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010 $z 2003046353 020 $z0071402144 (print) 020 $a0071450297 035 $a(Sirsi) a213578 050 4$aTK7836$b.E4654 2003 082 04$a621.381$221 245 00$aElectronic materials and processes handbook$h[electronic resource] /$cCharles A. Harper, editor in chief. 250 $a3rd ed. 260 $aNew York :$bMcGraw-Hill,$c[2003] 300 $a1 electronic text :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 24, 2007. 530 $aAlso issued in print and PDF version. 500 $aPrint version c2003. 504 $aIncludes bibliographical references and index. 545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/bios/mh041/2003046353.html 505 0 $uhttp://www.loc.gov/catdir/toc/mh031/2003046353.html 650 0$aElectronics$xMaterials. 650 0$aElectronic apparatus and appliances$xMaterials. 650 0$aIntegrated circuits$xDesign and construction. 650 0$aMicroelectronics. 650 0$aIntegrated circuits$xMaterials. 650 0$aElectronic ceramics. 650 0$aElectronic packaging. 650 0$aMicroelectronic packaging. 650 0$aPrinted circuits. 650 0$aElectric insulators and insulation$xPlastics. 650 0$aAdhesives. 650 0$aSolder and soldering. 650 0$aElectronic apparatus and appliances$xTemperature control. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aHarper, Charles A. 700 1 $aCohn, Charles. 700 1 $aSchoch, Karl F. 700 1 $aBailey, Alan E. 700 1 $aGardner, J. Donald. 700 1 $aHwang, Jennie S. 700 1 $aMcChesney, Mike. 700 1 $aCarano, Michael. 700 1 $aFjelstad, Joseph. 700 1 $aSergent, Jerry E. 700 1 $aToleno, Brian J. 700 1 $aBurns, Barry. 700 1 $aMarinelli, Christy. 700 1 $aKrum, Al. 740 02$aDevelopment and fabrication of IC chips. 740 02$aPlastics, elastomers, and composites. 740 02$aCeramics and glasses. 740 02$aMetals. 740 02$aSolder technologies for electronic packaging and assembly. 740 02$aElectroplating and deposited metallic coatings. 740 02$aPrinted circuit board fabrication. 740 02$aMaterials and processes for hybrid microelectronics and multichip modules. 740 02$aAdhesives, underfills, and coatings in electonics assemblies. 740 02$aThermal management materials and systems. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/electronic-materials-and-processes-handbookthird-edition$zSubscription required 949 $aTK 7836 .E4654$wLC$c1$i213578-2001$d12/30/2011$lMAIN$mMGH$q7$rY$sY$tWEB$u4/24/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 03706cam 2200757 a 4500 001 ccn00213579 006 m f d
007 cr cn ---uuauu 008 070424s2003 nyua fobf 001 0 eng d 010 $z 2002028803 020 $z0071386246 (print) 020 $a007145005X 035 $a(Sirsi) a213579 050 4$aTK7836$b.E468 2003 082 04$a621.381$221 245 00$aElectronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials$h[electronic resource] /$cJohn H. Lau ... [et al.]. 260 $aNew York :$bMcGraw-Hill,$c[2003] 300 $a1 electronic text :$bill. 490 0 $aMcGraw-Hill handbooks 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 24, 2007. 530 $aAlso issued in print and PDF version. 500 $aPrint version c2003. 504 $aIncludes bibliographical references and index. 545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/bios/mh041/2002028803.html 505 0 $uhttp://www.loc.gov/catdir/toc/mh031/2002028803.html 650 0$aElectronic apparatus and appliances$xDesign and construction. 650 0$aGreen products. 650 0$aEnvironmental protection. 650 0$aElectronic apparatus and appliances$xMaterials$xEnvironmental aspects. 650 0$aElectronic packaging$xMaterials$xEnvironmental aspects. 650 0$aMicroelectronic packaging$xMaterials$xEnvironmental aspects. 650 0$aIntegrated circuits$xMaterials$xEnvironmental aspects. 650 0$aPolychlorinated biphenals$xEnvironmental aspects. 650 0$aSolders and soldering$xEnvironmental aspects. 650 0$aHalocarbons$xEnvironmental aspects. 650 0$aLead-free electronics manufacturing processes. 650 0$aAdhesives$xEnvironmental aspects. 650 0$aElectronics$xMaterials$xEnvironmental aspects. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aLau, John H. 740 02$aIntroduction to environmentally benign electronics manufacturing. 740 02$aChip- (wafer- ) level interconnects with lead-free solder bumps. 740 02$aWLCSP with lead-free solder bumps on PCB/substrate. 740 02$aChip- (wafer- ) level interconnects with solderless bumps. 740 02$aWLCSPs with solderless bumps on PCB/substate. 740 02$aEnvironmentally benign molding compounds for IC packages. 740 02$aEnvironmentally benign die attach films for IC packaging. 740 02$aEnvironmental issues for conventional PCBs. 740 02$aHalogenated and halogen-free materials for flame retardation. 740 02$aFabrication of environmentally friendly PCB. 740 02$aGlobal status of lead-free soldering. 740 02$aDevelopment of lead-free solder alloys. 740 02$aPrevailing lead-free alloys. 740 02$aLead-free surface finishes. 740 02$aImplementation of lead-free soldering. 740 02$aChallenges for lead-free soldering. 740 02$aIntroduction to conducive adhesives. 740 02$aConductivity establishment of conductive adhesives. 740 02$aMechanisms underlying the unstable contact resistance of ECAs. 740 02$aStabilization of contact resistance of conductive adhesives. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/electronics-manufacturing-with-lead-freehalogen-free-and-conductive-adhesive-materials$zSubscription required 949 $aTK 7836 .E468$wLC$c1$i213579-2001$d12/30/2011$lMAIN$mMGH$q11$rY$sY$tWEB$u4/24/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 05173cam 2201333 a 4500 001 ccn00213580 006 m f d 007 cr cn ---uuauu
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740 02$aHeat recovery and reuse. 74
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700 1 $aFine, Daniel H. 700 1 $aDod
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740 02$aOptofluidic colloidal photo
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035 $a(Sirsi) a303067 050 4$aTP355$
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740 02$aDesign of connections for a
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740 02$aBio- MEMS packaging. 740 02
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650 0$aExperimental design. 655 0$a
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740 02$aHeavy metal removal. 740 02
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740 02$aRadiometry, wave optics, an
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530 $aAlso issued in print and PDF
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700 1 $aWolfe, William L. 700 1 $aZ
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700 1 $aKlein, Marvin. 700 1 $aHaga
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740 02$aTechniques of first-order l
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740 02$aX-ray mirror metrology. 740
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740 02$aOverview of the emerging co
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700 1 $aReddy, T. Agami. 700 1 $aSt
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245 00$aForensic structural enginee
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300 $a1 electronic text (xv, 448 p.
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245 00$aStem cell technologies$h[el
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050 4$aTK1056$b.P48 2010 082 04$a62
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830 0$aMcGraw-Hill's AccessEngineer
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300 $a1 electronic text (xvii, 488
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949 $aHD 1390 .H67$wLC$c1$i316581-1
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650 0$aBattery industry. 650 0$aSpa
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high-power laser sources as well as
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505 0 $aPart I. Disassembly backgro
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700 1 $aEvett, Jack B.,$d1942- 700
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650 0$aBiomedical engineering. 650
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650 0$aSystems engineering. 650 0$a
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650 0$aElectric displacement$vOutli
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Page 101 and 102: 740 02$aRequirements engineering ar
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Page 145: 700 1 $aErickson, Calvin. 700 1 $aR
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700 1 $aFarquhar, Edward A. 700 1 $
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500 $aPrint version c2003. 504 $aIn
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740 02$aStep-by-step overviews of o
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650 0$aMetal-cutting. 650 0$aTurnin
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650 0$aIntegrated circuits. 650 0$a
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740 02$aSignaling transport (SIGTRA
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082 04$a621.382$221 245 00$aSpread
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700 1 $aMalyszek, Jeffrey D. 740 02
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588 $aDescription based on cover im
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650 0$aWater-supply$xSecurity measu
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700 1 $aCarlson, C. L. 700 1 $aKiss
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740 02$aPrinciples of color vision.
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700 1 $aSoni, M. P. 700 1 $aPatel,
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740 02$aIdentification of ageing pr
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740 02$aManaging the global design
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050 4$aTP157$b.L475 2008 082 04$a62
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