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Development of a Oxygen Sensor for Marine ... - DTU Nanotech

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Chapter 6<br />

Problems and Solutions<br />

In almost every project some unexpected problems appears, ranging from<br />

merely inconvenient problems such as cleanroom machinery being out <strong>of</strong><br />

work, to more actual problems, such as fabrications steps being more complicated<br />

than they appear on paper. In this chapter some <strong>of</strong> the problems<br />

encountered during the process <strong>of</strong> creating the Clark sensor will be highlighted,<br />

as well as how they were solved when possible.<br />

6.1 Wirebonding<br />

As mentioned in Chapter 5, the first, and at the time the only, choice <strong>for</strong><br />

connecting the chip to the flex print was wirebonding. Wirebonding is basically<br />

done by having a needle, with a metal (Al) thread through it, pressing<br />

down on the contact pad <strong>of</strong> the chip, and then through the use <strong>of</strong> ultrasound<br />

and vibrations attach the thread. The similar process is then repeated on<br />

the flex print, at which time the rest <strong>of</strong> the thread is snapped <strong>of</strong>f. However<br />

this would soon prove to be a lot more complicated than it sounds. For some<br />

unexplainable reasons the thread refused to per<strong>for</strong>m the second attachment,<br />

whether it was on the gold on the chip, or on the flex print. Albeit some<br />

were wirebondings were successful, they were few and there was far between<br />

them.<br />

Why this is so, remained a mystery <strong>for</strong> a while, however there was some<br />

problems with the machine at the time. However a later examination <strong>of</strong> the<br />

flex print revealed that the metal on it was tin covered copper. There<strong>for</strong> it<br />

was impossible to bond to the flex print, unless the tin was scraped <strong>of</strong>f, as<br />

49

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