Development of a Oxygen Sensor for Marine ... - DTU Nanotech

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56 CHAPTER 6. PROBLEMS AND SOLUTIONS 6.4 Summary While many problems can occur in creating a sensor, it is not safe to assume that merely because the cleanroom processing is done that no further problems will be encountered. The problems shown and solved in this chapter, illustrates this very well.
Chapter 7 Evaluation of Results and Measurements Shown in this chapter is the results gained during this project, as well as how they might be improved upon. While the process itself was successful, the problem that showed up with the packaging and the wirebonder, as detailed in Chapter refsec:problems, there is not as many measurements on the Clark Sensor as hoped, and therefore these will have to be obtained after this thesis is handed in. Figure 7.1: Pictures showing the missing Pt. On the picture on the left, some residues of platinum can be seen, where as the middle one shows a hole in the temperature sensor, while on the picture to the right the temperature sensor is missing entirely. 7.1 Fabrication results The fabrication of the chips was successful, and one wafer made it through the whole clean room process, while a few others were postponed at an early 57
Page 1 and 2:
Development of a Oxygen Sensor for
Page 3:
Abstract This thesis described the
Page 7 and 8:
Contents 1 Introduction 1 1.1 Disso
Page 9 and 10:
CONTENTS vii B Fabrication Process
Page 11 and 12:
Chapter 1 Introduction Roughly 70 %
Page 13 and 14:
1.1. DISSOLVED OXYGEN LEVEL 3 K = a
Page 15 and 16: 1.2. THESIS OUTLINE 5 In Chapter 8
Page 17 and 18: Chapter 2 Optodes and ISFET There a
Page 19 and 20: 2.2. ISFET (ION SELECTIVE FIELD EFF
Page 21 and 22: 2.3. SUMMARY 11 of oxygen molecules
Page 23 and 24: Chapter 3 Theory of the Clark Senso
Page 25 and 26: 3.1. CHEMISTRY OF THE CLARK SENSOR
Page 33 and 34: 3.2. THE POTENTIOSTAT 23 Reference
Page 35 and 36: 3.2. THE POTENTIOSTAT 25 Working El
Page 37 and 38: Chapter 4 System Design The sensor
Page 39 and 40: 4.2. ACTUAL DESIGN 29 seen on figur
Page 41 and 42: 4.2. ACTUAL DESIGN 31 The third des
Page 43 and 44: 4.3. TEMPERATURE SENSOR 33 Figure 4
Page 45 and 46: 4.3. TEMPERATURE SENSOR 35 a Pt300,
Page 47 and 48: 4.4. PACKAGING 37 Figure 4.11: Clos
Page 49 and 50: 4.4. PACKAGING 39 90 mm 15 mm 6 mm
Page 51 and 52: Chapter 5 Fabrication The fabricati
Page 53 and 54: 5.1. PROCESSING 43 Figure 5.4: Alig
Page 55 and 56: 5.2. BACK-END PROCESSING 45 under e
Page 57 and 58: 5.2. BACK-END PROCESSING 47 5.2.2 A
Page 59 and 60: Chapter 6 Problems and Solutions In
Page 61 and 62: 6.1. WIREBONDING 51 make a line bet
Page 63 and 64: 6.2. THE FLEX PRINT 53 The reason b
Page 65: 6.3. THE ’O’-RING 55 Figure 6.8
Page 69 and 70: 7.2. TEMPERATURE SENSOR 59 Figure 7
Page 71 and 72: 7.4. SUMMARY 61 Figure 7.5: Polarog
Page 73 and 74: Chapter 8 Conclusion The primary go
Page 75 and 76: Bibliography [1] http://earthobserv
Page 77 and 78: BIBLIOGRAPHY 67 [26] W.E. Morf. The
Page 79 and 80: Appendix A Silicide Recipe The foll
Page 81 and 82: Appendix B Fabrication Process 71
Page 84 and 85: 74 APPENDIX B. FABRICATION PROCESS
Page 86: 76 APPENDIX C. PROCESS SEQUENCE
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