page 49 and 50: 4.4. PACKAGING 39 90 mm 15 mm 6 mm
Page 51 and 52: Chapter 5 Fabrication The fabricati
Page 53 and 54: 5.1. PROCESSING 43 Figure 5.4: Alig
Page 55 and 56: 5.2. BACK-END PROCESSING 45 under e
Page 57 and 58: 5.2. BACK-END PROCESSING 47 5.2.2 A
Page 59 and 60: Chapter 6 Problems and Solutions In
Page 61 and 62: 6.1. WIREBONDING 51 make a line bet
Page 63 and 64: 6.2. THE FLEX PRINT 53 The reason b
Page 65 and 66: 6.3. THE ’O’-RING 55 Figure 6.8
Page 67: Chapter 7 Evaluation of Results and
Page 71 and 72: 7.4. SUMMARY 61 Figure 7.5: Polarog
Page 73 and 74: Chapter 8 Conclusion The primary go
Page 75 and 76: Bibliography [1] http://earthobserv
Page 77 and 78: BIBLIOGRAPHY 67 [26] W.E. Morf. The
Page 79 and 80: Appendix A Silicide Recipe The foll
Page 81 and 82: Appendix B Fabrication Process 71
Page 84 and 85: 74 APPENDIX B. FABRICATION PROCESS
Page 86: 76 APPENDIX C. PROCESS SEQUENCE
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