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uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

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analysis of components -- ch. 19. Semiconductors -- ch. 20. Power and high-voltage<br />

considerations.<br />

650 0$aElectronic apparatus and appliances$xReliability.<br />

650 0$aSystem failures (Engineering)<br />

650 0$aMicroelectronics.<br />

650 0$aSemiconductors.<br />

650 0$aAcoustic imaging.<br />

650 0$aInfrared photography.<br />

650 0$aElectron microscopy.<br />

650 0$aX-ray microscopy.<br />

650 0$aMetallography.<br />

650 0$aSemiconductors$xDefects.<br />

650 0$aSolder and soldering.<br />

650 0$aPrinted circuits.<br />

650 0$aElectronic apparatus and appliances$xDefects.<br />

650 0$aElectronics$xMaterials$xDefects.<br />

655 0$aElectronic books.<br />

655 0$aInternet resources.<br />

700 1 $aDylls, D. David.<br />

700 1 $aMedora, Noshirwan K.<br />

700 1 $aLe May, Ian.<br />

700 1 $aLudwig, Lawrence L.<br />

700 1 $aKaplan, Herbert.<br />

700 1 $aKessler, L. W.<br />

700 1 $aSemmens, J. E.<br />

700 1 $aRoche, David J.<br />

700 1 $aErickson, J. J.<br />

700 1 $aDevaney, John R.<br />

700 1 $aVan Westerhuyzen, Dennis H.<br />

700 1 $aVettraino, L. G.<br />

700 1 $aBlanchard, Richard A.<br />

700 1 $aGaller, Donald.<br />

700 1 $aGlover, Duncan.<br />

700 1 $aKusko, Alexander.<br />

700 1 $aLoud, John D.<br />

700 1 $aMimmack, Gregory J.<br />

700 1 $aSlenski, George.<br />

700 1 $aDenson, William.<br />

700 1 $aMuller, Gunter.<br />

700 1 $aDunbar, William G.<br />

740 02$aIntroduction to electronic failure analysis.<br />

740 02$aOverview of electronic systems reliability.<br />

740 02$aProduct liability.<br />

740 02$aPhotography and optical microscopy.<br />

740 02$aX-ray/radiographic component inspection.<br />

740 02$aInfrared thermography.<br />

740 02$aAcoustic micro imaging failure analysis of electronic devices.<br />

740 02$aMetallography.<br />

740 02$aChemical characterization.<br />

740 02$aElectronic and electrical characterization.<br />

740 02$aScanning electron microscopy and x-ray analysis.<br />

740 02$aMiscellaneous techniques.<br />

740 02$aSolder joints.<br />

740 02$aFailure analysis of printed wiring assemblies.<br />

740 02$aWires and cables.<br />

740 02$aSwitches and relays.<br />

740 02$aConnection technology.<br />

740 02$aSemiconductors.<br />

740 02$aPower and high-voltage considerations.<br />

830 0$a<strong>McGraw</strong>-<strong>Hill</strong>'s AccessEngineering.<br />

856 40$uhttp://access<strong>eng</strong>ineeringlibrary.com/browse/electronic-failure-analysis-handbook-techniquesand-applications-for-electronic-and-electrical-packages-components-andassemblies$zSubscription<br />

required<br />

949 $aTK 7870.23 .M37$wLC$c1$i214210-2<strong>001</strong>$d12/30/2011$lMAIN$mMGH$q8$rY$sY$tWEB$u4/23/2007$xENG<br />

997 $a(c)2007 Cassidy Cataloguing Services, Inc.

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