uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

010 $z 2003046353
020 $z0071402144 (print)
020 $a0071450297
035 $a(Sirsi) a213578
050 4$aTK7836$b.E4654 2003
082 04$a621.381$221
245 00$aElectronic materials and processes handbook$h[electronic resource] /$cCharles A. Harper,
editor in chief.
250 $a3rd ed.
260 $aNew York :$bMcGraw-Hill,$c[2003]
300 $a1 electronic text :$bill.
490 1 $aMcGraw-Hill's AccessEngineering
588 $aDescription based on cover image and table of contents, viewed on April 24, 2007.
530 $aAlso issued in print and PDF version.
500 $aPrint version c2003.
504 $aIncludes bibliographical references and index.
545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/bios/mh041/2003046353.html
505 0 $uhttp://www.loc.gov/catdir/toc/mh031/2003046353.html
650 0$aElectronics$xMaterials.
650 0$aElectronic apparatus and appliances$xMaterials.
650 0$aIntegrated circuits$xDesign and construction.
650 0$aMicroelectronics.
650 0$aIntegrated circuits$xMaterials.
650 0$aElectronic ceramics.
650 0$aElectronic packaging.
650 0$aMicroelectronic packaging.
650 0$aPrinted circuits.
650 0$aElectric insulators and insulation$xPlastics.
650 0$aAdhesives.
650 0$aSolder and soldering.
650 0$aElectronic apparatus and appliances$xTemperature control.
655 0$aElectronic books.
655 0$aInternet resources.
700 1 $aHarper, Charles A.
700 1 $aCohn, Charles.
700 1 $aSchoch, Karl F.
700 1 $aBailey, Alan E.
700 1 $aGardner, J. Donald.
700 1 $aHwang, Jennie S.
700 1 $aMcChesney, Mike.
700 1 $aCarano, Michael.
700 1 $aFjelstad, Joseph.
700 1 $aSergent, Jerry E.
700 1 $aToleno, Brian J.
700 1 $aBurns, Barry.
700 1 $aMarinelli, Christy.
700 1 $aKrum, Al.
740 02$aDevelopment and fabrication of IC chips.
740 02$aPlastics, elastomers, and composites.
740 02$aCeramics and glasses.
740 02$aMetals.
740 02$aSolder technologies for electronic packaging and assembly.
740 02$aElectroplating and deposited metallic coatings.
740 02$aPrinted circuit board fabrication.
740 02$aMaterials and processes for hybrid microelectronics and multichip modules.
740 02$aAdhesives, underfills, and coatings in electonics assemblies.
740 02$aThermal management materials and systems.
830 0$aMcGraw-Hill's AccessEngineering.
856 40$uhttp://accessengineeringlibrary.com/browse/electronic-materials-and-processes-handbookthird-edition$zSubscription
required
949 $aTK 7836 .E4654$wLC$c1$i213578-2001$d12/30/2011$lMAIN$mMGH$q7$rY$sY$tWEB$u4/24/2007$xENG
997 $a(c)2007 Cassidy Cataloguing Services, Inc.
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001 ccn00213579
006 m f d