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740 02$aComputer architecture. 740 02$aMicroarchitecture. 740 02$aLogic design. 740 02$aCircuit design. 740 02$aLayout. 740 02$aSemiconductor manufacturing. 740 02$aMicroprocessor packaging. 740 02$aSilicon debug and test. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/microprocessor-design-a-practical-guide-fromdesign-planning-to-manufacturing$zSubscription required 949 $aQA 76.5 .M528$wLC$c1$i213936-2001$d12/30/2011$lMAIN$mMGH$q13$rY$sY$tWEB$u4/25/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 02801cam 2200649 a 4500 001 ccn00213937 006 m f d 007 cr cn ---uuauu 008 070425s2001 nyua fobf 001 0 eng d 010 $z 2001030752 020 $a0071455795 020 $z0071363270 (print) 035 $a(Sirsi) a213937 050 4$aTK7874$b.L31684 2001 082 04$a621.381/046$221 100 1 $aLau, John H. 245 10$aMicrovias : for low-cost, high-density interconnects$h[electronic resource] /$cJohn H. Lau, S.W. Ricky Lee. 260 $aNew York :$bMcGraw-Hill,$c[2001] 300 $a1 electronic text (xxiii, 565 p.) :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 25, 2007. 500 $aPrint version c2001. 504 $aIncludes bibliographic references and index. 505 0 $uhttp://www.loc.gov/catdir/toc/mh031/2001030752.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/bios/mh041/2001030752.html 650 0$aMicroelectronic packaging. 650 0$aMultichip modules (Microelectronics) 650 0$aFlip chip technology. 650 0$aPrinted circuits. 650 0$aDrilling and boring. 650 0$aMicro-drilling. 650 0$aMicroelectronics$xMaterials. 650 0$aSolder and soldering. 650 0$aSolder and soldering$xTesting. 650 0$aMicroelectronics packaging$xReliability. 650 0$aMultichip modules (Microelectronics)$xTesting. 650 0$aIntegrated circuits$xDesign and construction$xCost control. 650 0$aSemiconductors$xJunctions. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aLee, S. W. Ricky. 740 02$aIntroduction to microvia and WLCSP technologies. 740 02$aConventional printed circuit board technologies. 740 02$aMicrovias by mechanical drilling. 740 02$aMicrovias by laser drilling. 740 02$aMicrovias by photoimaging. 740 02$aConductive paste/ink-filled microvias. 740 02$aSpecial high-density interconnects for flip chip applications. 740 02$aSolders for next-generation high-density interconnects. 740 02$aSolder-bumped flip chip WLCSP. 740 02$aAssembly of flip chip on PCB/substrate. 740 02$aSolder joint reliability of flip chip on microvia PCB/substrate. 830 0$aMcGraw-Hill's AccessEngineering.
856 40$uhttp://accessengineeringlibrary.com/browse/microvias-for-low-cost-high-densityinterconnects$zSubscription required 949 $aTK 7874 .L31684$wLC$c1$i213937-2001$d12/30/2011$lMAIN$mMGH$q10$rY$sY$tWEB$u4/25/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 03413cam 2200961 a 4500 001 ccn00213938 006 m f d 007 cr cn ---uuauu 008 070426s2000 nyua obf 001 0 eng d 010 $z 99056522 020 $a007144923x 020 $z0070267146 (print) 035 $a(Sirsi) a213938 050 4$aTA455.P5$bM62 2000 082 04$a668.4$221 245 00$aModern plastics handbook$h[electronic resource] /$cCharles A. Harper, editor in chief. 246 30$aModern plastics 260 $aNew York :$bMcGraw-Hill,$c[2000] 300 $a1 electronic text :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 26, 2007. 500 $aPrint version c2000. 504 $aIncludes bibliographical references and index. 505 0 $uhttp://www.loc.gov/catdir/toc/mh023/99056522.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/bios/mh041/99056522.html 650 0$aPlastics. 650 0$aThermoplastics. 650 0$aThermosetting plastics. 650 0$aReinforced plastics. 650 0$aPolymeric composites. 650 0$aElastomers. 650 0$aPlastics$xAdditives. 650 0$aEngineering instruments. 650 0$aComputer-aided engineering. 650 0$aCAD/CAM systems. 650 0$aComputer-aided design. 650 0$aPlastics industry and trade$xEquipment and supplies. 650 0$aPlastics$xSurfaces. 650 0$aPlastics$xBonding. 650 0$aPlastics$xFinishing. 650 0$aPlastic coatings. 650 0$aPlastics$xRecycling. 650 0$aPlastics$xTesting. 650 0$aBiodegradable plastics. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aHarper, Charles A. 700 1 $aBaker, A.-M. M. 700 1 $aMead, Joey. 700 1 $aWright, Ralph E. 700 1 $aMargolis, James M. 700 1 $aKattas, Lou. 700 1 $aGastrock, Fred. 700 1 $aLevin, Inessa. 700 1 $aCacciatore, Allison. 700 1 $aBarry, Carol M. F. 700 1 $aOrroth, Stephen A. 700 1 $aHull, John L. 700 1 $aLukaszyk, William R. 700 1 $aStoughton, Peter. 700 1 $aKennedy, Peter. 700 1 $aRotheiser, Jordan I. 700 1 $aPetrie, Edward M. 700 1 $aIzzo, Carl P.
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740 02$aHeat recovery and reuse. 74
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007 cr cn ---uuauu 008 100211s2009
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700 1 $aFine, Daniel H. 700 1 $aDod
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740 02$aOptofluidic colloidal photo
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035 $a(Sirsi) a303067 050 4$aTP355$
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740 02$aDesign of connections for a
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000 04720cam 2201093 a 4500 001 ccn
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740 02$aBio- MEMS packaging. 740 02
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650 0$aExperimental design. 655 0$a
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740 02$aHeavy metal removal. 740 02
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740 02$aRadiometry, wave optics, an
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006 m f d 007 cr cn ---uuauu 008 10
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530 $aAlso issued in print and PDF
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700 1 $aWolfe, William L. 700 1 $aZ
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700 1 $aKlein, Marvin. 700 1 $aHaga
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740 02$aTechniques of first-order l
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740 02$aX-ray mirror metrology. 740
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740 02$aOverview of the emerging co
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700 1 $aReddy, T. Agami. 700 1 $aSt
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245 00$aForensic structural enginee
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300 $a1 electronic text (xv, 448 p.
Page 45 and 46:
245 00$aStem cell technologies$h[el
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050 4$aTK1056$b.P48 2010 082 04$a62
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010 $z 2010287045 020 $z97800717010
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830 0$aMcGraw-Hill's AccessEngineer
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300 $a1 electronic text (xvii, 488
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949 $aHD 1390 .H67$wLC$c1$i316581-1
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655 0$aInternet resources. 710 2 $a
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655 0$aElectronic books. 655 0$aInt
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000 01910cam 2200505 a 4500 001 ccn
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740 02$aSlope stability. 740 02$aRe
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100 1 $aWang, Linbing,$d1963- 245 1
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007 cr cn ---uuauu 008 110415s2011
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650 0$aBattery industry. 650 0$aSpa
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655 0$aInternet resources. 740 02$a
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740 02$aThrough-silicon-via (TSV) i
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007 cr cn ---uuauu 008 110714s2011
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high-power laser sources as well as
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505 0 $aPart I. Disassembly backgro
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700 1 $aEvett, Jack B.,$d1942- 700
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650 0$aBiomedical engineering. 650
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245 10$aSchaums outlines signals an
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650 0$aSystems engineering. 650 0$a
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650 0$aElectric displacement$vOutli
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650 0$aStructural frames$vOutlines,
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949 $aQA 303 .A96 2009$wLC$c1$i3374
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000 02788cam 2200625 a 4500 001 ccn
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740 02$aIntroduction to statistical
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740 02$aRequirements engineering ar
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740 02$aAlternating-current circuit
Page 105 and 106:
997 $a(c)2012 Cassidy Cataloguing S
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035 $a(Sirsi) a345656 050 4$aQD257$
Page 109 and 110:
650 0$aComputer software$xQuality c
Page 111 and 112:
490 1 $aMcGraw-Hill's AccessEnginee
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740 02$aWireless communications. 74
Page 115 and 116:
650 0$aBall grid array technology.
Page 117 and 118:
740 02$aFundamentals of soil and wa
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001 ccn00213537 006 m f d 007 cr cn
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740 02$aMeasuring system performanc
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650 0$aSurveying$vTables. 650 0$aMa
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700 1 $aCunningham, Michael J. 700
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020 $z9780071544528 (print) 035 $a(
Page 129 and 130:
650 0$aBuilding sites$xPower supply
Page 131 and 132:
740 02$aNetwork models. 740 02$aDat
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490 1 $aMcGraw-Hill's AccessEnginee
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740 02$aInternally ground parts. 74
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process variations -- ch. 9. Procur
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245 10$aElectrical engineer's porta
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300 $a1 electronic text :$bill. 490
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500 $aPrint version c2006. 504 $aIn
Page 145 and 146:
700 1 $aErickson, Calvin. 700 1 $aR
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007 cr cn ---uuauu 008 070424s2003
Page 149 and 150:
650 0$aElectric connectors. 650 0$a
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650 0$aWater chemistry. 650 0$aComp
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740 02$aThinking globally--the comp
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650 0$aStructural dynamics. 650 0$a
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700 1 $aMalmodin, Jens. 700 1 $aTra
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650 0$aEarthquakes$xSafety measures
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740 02$aBrief insight of project ma
Page 165 and 166:
655 0$aInternet resources. 740 02$a
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500 $aPrint version c2003. 500 $aRe
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650 0$aPower-plants$xEquipment and
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000 03994cam 2201177 a 4500 001 ccn
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650 0$aSealing compounds$xTesting.
Page 175 and 176: 740 02$aCost engineering. 740 02$aO
Page 177 and 178: 740 02$aUOP thermal hydrodealkylati
Page 179 and 180: 010 $z 2002511505 020 $a0071449493
Page 181 and 182: 700 1 $aTheisen, Hilary. 700 1 $aSp
Page 183 and 184: 700 1 $aDenney, Richard W., Jr. 700
Page 185 and 186: 700 1 $aDearth, David R. 700 1 $aKe
Page 187 and 188: 650 0$aHorizontal oil well drilling
Page 189 and 190: 020 $z9780071622974 (print) 020 $a0
Page 191 and 192: 740 02$aHydraulics of open channel
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Page 195 and 196: 740 02$aHVAC subsystems. 740 02$aAi
Page 197 and 198: 035 $a(Sirsi) a213700 050 4$aTP492$
Page 199 and 200: 740 02$aQuantum well infrared photo
Page 201 and 202: 700 1 $aFarquhar, Edward A. 700 1 $
Page 203 and 204: 500 $aPrint version c2003. 504 $aIn
Page 205 and 206: 740 02$aStep-by-step overviews of o
Page 207 and 208: 650 0$aMetal-cutting. 650 0$aTurnin
Page 209 and 210: 740 02$aAdaptive control. 740 02$aO
Page 211 and 212: 650 0$aMasonry. 650 0$aMasonry$xHis
Page 213 and 214: 650 0$aEngineering design$xData pro
Page 215 and 216: 700 1 $aDavic, Nicholas D. 700 1 $a
Page 217 and 218: 740 02$aCase study : staffing a new
Page 219 and 220: 650 0$aMetals$xFinishing. 650 0$aSt
Page 221 and 222: 740 02$aDigital control systems. 74
Page 223 and 224: 740 02$aIndustrial robots. 740 02$a
Page 225: 655 0$aInternet resources. 740 02$a
Page 229 and 230: 650 0$aBackhoes. 650 0$aConveying m
Page 231 and 232: 655 0$aElectronic books. 655 0$aInt
Page 233 and 234: 655 0$aInternet resources. 700 1 $a
Page 235 and 236: 700 1 $aFan, Timothy. 700 1 $aKaise
Page 237 and 238: 740 02$aEquipment for distillation,
Page 239 and 240: 035 $a(Sirsi) a214000 050 4$aTA1520
Page 241 and 242: 700 1 $aBritton, Gordon. 700 1 $aDe
Page 243 and 244: 650 0$aPlastics$xChemical resistanc
Page 245 and 246: 300 $a1 electronic text :$bill. 490
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Page 251 and 252: 650 0$aMicroelectronic packaging. 6
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Page 255 and 256: 700 1 $aKaiser, David A. 700 1 $aKe
Page 257 and 258: 545 0 $aContributor biographical in
Page 259 and 260: 700 1 $aBoyadjis, Paul A. 700 1 $aC
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Page 263 and 264: 655 0$aInternet resources. 700 1 $a
Page 265 and 266: 650 0$aIntegrated circuits. 650 0$a
Page 267 and 268: 700 1 $aRamdani, Jamal. 700 1 $aVac
Page 269 and 270: 740 02$aSignaling transport (SIGTRA
Page 271 and 272: 082 04$a621.382$221 245 00$aSpread
Page 273 and 274: 700 1 $aMalyszek, Jeffrey D. 740 02
Page 275 and 276: 740 02$aSpectral changes and linear
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700 1 $aChang, Hsun-Hsien. 700 1 $a
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505 0 $aFrequency bands, propagatio
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740 02$aSpectrum analysis. 740 02$a
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650 0$aPhase modulation. 650 0$aRad
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700 1 $aLebron, Ramon C. 700 1 $aCr
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740 02$aSubstitution and analog mea
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245 00$aStandard handbook of machin
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830 0$aMcGraw-Hill's AccessEngineer
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710 2 $aEnvirex Products. 710 2 $aS
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020 $z0071354719 (print) 035 $a(Sir
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650 0$aBuilding laws$zUnited States
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650 0$aLasers$xHistory. 650 0$aOpti
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997 $a(c)2007 Cassidy Cataloguing S
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008 070430s2003 nyua fobf 001 0 eng
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650 0$aLanduse, Urban. 650 0$aHuman
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588 $aDescription based on cover im
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650 0$aWater-supply$xSecurity measu
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650 0$aAbstract data types (Compute
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588 $aDescription based on cover im
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545 0 $aContributor biographical in
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949 $aTK 6570 .M6 L375$wLC$c1$i2141
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035 $a(Sirsi) a214198 050 4$aTA666$
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analysis of components -- ch. 19. S
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700 1 $aCarlson, C. L. 700 1 $aKiss
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949 $aTJ 151 .M37$wLC$c1$i214215-20
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740 02$aPrinciples of color vision.
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700 1 $aSoni, M. P. 700 1 $aPatel,
Page 331 and 332:
650 0$aElectric wiring, Interior. 6
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000 07168cam 22020771a 4500 001 ccn
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740 02$aUltra wideband arrays. 740
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740 02$aArrays of folded unipoles.
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020 $z0071470751 (print) 020 $z9780
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740 02$aIdentification of ageing pr
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655 0$aInternet resources. 700 1 $a
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740 02$aRecognizing the forms of co
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700 1 $aTaylor, Tim. 700 1 $aMarch,
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740 02$aManaging the global design
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504 $aIncludes bibliographical refe
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020 $z0071548661 (print) 020 $a0071
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740 02$aRigid pipe products. 740 02
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740 02$aAlignment of a pair of sequ
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530 $aAlso issued in print and PDF
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050 4$aTP157$b.L475 2008 082 04$a62
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740 02$aIntroduction to solar power
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504 $aIncludes bibliographical refe
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245 10$aSolid waste analysis and mi
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700 1 $aKim, Y. Richard. 700 1 $aBa
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000 02966cam 2200685 a 4500 001 ccn
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700 1 $aWaite, Gabi Nindl. 700 1 $a
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