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650 0$aIntegrated circuits. 650 0$aIntegrated circuits industry. 650 0$aPassive components. 650 0$aIntegrated passive components. 650 0$aOptoelectronics. 650 0$aRadio frequency integrated circuits. 650 0$aMicroelectromechanical systems. 650 0$aSealing (Technology) 650 0$aMiniature electronic equipment (Bonding) 650 0$aElectronic apparatus and appliances$xPlastic embedment. 650 0$aElectronics$xMaterials$xSurfaces. 650 0$aSemiconductors$xSurfaces. 650 0$aPrinted circuits$xDesign and construction. 650 0$aSurface mount technology. 650 0$aElectronic packaging$xMaterials. 650 0$aMicroelectronic packaging$xMaterials. 650 0$aElectronics$xTesting. 650 0$aMicroelectronics$xTesting. 650 0$aMicroelectronics$xDesign. 650 0$aElectronic apparatus and appliances$xReliability. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aTummala, Rao R.,$d1942- 700 1 $aMorris, James E. 700 1 $aDavidson, Evan. 700 1 $aSarma, D. H. R. 700 1 $aHubbard, Bob. 700 1 $aRao, N. J. 700 1 $aSwaminathan, Madhavan. 700 1 $aPeterson, Andrew F. 700 1 $aKim, Juongho. 700 1 $aSitaraman, Suresh K. 700 1 $aPang, John H. L. 700 1 $aBar-Cohen, Avram. 700 1 $aWatwe, Abhay. 700 1 $aSeetharamu, Kankanhally N. 700 1 $aKamath, Sundar M. 700 1 $aCharles, Harry K. 700 1 $aBaldwin, David F. 700 1 $aGarrou, Phil. 700 1 $aPrymak, John. 700 1 $aBhattacharya, Swapan. 700 1 $aPaik, Kyung. 700 1 $aCruz Rivera, Jose L. 700 1 $aGaylord, Thomas K. 700 1 $aGlytsis, Elias N. 700 1 $aLaskar, Joy. 700 1 $aTentzeris, Emmanouil M. 700 1 $aSchutt-Aine, Jose E. 700 1 $aRamesham, Rajeshuni. 700 1 $aGhaffarian, Reza. 700 1 $aAyazi, Farrokh. 700 1 $aWong, C. P. 700 1 $aFang, Treliant. 700 1 $aVaradarajan, Mahesh. 700 1 $aIllyefalvi-Vitez, Zsolt. 700 1 $aZImmermann, Joachim. 700 1 $aMattsson, Fredrik. 700 1 $aKandelid, Stefan. 700 1 $aRaj, Pulugurtha Markondeya. 700 1 $aLiu, Johan. 700 1 $aOhlckers, Per. 700 1 $aKeezer, David. 700 1 $aKim, Bruce. 700 1 $aKoppolu, Sasidhar. 700 1 $aMay, Gary S. 700 1 $aShinotani, Ken-ichi.
700 1 $aMalmodin, Jens. 700 1 $aTrankell, Richard. 700 1 $aQu, Jianmin. 700 1 $aGuo, Yifan. 740 02$aIntroduction to microsystems packaging. 740 02$aRole of packaging in microelectronics. 740 02$aRole of packaging in microsystems. 740 02$aFundamentals of electrical package design. 740 02$aFundamentals of design for reliability. 740 02$aFundamentals of thermal management. 740 02$aFundamentals of single chip packaging. 740 02$aFundamentals of multichip packaging. 740 02$aFundamentals of IC assembly. 740 02$aFundamentals of wafer-level packaging. 740 02$aFundamentals of passives : discrete, integrated, and embedded. 740 02$aFundamentals of optoelectronics. 740 02$aFundamentals of RF packaging. 740 02$aFundamentals of microelectromechanical systems. 740 02$aFundamentals of sealing and encapsulation. 740 02$aFundamentals of system-level PWB technologies. 740 02$aFundamentals of board assembly. 740 02$aFundamentals of packaging materials and processes. 740 02$aFundamentals of electrical testing. 740 02$aFundamentals of package manufacturing. 740 02$aFundamentals of microsystems design for environment. 740 02$aFundamentals of microsystems reliability. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/fundamentals-of-microsystemspackaging$zSubscription required 949 $aTK 7870.15 .F86$wLC$c1$i213593-2001$d12/30/2011$lMAIN$mMGH$q7$rY$sY$tWEB$u4/26/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 02546cam 2200661 a 4500 001 ccn00213594 006 m f d 007 cr cn ---uuauu 008 070426s2006 nyua fof 001 0 eng d 010 $z 2006043815 020 $z0071460705 (print) 020 $z9780071460705 (print) 020 $a0071484256 035 $a(Sirsi) a213594 050 4$aT357$b.C64 2006 082 04$a620/.0042$222 100 1 $aCogorno, Gene R. 245 10$aGeometric dimensioning and tolerancing for mechanical design$h[electronic resource] /$cGene R. Cogorno. 260 $aNew York :$bMcGraw-Hill,$c[2006] 300 $a1 electronic text (xi, 255 p.) :$bill. 490 1 $aMcGraw-Hill mechanical engineering 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 26, 2007. 530 $aAlso issued in print and PDF version. 500 $aPrint version c2006. 500 $aIncludes index. 545 0 $aContributor biographical information:$uhttp://www.loc.gov/catdir/enhancements/fy0634/2006043815-b.html 505 0 $uhttp://www.loc.gov/catdir/enhancements/fy0634/2006043815-t.html 650 0$aEngineering drawings$xDimensioning. 650 0$aTolerance (Engineering) 650 0$aMachine design. 650 0$aMechanical engineering. 650 0$aMechanical engineering$vTerminology. 650 0$aMechanical movements. 650 0$aSymmetry. 650 0$aGearing$xVibration.
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740 02$aHeat recovery and reuse. 74
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700 1 $aFine, Daniel H. 700 1 $aDod
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740 02$aOptofluidic colloidal photo
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035 $a(Sirsi) a303067 050 4$aTP355$
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740 02$aDesign of connections for a
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740 02$aBio- MEMS packaging. 740 02
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650 0$aExperimental design. 655 0$a
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740 02$aHeavy metal removal. 740 02
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740 02$aRadiometry, wave optics, an
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530 $aAlso issued in print and PDF
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700 1 $aWolfe, William L. 700 1 $aZ
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700 1 $aKlein, Marvin. 700 1 $aHaga
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740 02$aTechniques of first-order l
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740 02$aX-ray mirror metrology. 740
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740 02$aOverview of the emerging co
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700 1 $aReddy, T. Agami. 700 1 $aSt
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245 00$aForensic structural enginee
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300 $a1 electronic text (xv, 448 p.
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245 00$aStem cell technologies$h[el
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050 4$aTK1056$b.P48 2010 082 04$a62
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010 $z 2010287045 020 $z97800717010
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830 0$aMcGraw-Hill's AccessEngineer
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300 $a1 electronic text (xvii, 488
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949 $aHD 1390 .H67$wLC$c1$i316581-1
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655 0$aInternet resources. 710 2 $a
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655 0$aElectronic books. 655 0$aInt
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740 02$aSlope stability. 740 02$aRe
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100 1 $aWang, Linbing,$d1963- 245 1
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650 0$aBattery industry. 650 0$aSpa
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high-power laser sources as well as
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505 0 $aPart I. Disassembly backgro
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700 1 $aEvett, Jack B.,$d1942- 700
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650 0$aBiomedical engineering. 650
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245 10$aSchaums outlines signals an
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650 0$aSystems engineering. 650 0$a
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650 0$aElectric displacement$vOutli
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650 0$aStructural frames$vOutlines,
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740 02$aIntroduction to statistical
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740 02$aRequirements engineering ar
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740 02$aAlternating-current circuit
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997 $a(c)2012 Cassidy Cataloguing S
Page 107 and 108: 035 $a(Sirsi) a345656 050 4$aQD257$
Page 109 and 110: 650 0$aComputer software$xQuality c
Page 111 and 112: 490 1 $aMcGraw-Hill's AccessEnginee
Page 113 and 114: 740 02$aWireless communications. 74
Page 115 and 116: 650 0$aBall grid array technology.
Page 117 and 118: 740 02$aFundamentals of soil and wa
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Page 121 and 122: 740 02$aMeasuring system performanc
Page 123 and 124: 650 0$aSurveying$vTables. 650 0$aMa
Page 125 and 126: 700 1 $aCunningham, Michael J. 700
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Page 129 and 130: 650 0$aBuilding sites$xPower supply
Page 131 and 132: 740 02$aNetwork models. 740 02$aDat
Page 133 and 134: 490 1 $aMcGraw-Hill's AccessEnginee
Page 135 and 136: 740 02$aInternally ground parts. 74
Page 137 and 138: process variations -- ch. 9. Procur
Page 139 and 140: 245 10$aElectrical engineer's porta
Page 141 and 142: 300 $a1 electronic text :$bill. 490
Page 143 and 144: 500 $aPrint version c2006. 504 $aIn
Page 145 and 146: 700 1 $aErickson, Calvin. 700 1 $aR
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Page 149 and 150: 650 0$aElectric connectors. 650 0$a
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Page 155 and 156: 740 02$aThinking globally--the comp
Page 157: 650 0$aStructural dynamics. 650 0$a
Page 161 and 162: 650 0$aEarthquakes$xSafety measures
Page 163 and 164: 740 02$aBrief insight of project ma
Page 165 and 166: 655 0$aInternet resources. 740 02$a
Page 167 and 168: 500 $aPrint version c2003. 500 $aRe
Page 169 and 170: 650 0$aPower-plants$xEquipment and
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Page 175 and 176: 740 02$aCost engineering. 740 02$aO
Page 177 and 178: 740 02$aUOP thermal hydrodealkylati
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Page 183 and 184: 700 1 $aDenney, Richard W., Jr. 700
Page 185 and 186: 700 1 $aDearth, David R. 700 1 $aKe
Page 187 and 188: 650 0$aHorizontal oil well drilling
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740 02$aCase study : staffing a new
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740 02$aEquipment for distillation,
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700 1 $aBritton, Gordon. 700 1 $aDe
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650 0$aPlastics$xChemical resistanc
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300 $a1 electronic text :$bill. 490
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650 0$aMicroelectronic packaging. 6
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700 1 $aKaiser, David A. 700 1 $aKe
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650 0$aIntegrated circuits. 650 0$a
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740 02$aSignaling transport (SIGTRA
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082 04$a621.382$221 245 00$aSpread
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700 1 $aMalyszek, Jeffrey D. 740 02
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740 02$aSpectral changes and linear
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700 1 $aChang, Hsun-Hsien. 700 1 $a
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505 0 $aFrequency bands, propagatio
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740 02$aSpectrum analysis. 740 02$a
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650 0$aPhase modulation. 650 0$aRad
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740 02$aSubstitution and analog mea
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245 00$aStandard handbook of machin
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830 0$aMcGraw-Hill's AccessEngineer
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710 2 $aEnvirex Products. 710 2 $aS
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588 $aDescription based on cover im
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545 0 $aContributor biographical in
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700 1 $aCarlson, C. L. 700 1 $aKiss
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650 0$aElectric wiring, Interior. 6
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740 02$aIdentification of ageing pr
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700 1 $aTaylor, Tim. 700 1 $aMarch,
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740 02$aManaging the global design
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504 $aIncludes bibliographical refe
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530 $aAlso issued in print and PDF
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050 4$aTP157$b.L475 2008 082 04$a62
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740 02$aIntroduction to solar power
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