uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

740 02$aComputer architecture.
740 02$aMicroarchitecture.
740 02$aLogic design.
740 02$aCircuit design.
740 02$aLayout.
740 02$aSemiconductor manufacturing.
740 02$aMicroprocessor packaging.
740 02$aSilicon debug and test.
830 0$aMcGraw-Hill's AccessEngineering.
856 40$uhttp://accessengineeringlibrary.com/browse/microprocessor-design-a-practical-guide-fromdesign-planning-to-manufacturing$zSubscription
required
949 $aQA 76.5 .M528$wLC$c1$i213936-2001$d12/30/2011$lMAIN$mMGH$q13$rY$sY$tWEB$u4/25/2007$xENG
997 $a(c)2007 Cassidy Cataloguing Services, Inc.
000 02801cam 2200649 a 4500
001 ccn00213937
006 m f d
007 cr cn ---uuauu
008 070425s2001 nyua fobf 001 0 eng d
010 $z 2001030752
020 $a0071455795
020 $z0071363270 (print)
035 $a(Sirsi) a213937
050 4$aTK7874$b.L31684 2001
082 04$a621.381/046$221
100 1 $aLau, John H.
245 10$aMicrovias : for low-cost, high-density interconnects$h[electronic resource] /$cJohn H. Lau,
S.W. Ricky Lee.
260 $aNew York :$bMcGraw-Hill,$c[2001]
300 $a1 electronic text (xxiii, 565 p.) :$bill.
490 1 $aMcGraw-Hill's AccessEngineering
588 $aDescription based on cover image and table of contents, viewed on April 25, 2007.
500 $aPrint version c2001.
504 $aIncludes bibliographic references and index.
505 0 $uhttp://www.loc.gov/catdir/toc/mh031/2001030752.html
530 $aAlso issued in print and PDF version.
545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/bios/mh041/2001030752.html
650 0$aMicroelectronic packaging.
650 0$aMultichip modules (Microelectronics)
650 0$aFlip chip technology.
650 0$aPrinted circuits.
650 0$aDrilling and boring.
650 0$aMicro-drilling.
650 0$aMicroelectronics$xMaterials.
650 0$aSolder and soldering.
650 0$aSolder and soldering$xTesting.
650 0$aMicroelectronics packaging$xReliability.
650 0$aMultichip modules (Microelectronics)$xTesting.
650 0$aIntegrated circuits$xDesign and construction$xCost control.
650 0$aSemiconductors$xJunctions.
655 0$aElectronic books.
655 0$aInternet resources.
700 1 $aLee, S. W. Ricky.
740 02$aIntroduction to microvia and WLCSP technologies.
740 02$aConventional printed circuit board technologies.
740 02$aMicrovias by mechanical drilling.
740 02$aMicrovias by laser drilling.
740 02$aMicrovias by photoimaging.
740 02$aConductive paste/ink-filled microvias.
740 02$aSpecial high-density interconnects for flip chip applications.
740 02$aSolders for next-generation high-density interconnects.
740 02$aSolder-bumped flip chip WLCSP.
740 02$aAssembly of flip chip on PCB/substrate.
740 02$aSolder joint reliability of flip chip on microvia PCB/substrate.
830 0$aMcGraw-Hill's AccessEngineering.