uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

700 1 $aNumakura, Dominique K.
740 02$aElectronic packaging and high-density interconnectivity.
740 02$aSemiconductor packaging technology.
740 02$aAdvanced packaging.
740 02$aTypes of printed wiring boards.
740 02$aIntroduction to base materials.
740 02$aBase material components.
740 02$aBase material manufacturing processes.
740 02$aProperties of base materials.
740 02$aDensification issues for base materials.
740 02$aIntroducing base materials into the PCB manufacturing process.
740 02$aHDI microvia materials.
740 02$aLaminate qualification and testing.
740 02$aPhysical characteristics of the PCB.
740 02$aPCB design process.
740 02$aElectrical and mechanical design parameters.
740 02$aControlled impedance.
740 02$aMultilayer design issues.
740 02$aPlanning for design, fabrication, and assembly.
740 02$aManufacturing information documentation and transfer.
740 02$aElectronic contract manufacturing supplier selection and management.
740 02$aIntroduction to high-density interconnection technology.
740 02$aHigh-density interconnect-build-up technologies.
740 02$aMicrovia hole technologies.
740 02$aDrilling processes.
740 02$aHigh-density interconnect drilling.
740 02$aImaging.
740 02$aMultilayer materials and processing.
740 02$aPreparing boards for plating.
740 02$aElectroplating.
740 02$aDirect plating.
740 02$aPWB manufacture using fully electroless copper.
740 02$aSurface finishes.
740 02$aEtching process and technologies.
740 02$aSolder resist material and processes.
740 02$aMachining and routing.
740 02$aProcess capability and control.
740 02$aBare board test objectives and definitions.
740 02$aBare board test methods.
740 02$aBare board test equipment.
740 02$aHDI bare board special testing methods.
740 02$aAssembly processes.
740 02$aDesign for soldering and solderability.
740 02$aSolder materials and processes.
740 02$aNo-clean assembly process.
740 02$aLead-free soldering.
740 02$aFluxes and cleaning.
740 02$aPress-fit connections.
740 02$aAcceptability of fabricated boards.
740 02$aAcceptability of printed circuit board assemblies.
740 02$aAssembly inspection.
740 02$aDesign for testing.
740 02$aLoaded board testing.
740 02$aReliability of printed circuit assemblies.
740 02$aComponent-to-PWB reliability.
740 02$aProcess waste minimization and treatment.
740 02$aFlexible circuits: applications and materials.
740 02$aDesign of flexible circuits.
740 02$aManufacturing of flexible circuits.
740 02$aTermination of flexible circuits.
740 02$aSpecial constructions of flexible circuits.
740 02$aQuality assurance of flexible circuits.
830 0$aMcGraw-Hill's AccessEngineering.
856 40$uhttp://accessengineeringlibrary.com/browse/printed-circuits-handbook-fifthedition$zSubscription
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949 $aTK 7868 .P7 P76 2001$wLC$c1$i214053-3001$d2/22/2012$lMAIN$mMGH$q8$rY$sY$tWEB$u5/1/2007$xENG
997 $a(c)2007 Cassidy Cataloguing Services, Inc.