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650 0$aSemiconductors$xDesign and construction. 650 0$aIntegrated circuits$xDesign and construction. 650 0$aSemiconductors$xMaterials. 650 0$aIntegrated circuits$xReliability. 650 0$aDielectrics. 650 0$aSilicides. 650 0$aPlasma engineering. 650 0$aProcess control. 650 0$aVacuum techology. 650 0$aIntegrated circuits$xMasks. 650 0$aMicrolithography. 650 0$aIon implantation. 650 0$aRapid thermal process. 650 0$aPlasma etching. 650 0$aEtching. 650 0$aPhysical vapor deposition. 650 0$aChemical vapor deposition. 650 0$aEpitaxy. 650 0$aElectrolytic polishing. 650 0$aSemiconductors$xPolishing. 650 0$aSemiconductors$xCleaning. 650 0$aGrinding and polishing. 650 0$aMicroelectronic packaging. 650 0$aElectronic packaging. 650 0$aNanotechnology. 650 0$aMicrofabrication. 650 0$aMicroelectromechanical systems. 650 0$aFlat panel displays. 650 0$aGases. 650 0$aWaste gases$xPurification. 650 0$aHydraulic conveying. 650 0$aSlurry pipelines. 650 0$aChemical plants$xWaste disposal. 650 0$aWater-supply engineering. 650 0$aMaterials handling. 650 0$aMetrology. 650 0$aSix sigma (Quality control standard) 650 0$aSemiconductor industry$xEnvironmental aspects. 650 0$aSemiconductor industry$xHealth aspects. 650 0$aSemiconductor industry$xSafety measures. 650 0$aClean rooms$xDesign and construction. 650 0$aVibration. 650 0$aNoise control. 650 0$aStatic eliminators. 650 0$aElectrostatics. 650 0$aAirborne infection. 650 0$aAir$xPollution. 650 0$aSewage$xPurification$xNeutralization. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aGeng, Hwaiyu. 700 1 $aZhou, Lin. 700 1 $aPark, Ilsun. 700 1 $aRavi, K. V. 700 1 $aRathore, Hazara S. 700 1 $aChanda, Kaushik. 700 1 $aRen, L. P. 700 1 $aTu, King N. 700 1 $aCoumou, David J. 700 1 $aBiltoft, Peter. 700 1 $aHoward, Charles. 700 1 $aMack, Chris A. 700 1 $aGraf, Michael. 700 1 $aZhang, Peng. 700 1 $aLai, Shouliang. 700 1 $aSolzbacher, Florian. 700 1 $aMcInerney, Edward J.
700 1 $aRamdani, Jamal. 700 1 $aVaccari, Giovanni. 700 1 $aRitzdorf, Tom. 700 1 $aKlocke, John. 700 1 $aDyer, Timothy S. 700 1 $aMachamer, Andrew. 700 1 $aBlair, Donald W. 700 1 $aArai, Kazuhisa. 700 1 $aKobayashi, Yoshikazu. 700 1 $aOtani, Hideaki. 700 1 $aT�onnies, Dietrich. 700 1 $aT�opper, Michael. 700 1 $aWang, Zhong L. 700 1 $aHuff, Michael A. 700 1 $aLiu, David N. 700 1 $aCurcie, Wayne D. 700 1 $aSweeney, Joseph D. 700 1 $aCox, James C. 700 1 $aCavicchi, Kristin. 700 1 $aBarsness, Dan. 700 1 $aGould, Charles K. 700 1 $aAlbrecht, David J. 700 1 $aLi, Bo. 700 1 $aCarriker, Wayne. 700 1 $aHaris, Clint. 700 1 $aPeltinov, Ram. 700 1 $aMenaker, Mina. 700 1 $aScibilia, Bruno. 700 1 $aAltis, Yoan Dupret. 700 1 $aMcCafferty, Robert H. 700 1 $aDavis, Brett J. 700 1 $aTrammell, Steven R. 700 1 $aPavlotsky, Richard V. 700 1 $aBeck, Stephen C. 700 1 $aGendreau, Michael. 700 1 $aAmick, Hal. 700 1 $aLevit, Larry. 700 1 $aMuller, Chris. 700 1 $aKochevar, Steven. 700 1 $aGromala, Jerry. 700 1 $aPinkowski, Richard E. 710 2 $aIDC Corporation. 740 02$aHow semiconductor chips are made. 740 02$aIC design. 740 02$aSilicon substrates for semiconductor manufacturing. 740 02$aCopper, low-k dielectrics, and their reliability. 740 02$aFundamentals of silicide formation on Si. 740 02$aPlasma process control. 740 02$aVacuum technology. 740 02$aPhotomask. 740 02$aMicrolithography. 740 02$aIon implantation and rapid thermal processing. 740 02$aWet etching. 740 02$aPlasma etching. 740 02$aPhysical vapor deposition. 740 02$aChemical vapor deposition. 740 02$aEpitaxy. 740 02$aECD fundamentals. 740 02$aChemical mechanical polishing. 740 02$aWet cleaning. 740 02$aInspection, measurement, and test. 740 02$aGrinding, stress relief, and dicing. 740 02$aPackaging. 740 02$aNanotechnology and nanomanufacturing. 740 02$aFundamentals of microelectromechanical systems. 740 02$aFlat-panel display technology and manufacturing. 740 02$aSpecialty gas and CDA systems.
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740 02$aHeat recovery and reuse. 74
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700 1 $aFine, Daniel H. 700 1 $aDod
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740 02$aOptofluidic colloidal photo
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740 02$aHeavy metal removal. 740 02
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740 02$aRadiometry, wave optics, an
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530 $aAlso issued in print and PDF
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700 1 $aWolfe, William L. 700 1 $aZ
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700 1 $aKlein, Marvin. 700 1 $aHaga
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740 02$aTechniques of first-order l
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740 02$aX-ray mirror metrology. 740
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740 02$aOverview of the emerging co
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700 1 $aReddy, T. Agami. 700 1 $aSt
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245 00$aForensic structural enginee
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300 $a1 electronic text (xv, 448 p.
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245 00$aStem cell technologies$h[el
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050 4$aTK1056$b.P48 2010 082 04$a62
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830 0$aMcGraw-Hill's AccessEngineer
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300 $a1 electronic text (xvii, 488
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949 $aHD 1390 .H67$wLC$c1$i316581-1
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505 0 $aPart I. Disassembly backgro
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700 1 $aEvett, Jack B.,$d1942- 700
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650 0$aBiomedical engineering. 650
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245 10$aSchaums outlines signals an
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650 0$aSystems engineering. 650 0$a
Page 89 and 90:
650 0$aElectric displacement$vOutli
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740 02$aIntroduction to statistical
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740 02$aRequirements engineering ar
Page 103 and 104:
740 02$aAlternating-current circuit
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997 $a(c)2012 Cassidy Cataloguing S
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035 $a(Sirsi) a345656 050 4$aQD257$
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650 0$aComputer software$xQuality c
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490 1 $aMcGraw-Hill's AccessEnginee
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740 02$aWireless communications. 74
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650 0$aBall grid array technology.
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740 02$aFundamentals of soil and wa
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740 02$aMeasuring system performanc
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650 0$aSurveying$vTables. 650 0$aMa
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700 1 $aCunningham, Michael J. 700
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650 0$aBuilding sites$xPower supply
Page 131 and 132:
740 02$aNetwork models. 740 02$aDat
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490 1 $aMcGraw-Hill's AccessEnginee
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740 02$aInternally ground parts. 74
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process variations -- ch. 9. Procur
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245 10$aElectrical engineer's porta
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300 $a1 electronic text :$bill. 490
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500 $aPrint version c2006. 504 $aIn
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700 1 $aErickson, Calvin. 700 1 $aR
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700 1 $aMalmodin, Jens. 700 1 $aTra
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Page 265: 650 0$aIntegrated circuits. 650 0$a
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700 1 $aCarlson, C. L. 700 1 $aKiss
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740 02$aManaging the global design
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504 $aIncludes bibliographical refe
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530 $aAlso issued in print and PDF
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050 4$aTP157$b.L475 2008 082 04$a62
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740 02$aIntroduction to solar power
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504 $aIncludes bibliographical refe
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