uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

More documents

Recommendations

Info

006 m f d 007 cr cn ---uuauu 008 070413s2002 nyua fo 001 0 eng d 010 $z 2003278381 020 $a0071449507 020 $z0071385460 (print) 035 $a(Sirsi) a213531 050 4$aTH5701$b.B88 2002 082 04$a696$222 100 1 $aButler, Robert Brown. 245 10$aArchitectural engineering design$h[electronic resource] :$bmechanical systems /$cRobert Brown Butler. 260 $aNew York :$bMcGraw-Hill,$c[2002] 300 $a1 electronic text (xix, 810 p.) :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 500 $aIncludes index. 588 $aDescription based on cover image and table of contents, viewed on April 13, 2007. 500 $aPrint version c2002. 505 0 $uhttp://www.loc.gov/catdir/toc/mh041/2003278381.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information$uhttp://www.loc.gov/catdir/bios/mh041/2003278381.html 650 0$aBuildings$xMechanical systems. 650 0$aBuildings$xMechanical equipment. 650 0$aBuildings$xElectric equipment. 650 0$aBuilding$xPlanning. 650 0$aArchitectural design. 650 0$aBuildings$xEnvironmental engineering. 650 0$aArchitectural acoustics. 650 0$aPlumbing. 650 0$aLighting. 655 0$aInternet resources. 655 0$aElectronic books. 740 02$aClimatic forces. 740 02$aClimate control. 740 02$aPlumbing. 740 02$aElectrical. 740 02$aIillumination. 740 02$aAcoustics. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/architectural-engineering-design-mechanicalsystems$zSubscription required 949 $aTH 5701 .B88$wLC$c1$i213531-2001$d12/28/2011$lMAIN$mMGH$q12$rY$sY$tWEB$u4/13/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 05023cam 2201357 a 4500 001 ccn00213532 006 m f d 007 cr cn ---uuauu 008 070418s2002 nyua fobf 000 0 eng d 010 $z 2001041051 020 $a0071449450 020 $z0071374930 (print) 035 $a(Sirsi) a213532 050 4$aTK7870.15$b.G54 2002 082 04$a621.381/046$221 100 1 $aGilleo, Ken. 245 10$aArea array packaging handbook$h[electronic resource] /$cKen Gilleo. 260 $aNew York :$bMcGraw-Hill,$c[2002] 300 $a1 electronic text :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 18, 2007. 500 $aPrint version c2002. 504 $aIncludes bibliographical references. 505 0 $uhttp://www.loc.gov/catdir/toc/mh021/2001041051.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information$uhttp://www.loc.gov/catdir/bios/mh041/2001041051.html
650 0$aBall grid array technology. 650 0$aMicroelectronic packaging. 650 0$aElectronics industries. 650 0$aElectronic packaging. 650 0$aIntegrated circuits industry. 650 0$aFlip chip technology. 650 0$aPolymers. 650 0$aElectronics$xMaterials. 650 0$aHermetic sealing. 650 0$aAdhesives. 650 0$aSolder and soldering. 650 0$aMultichip modules (Microelectronics)$xTesting. 650 0$aScreen process printing. 650 0$aSoftware measurement. 650 0$aElectronic apparatus and appliances$xCosts. 650 0$aSurface mount technology. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aLasky, Ronald. C. 700 1 $aMorvan, Y. 700 1 $aSmith, Lee. 700 1 $aFjelstad, Joseph. 700 1 $aYasumura, Gary. 700 1 $aKim, Young Gon. 700 1 $aRandolph, Steve. 700 1 $aSanders, John. 700 1 $aCole, Marie S. 700 1 $aBates, Bill. 700 1 $aChen, Tim. 700 1 $aCotterman, Bruce. 700 1 $aGarrett, Dave. 700 1 $aMohanty, Rita. 700 1 $aPerry, John. 700 1 $aPreveti, Mike. 700 1 $aLee, Jacob. 700 1 $aMinogue, Gerard. 700 1 $aHwang, Jennie S. 700 1 $aRae, Alan. 700 1 $aBlumel, David. 700 1 $aBaldwin, Daniel F. 700 1 $aJohnson, R. Wayne. 700 1 $aWood, Paul. 700 1 $aRupprecht, Howard. 700 1 $aGhaffarian, Raza. 700 1 $aLazinsky, C. 700 1 $aBelmonte, Joe. 700 1 $aSchiebel, G�unter. 700 1 $aApell, Marc. 700 1 $aMcLenaghan, A. James. 700 1 $aLewis, Brian. 700 1 $aJiang, Nan. 700 1 $aTravers, Joseph. 700 1 $aAnderson, Steve. 700 1 $aZarrow, Phil. 710 2 $aPrismark Partners LLC. 740 02$aIntroduction to electronic packaging. 740 02$aElectronics industry overview. 740 02$aTrends/drivers in the electronics manufacturing industry. 740 02$aArea array packaging. 740 02$aStacked/3d packages. 740 02$aCompliant ic packaging. 740 02$aFlip chip technology. 740 02$aOptions in high-density part cleaning. 740 02$aMems packaging and assembly challenges. 740 02$aCeramic ball and column grid array overview. 740 02$aPolymer packaging materials: adhesives, encapsulants, and underfills. 740 02$aHermetic packaging systems: adhesive and getter.
Page 1 and 2:
000 02558cam 2200625 a 4500 001 ccn
Page 3 and 4:
740 02$aHeat recovery and reuse. 74
Page 5 and 6:
007 cr cn ---uuauu 008 100211s2009
Page 7 and 8:
700 1 $aFine, Daniel H. 700 1 $aDod
Page 9 and 10:
740 02$aOptofluidic colloidal photo
Page 11 and 12:
035 $a(Sirsi) a303067 050 4$aTP355$
Page 13 and 14:
740 02$aDesign of connections for a
Page 15 and 16:
000 04720cam 2201093 a 4500 001 ccn
Page 17 and 18:
740 02$aBio- MEMS packaging. 740 02
Page 19 and 20:
650 0$aExperimental design. 655 0$a
Page 21 and 22:
740 02$aHeavy metal removal. 740 02
Page 23 and 24:
740 02$aRadiometry, wave optics, an
Page 25 and 26:
006 m f d 007 cr cn ---uuauu 008 10
Page 27 and 28:
530 $aAlso issued in print and PDF
Page 29 and 30:
700 1 $aWolfe, William L. 700 1 $aZ
Page 31 and 32:
700 1 $aKlein, Marvin. 700 1 $aHaga
Page 33 and 34:
740 02$aTechniques of first-order l
Page 35 and 36:
740 02$aX-ray mirror metrology. 740
Page 37 and 38:
740 02$aOverview of the emerging co
Page 39 and 40:
700 1 $aReddy, T. Agami. 700 1 $aSt
Page 41 and 42:
245 00$aForensic structural enginee
Page 43 and 44:
300 $a1 electronic text (xv, 448 p.
Page 45 and 46:
245 00$aStem cell technologies$h[el
Page 47 and 48:
050 4$aTK1056$b.P48 2010 082 04$a62
Page 49 and 50:
010 $z 2010287045 020 $z97800717010
Page 51 and 52:
830 0$aMcGraw-Hill's AccessEngineer
Page 53 and 54:
300 $a1 electronic text (xvii, 488
Page 55 and 56:
949 $aHD 1390 .H67$wLC$c1$i316581-1
Page 57 and 58:
655 0$aInternet resources. 710 2 $a
Page 59 and 60:
655 0$aElectronic books. 655 0$aInt
Page 61 and 62:
000 01910cam 2200505 a 4500 001 ccn
Page 63 and 64: 740 02$aSlope stability. 740 02$aRe
Page 65 and 66: 100 1 $aWang, Linbing,$d1963- 245 1
Page 67 and 68: 007 cr cn ---uuauu 008 110415s2011
Page 69 and 70: 650 0$aBattery industry. 650 0$aSpa
Page 71 and 72: 655 0$aInternet resources. 740 02$a
Page 73 and 74: 740 02$aThrough-silicon-via (TSV) i
Page 77 and 78: high-power laser sources as well as
Page 79 and 80: 505 0 $aPart I. Disassembly backgro
Page 81 and 82: 700 1 $aEvett, Jack B.,$d1942- 700
Page 83 and 84: 650 0$aBiomedical engineering. 650
Page 85 and 86: 245 10$aSchaums outlines signals an
Page 87 and 88: 650 0$aSystems engineering. 650 0$a
Page 89 and 90: 650 0$aElectric displacement$vOutli
Page 91 and 92: 650 0$aStructural frames$vOutlines,
Page 93 and 94: 949 $aQA 303 .A96 2009$wLC$c1$i3374
Page 95 and 96: 655 0$aElectronic books. 655 0$aInt
Page 97 and 98: 000 02788cam 2200625 a 4500 001 ccn
Page 99 and 100: 740 02$aIntroduction to statistical
Page 101 and 102: 740 02$aRequirements engineering ar
Page 103 and 104: 740 02$aAlternating-current circuit
Page 105 and 106: 997 $a(c)2012 Cassidy Cataloguing S
Page 107 and 108: 035 $a(Sirsi) a345656 050 4$aQD257$
Page 109 and 110: 650 0$aComputer software$xQuality c
Page 111 and 112: 490 1 $aMcGraw-Hill's AccessEnginee
Page 113: 740 02$aWireless communications. 74
Page 117 and 118: 740 02$aFundamentals of soil and wa
Page 119 and 120: 001 ccn00213537 006 m f d 007 cr cn
Page 121 and 122: 740 02$aMeasuring system performanc
Page 123 and 124: 650 0$aSurveying$vTables. 650 0$aMa
Page 125 and 126: 700 1 $aCunningham, Michael J. 700
Page 127 and 128: 020 $z9780071544528 (print) 035 $a(
Page 129 and 130: 650 0$aBuilding sites$xPower supply
Page 131 and 132: 740 02$aNetwork models. 740 02$aDat
Page 133 and 134: 490 1 $aMcGraw-Hill's AccessEnginee
Page 135 and 136: 740 02$aInternally ground parts. 74
Page 137 and 138: process variations -- ch. 9. Procur
Page 139 and 140: 245 10$aElectrical engineer's porta
Page 141 and 142: 300 $a1 electronic text :$bill. 490
Page 143 and 144: 500 $aPrint version c2006. 504 $aIn
Page 145 and 146: 700 1 $aErickson, Calvin. 700 1 $aR
Page 149 and 150: 650 0$aElectric connectors. 650 0$a
Page 151 and 152: 650 0$aWater chemistry. 650 0$aComp
Page 153 and 154: 655 0$aElectronic books. 655 0$aInt
Page 155 and 156: 740 02$aThinking globally--the comp
Page 157 and 158: 650 0$aStructural dynamics. 650 0$a
Page 159 and 160: 700 1 $aMalmodin, Jens. 700 1 $aTra
Page 161 and 162: 650 0$aEarthquakes$xSafety measures
Page 163 and 164: 740 02$aBrief insight of project ma
Page 165 and 166:
655 0$aInternet resources. 740 02$a
Page 167 and 168:
500 $aPrint version c2003. 500 $aRe
Page 169 and 170:
650 0$aPower-plants$xEquipment and
Page 171 and 172:
000 03994cam 2201177 a 4500 001 ccn
Page 173 and 174:
650 0$aSealing compounds$xTesting.
Page 175 and 176:
740 02$aCost engineering. 740 02$aO
Page 177 and 178:
740 02$aUOP thermal hydrodealkylati
Page 179 and 180:
010 $z 2002511505 020 $a0071449493
Page 181 and 182:
700 1 $aTheisen, Hilary. 700 1 $aSp
Page 183 and 184:
700 1 $aDenney, Richard W., Jr. 700
Page 185 and 186:
700 1 $aDearth, David R. 700 1 $aKe
Page 187 and 188:
650 0$aHorizontal oil well drilling
Page 189 and 190:
020 $z9780071622974 (print) 020 $a0
Page 191 and 192:
740 02$aHydraulics of open channel
Page 193 and 194:
000 09104cam 2202365 a 4500 001 ccn
Page 195 and 196:
740 02$aHVAC subsystems. 740 02$aAi
Page 197 and 198:
035 $a(Sirsi) a213700 050 4$aTP492$
Page 199 and 200:
740 02$aQuantum well infrared photo
Page 201 and 202:
700 1 $aFarquhar, Edward A. 700 1 $
Page 203 and 204:
500 $aPrint version c2003. 504 $aIn
Page 205 and 206:
740 02$aStep-by-step overviews of o
Page 207 and 208:
650 0$aMetal-cutting. 650 0$aTurnin
Page 209 and 210:
740 02$aAdaptive control. 740 02$aO
Page 211 and 212:
650 0$aMasonry. 650 0$aMasonry$xHis
Page 213 and 214:
650 0$aEngineering design$xData pro
Page 215 and 216:
700 1 $aDavic, Nicholas D. 700 1 $a
Page 217 and 218:
740 02$aCase study : staffing a new
Page 219 and 220:
650 0$aMetals$xFinishing. 650 0$aSt
Page 221 and 222:
740 02$aDigital control systems. 74
Page 223 and 224:
740 02$aIndustrial robots. 740 02$a
Page 225 and 226:
655 0$aInternet resources. 740 02$a
Page 227 and 228:
856 40$uhttp://accessengineeringlib
Page 229 and 230:
650 0$aBackhoes. 650 0$aConveying m
Page 231 and 232:
Page 233 and 234:
Page 235 and 236:
700 1 $aFan, Timothy. 700 1 $aKaise
Page 237 and 238:
740 02$aEquipment for distillation,
Page 239 and 240:
035 $a(Sirsi) a214000 050 4$aTA1520
Page 241 and 242:
700 1 $aBritton, Gordon. 700 1 $aDe
Page 243 and 244:
650 0$aPlastics$xChemical resistanc
Page 245 and 246:
300 $a1 electronic text :$bill. 490
Page 247 and 248:
001 ccn00214049 006 m f d 007 cr cn
Page 249 and 250:
008 070501s2004 nyuab fobf 001 0 en
Page 251 and 252:
650 0$aMicroelectronic packaging. 6
Page 253 and 254:
000 06072cam 2202029 a 4500 001 ccn
Page 255 and 256:
700 1 $aKaiser, David A. 700 1 $aKe
Page 257 and 258:
545 0 $aContributor biographical in
Page 259 and 260:
700 1 $aBoyadjis, Paul A. 700 1 $aC
Page 261 and 262:
000 04091cam 2200985 a 4500 001 ccn
Page 263 and 264:
Page 265 and 266:
650 0$aIntegrated circuits. 650 0$a
Page 267 and 268:
700 1 $aRamdani, Jamal. 700 1 $aVac
Page 269 and 270:
740 02$aSignaling transport (SIGTRA
Page 271 and 272:
082 04$a621.382$221 245 00$aSpread
Page 273 and 274:
700 1 $aMalyszek, Jeffrey D. 740 02
Page 275 and 276:
740 02$aSpectral changes and linear
Page 277 and 278:
700 1 $aChang, Hsun-Hsien. 700 1 $a
Page 279 and 280:
505 0 $aFrequency bands, propagatio
Page 281 and 282:
740 02$aSpectrum analysis. 740 02$a
Page 283 and 284:
650 0$aPhase modulation. 650 0$aRad
Page 285 and 286:
700 1 $aLebron, Ramon C. 700 1 $aCr
Page 287 and 288:
740 02$aSubstitution and analog mea
Page 289 and 290:
245 00$aStandard handbook of machin
Page 291 and 292:
830 0$aMcGraw-Hill's AccessEngineer
Page 293 and 294:
710 2 $aEnvirex Products. 710 2 $aS
Page 295 and 296:
020 $z0071354719 (print) 035 $a(Sir
Page 297 and 298:
650 0$aBuilding laws$zUnited States
Page 299 and 300:
650 0$aLasers$xHistory. 650 0$aOpti
Page 301 and 302:
997 $a(c)2007 Cassidy Cataloguing S
Page 303 and 304:
008 070430s2003 nyua fobf 001 0 eng
Page 305 and 306:
650 0$aLanduse, Urban. 650 0$aHuman
Page 307 and 308:
588 $aDescription based on cover im
Page 309 and 310:
650 0$aWater-supply$xSecurity measu
Page 311 and 312:
650 0$aAbstract data types (Compute
Page 313 and 314:
588 $aDescription based on cover im
Page 315 and 316:
545 0 $aContributor biographical in
Page 317 and 318:
949 $aTK 6570 .M6 L375$wLC$c1$i2141
Page 319 and 320:
035 $a(Sirsi) a214198 050 4$aTA666$
Page 321 and 322:
analysis of components -- ch. 19. S
Page 323 and 324:
700 1 $aCarlson, C. L. 700 1 $aKiss
Page 325 and 326:
949 $aTJ 151 .M37$wLC$c1$i214215-20
Page 327 and 328:
740 02$aPrinciples of color vision.
Page 329 and 330:
700 1 $aSoni, M. P. 700 1 $aPatel,
Page 331 and 332:
650 0$aElectric wiring, Interior. 6
Page 333 and 334:
000 07168cam 22020771a 4500 001 ccn
Page 335 and 336:
740 02$aUltra wideband arrays. 740
Page 337 and 338:
740 02$aArrays of folded unipoles.
Page 339 and 340:
020 $z0071470751 (print) 020 $z9780
Page 341 and 342:
740 02$aIdentification of ageing pr
Page 343 and 344:
Page 345 and 346:
740 02$aRecognizing the forms of co
Page 347 and 348:
700 1 $aTaylor, Tim. 700 1 $aMarch,
Page 349 and 350:
007 cr cn ---uuauu 008 081008s2008
Page 351 and 352:
740 02$aManaging the global design
Page 353 and 354:
504 $aIncludes bibliographical refe
Page 355 and 356:
020 $z0071548661 (print) 020 $a0071
Page 357 and 358:
740 02$aRigid pipe products. 740 02
Page 359 and 360:
740 02$aAlignment of a pair of sequ
Page 361 and 362:
530 $aAlso issued in print and PDF
Page 363 and 364:
050 4$aTP157$b.L475 2008 082 04$a62
Page 365 and 366:
Page 367 and 368:
740 02$aIntroduction to solar power
Page 369 and 370:
Page 371 and 372:
504 $aIncludes bibliographical refe
Page 373 and 374:
245 10$aSolid waste analysis and mi
Page 375 and 376:
700 1 $aKim, Y. Richard. 700 1 $aBa
Page 377 and 378:
000 02966cam 2200685 a 4500 001 ccn
Page 379 and 380:
700 1 $aWaite, Gabi Nindl. 700 1 $a
show all

uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

Create successful ePaper yourself

Delete template?

Save as template?