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007 cr cn ---uuauu 008 081008s2008 nyua fob 001 0 eng d 010 $z 2007041214 020 $a0071621741 020 $z0071496602 (print) 020 $z9780071496605 (print) 035 $a(Sirsi) a229566 050 4$aTA174$b.I86 2008 082 04$a621.9/02$222 100 1 $aIt�o, Y.$q(Yoshimi),$d1940- 245 10$aModular design for machine tools$h[electronic resource] /$cYoshimi Ito. 260 $aNew York :$bMcGraw-Hill,$c[2008] 300 $a1 electronic text (xxiii, 504 p.) :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on October 7, 2008. 500 $aPrint version c2008. 504 $aIncludes bibliographical references and index. 505 0 $aPt. 1. Engineering guides of modular design and description methodology of machine tools -- pt.2. Engineering design for machine tool joints-interfacial structural configuration in modular design. 505 0 $uhttp://www.loc.gov/catdir/enhancements/fy0814/2007041214-t.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information$uhttp://www.loc.gov/catdir/enhancements/fy0814/2007041214-b.html 650 0$aEngineering design. 650 0$aComputer-aided design. 650 0$aModularity (Engineering) 650 0$aMachine-tools. 655 0$aElectronic books. 655 0$aInternet resources. 740 02$aBasic knowledge: what is the modular design? 740 02$aEngineering guides and future perspectives of modular design. 740 02$aDescription of machine tools. 740 02$aApplication of machine tool description to engineering design. 740 02$aBasic knowledge of machine tool joints. 740 02$aFundamentals of engineering design and characteristics of the single flat joint. 740 02$aDesign guides, practices, and firsthand view of engineering developments-stationary joints. 740 02$aDesign guides, practices, and firsthand view of engineering developments-sliding joints. 740 02$aRudimentary engineering knowledge about other joints. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/modular-design-for-machine-tools$zSubscription required 949 $aTA 174 .I86 2008$wLC$c1$i229566-2001$d12/30/2011$lMAIN$mMGH$q4$rY$sY$tWEB$u10/8/2008$xENG 997 $a(c)2008 Cassidy Cataloguing Services, Inc. 000 03699cam 2201057 a 4500 001 ccn00230187 006 m f d 007 cr cn ---uuauu 008 081021s2008 nyua fob 001 0 eng 010 $z 2008016996 020 $a0071603158 020 $z0071459065 (print) 020 $z9780071459068 (print) 035 $a(Sirsi) a230187 050 4$aTK7870.15$b.T86 2008 082 04$a621.381/046$222 100 1 $aTummala, Rao R.,$d1942- 245 10$aIntroduction to system-on-package (SOP)$h[electronic resource] :$bminiaturization of the entire system /$cRao R. Tummala, Madhavan Swaminathan. 246 1 $iOnline index title:$aSystem on package: miniaturization of the entire system 260 $aNew York :$bMcGraw-Hill,$c[2008] 300 $a1 electronic text (xx, 785 p.) :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on October 21, 2008. 500 $aPrint version c2008.
504 $aIncludes bibliographical references and index. 530 $aAlso issued in print and PDF version. 650 0$aMultichip modules (Microelectronics)$xDesign and construction. 650 0$aMicroelectronic packaging. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aSwaminathan, Madhavan. 700 1 $aBandyopadhyay, Tapobrata. 700 1 $aMehendale, Mahesh. 700 1 $aRao, Jagdish. 700 1 $aLee, Baik-Woo. 700 1 $aYoon, Chong K. 700 1 $aBrown, Kenneth M. 700 1 $aEngin, A. Ege. 700 1 $aGovind, Vinu. 700 1 $aBavisi, Amit. 700 1 $aPapapolymerou, John. 700 1 $aTentzeris, Manos. 700 1 $aLaskar, Joy. 700 1 $aBhattacharya, Swapan. 700 1 $aChang, Gee-Kung. 700 1 $aGaylord, Thomas. 700 1 $aVallalaz, Ricardo. 700 1 $aGuidotti, Daniel. 700 1 $aChen, Ray T. 700 1 $aSundaram, Venky. 700 1 $aLiu, Fuhan. 700 1 $aKrishnan, Ganesh. 700 1 $aWhite, George. 700 1 $aKohl, Paul. 700 1 $aRaj, P. Markondeya. 700 1 $aPucha, Raghuram V. 700 1 $aQu, Jianmin. 700 1 $aSitaraman, Suresh K. 700 1 $aMonajemi, Pejman. 700 1 $aAyazi, Farrokh. 700 1 $aSparks, Douglas. 700 1 $aZhang, Zhuqing. 700 1 $aLi , Y. 700 1 $aWong, C. P. 700 1 $aJoshi, Y. 700 1 $aJha, Gopal C. 700 1 $aPatterson, M. 700 1 $aDutta, P. 700 1 $aAkbay, S. S. 700 1 $aKeezer, D. 700 1 $aChatterjee, A. 700 1 $aJanagama, Dasharathan G. 700 1 $aLiu, Jin. 700 1 $aIyer, Mahadevan K. 740 02$aIntroduction to the system-on-package (SOP) technology. 740 02$aIntroduction to system-on-chip (SOC). 740 02$aStacked ICS and packages (SIP). 740 02$aMixed-signal (SOP) design. 740 02$aRadio frequency systemon-package (RF SOP). 740 02$aIntegrated chip-to-chip optoelectronic SOP. 740 02$aSOP substrate with multilayer wiring and thin-film embedded components. 740 02$aMixed-signal (SOP) reliability. 740 02$aMEMS packaging. 740 02$aWafer-level SOP. 740 02$aThermal SOP. 740 02$aElectrical test of SOP modules and systems. 740 02$aBiosensor SOP. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/system-on-package-miniaturization-of-the-entiresystem$zSubscription required 949 $aTK 7870.15 .T86$wLC$c1$i230187-2001$d1/13/2012$lMAIN$mMGH$q4$rY$sY$tWEB$u10/21/2008$xENG
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740 02$aHeat recovery and reuse. 74
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700 1 $aFine, Daniel H. 700 1 $aDod
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740 02$aOptofluidic colloidal photo
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740 02$aDesign of connections for a
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740 02$aBio- MEMS packaging. 740 02
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650 0$aExperimental design. 655 0$a
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740 02$aHeavy metal removal. 740 02
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530 $aAlso issued in print and PDF
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700 1 $aWolfe, William L. 700 1 $aZ
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700 1 $aKlein, Marvin. 700 1 $aHaga
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740 02$aTechniques of first-order l
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740 02$aX-ray mirror metrology. 740
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740 02$aOverview of the emerging co
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700 1 $aReddy, T. Agami. 700 1 $aSt
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245 00$aForensic structural enginee
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300 $a1 electronic text (xv, 448 p.
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245 00$aStem cell technologies$h[el
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050 4$aTK1056$b.P48 2010 082 04$a62
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010 $z 2010287045 020 $z97800717010
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505 0 $aPart I. Disassembly backgro
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650 0$aBiomedical engineering. 650
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245 10$aSchaums outlines signals an
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650 0$aSystems engineering. 650 0$a
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650 0$aElectric displacement$vOutli
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650 0$aStructural frames$vOutlines,
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740 02$aRequirements engineering ar
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740 02$aAlternating-current circuit
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997 $a(c)2012 Cassidy Cataloguing S
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035 $a(Sirsi) a345656 050 4$aQD257$
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650 0$aComputer software$xQuality c
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490 1 $aMcGraw-Hill's AccessEnginee
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740 02$aWireless communications. 74
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650 0$aBall grid array technology.
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740 02$aFundamentals of soil and wa
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650 0$aBuilding sites$xPower supply
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process variations -- ch. 9. Procur
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245 10$aElectrical engineer's porta
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500 $aPrint version c2006. 504 $aIn
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650 0$aStructural dynamics. 650 0$a
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700 1 $aMalmodin, Jens. 700 1 $aTra
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650 0$aHorizontal oil well drilling
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740 02$aHydraulics of open channel
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740 02$aQuantum well infrared photo
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740 02$aCase study : staffing a new
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650 0$aMicroelectronic packaging. 6
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650 0$aIntegrated circuits. 650 0$a
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