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740 02$aArea array solder spheres, pastes, and fluxes. 740 02$aModern solder and solder paste. 740 02$aLead-free systems and process implications. 740 02$aElectrically conductive adhesives for surfacemount and flip chip processes: an alternative to solder? 740 02$aNext-generation flip chip materials and processing. 740 02$aFlip chip assembly and underfilling. 740 02$aBGA and CSP rework: what is involved? 740 02$aBGA assembly reliability. 740 02$aDie attach and rework. 740 02$aLiquid encapsulation equipment and processes. 740 02$aMolding for area array packages. 740 02$aScreen printing and stenciling. 740 02$aCriteria for placement and processing of advanced packages. 740 02$aOvens in electronics. 740 02$aProcess development, control, and optimization. 740 02$aMetrics : the key to productivity. 740 02$aCost estimating for electronic assembly. 740 42$aThe future of electronic packaging. 740 42$aThe future of SMT process equipment. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/area-array-packaging-handbook-manufacturing-andassembly$zSubscription required 949 $aTK 7870.15 .G54$wLC$c1$i213532-2001$d12/28/2011$lMAIN$mMGH$q7$rY$sY$tWEB$u4/18/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 02392cam 2200577 a 4500 001 ccn00213533 006 m f d 007 cr cn ---uuauu 008 070418s2001 nyua fobf 001 0 eng d 010 $z 00053295 020 $a0071450351 020 $z0070471789 (print) 035 $a(Sirsi) a213533 050 4$aTD767$b.M37 2001 082 04$a628.3/64/0973$221 100 1 $aMcFarland, Michael J.,$d1958- 245 10$aBiosolids engineering$h[electronic resource] /$cMichael J. McFarland. 260 $aNew York :$bMcGraw-Hill,$c[2001] 300 $a1 electronic text :$bill. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 18, 2007. 500 $aPrint version c2001. 504 $aIncludes bibliographical references and index. 505 0 $uhttp://www.loc.gov/catdir/toc/mh021/00053295.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information$uhttp://www.loc.gov/catdir/bios/mh041/00053295.html 650 0$aSewage sludge$zUnited States$xManagement. 650 0$aOrganic wastes$xRecycling. 650 0$aOrganic wastes$xManagement. 650 0$aSewage sludge$xRecycling. 650 0$aSewage sludge$xAnalysis. 650 0$aOrganic wastes as soil amendments. 650 0$aSewage disposal$xGovernment policy. 650 0$aSewage disposal plants$xStandards. 650 0$aSewage$xPurification. 650 0$aSewage disposal plants$xDesign and construction. 650 0$aSoil moisture. 655 0$aElectronic books. 655 0$aInternet resources. 740 02$aBiosolids management practices and regulatory requirements. 740 02$aBiosolids characteristics and production rates. 740 02$aBiosolids and sludge processing. 740 02$aControl of biosolids quality. 740 02$aTransport, storage, and facilities design.
740 02$aFundamentals of soil and water interactions. 740 02$aBeneficial use of biosolids. 740 02$aSampling and quality assurance. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/biosolids-engineering$zSubscription required 949 $aTD 767 .M37$wLC$c1$i213533-2001$d12/28/2011$lMAIN$mMGH$q9$rY$sY$tWEB$u4/19/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 02020cam 2200517 a 4500 001 ccn00213534 006 m f d 007 cr cn ---uuauu 008 070419s2006 nyu fobf 001 0 eng d 010 $z 2006047315 020 $a0071490167 020 $z9780071459037 (print) 020 $z0071459030 (print) 035 $a(Sirsi) a213534 050 4$aTG300$b.T66 2006 082 04$a624.2$222 100 1 $aTonias, Demetrios E. 245 10$aBridge engineering$h[electronic resource] /$cDemetrios E. Tonias, Jim J. Zhao. 250 $a2nd ed. 260 $aNew York :$bMcGraw-Hill,$c[2006] 300 $a1 electronic text. 490 1 $aMcGraw-Hill's AccessEngineering 588 $aDescription based on cover image and table of contents, viewed on April 19, 2007. 500 $aPrint version c2006. 504 $aIncludes bibliographical references and index. 505 0 $uhttp://www.loc.gov/catdir/enhancements/fy0668/2006047315-t.html 530 $aAlso issued in print and PDF version. 545 0 $aContributor biographical information$uhttp://www.loc.gov/catdir/enhancements/fy0668/2006047315-b.html 650 0$aBridges$xDesign and construction. 650 0$aBridges$xMaintenance and repair. 650 0$aBridges$xPlanning. 650 0$aStructural engineering. 650 0$aBridges$xFoundations and piers$xDesign and construction. 650 0$aBridges$xMaintenance and repair$xManagement. 655 0$aElectronic books. 655 0$aInternet resources. 700 1 $aZhao, Jim J. 740 02$aStructure. 740 02$aProject inception. 740 02$aSuperstructure. 740 02$aSubstructure. 740 02$aImplementation & management. 830 0$aMcGraw-Hill's AccessEngineering. 856 40$uhttp://accessengineeringlibrary.com/browse/bridge-engineering-second-edition$zSubscription required 949 $aTG 300 .T66$wLC$c1$i213534-2001$d12/28/2011$lMAIN$mMGH$q8$rY$sY$tWEB$u4/19/2007$xENG 997 $a(c)2007 Cassidy Cataloguing Services, Inc. 000 03539cam 2200889 a 4500 001 ccn00213536 006 m f d 007 cr cn ---uuauu 008 070419s2000 nyua fob 001 0 eng d 010 $z 00274542 020 $a0071453539 020 $z0070527687 (print) 035 $a(Sirsi) a213536 043 $an-us---$an-us-il 050 4$aHD257.5$b.B76 1999 082 04$a363.739/66/0977311$221
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000 02558cam 2200625 a 4500 001 ccn
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740 02$aHeat recovery and reuse. 74
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007 cr cn ---uuauu 008 100211s2009
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700 1 $aFine, Daniel H. 700 1 $aDod
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740 02$aOptofluidic colloidal photo
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035 $a(Sirsi) a303067 050 4$aTP355$
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740 02$aDesign of connections for a
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000 04720cam 2201093 a 4500 001 ccn
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740 02$aBio- MEMS packaging. 740 02
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650 0$aExperimental design. 655 0$a
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740 02$aHeavy metal removal. 740 02
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740 02$aRadiometry, wave optics, an
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006 m f d 007 cr cn ---uuauu 008 10
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530 $aAlso issued in print and PDF
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700 1 $aWolfe, William L. 700 1 $aZ
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700 1 $aKlein, Marvin. 700 1 $aHaga
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740 02$aTechniques of first-order l
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740 02$aX-ray mirror metrology. 740
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740 02$aOverview of the emerging co
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700 1 $aReddy, T. Agami. 700 1 $aSt
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245 00$aForensic structural enginee
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300 $a1 electronic text (xv, 448 p.
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245 00$aStem cell technologies$h[el
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050 4$aTK1056$b.P48 2010 082 04$a62
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010 $z 2010287045 020 $z97800717010
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830 0$aMcGraw-Hill's AccessEngineer
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300 $a1 electronic text (xvii, 488
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949 $aHD 1390 .H67$wLC$c1$i316581-1
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655 0$aInternet resources. 710 2 $a
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655 0$aElectronic books. 655 0$aInt
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000 01910cam 2200505 a 4500 001 ccn
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740 02$aSlope stability. 740 02$aRe
Page 65 and 66: 100 1 $aWang, Linbing,$d1963- 245 1
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Page 69 and 70: 650 0$aBattery industry. 650 0$aSpa
Page 71 and 72: 655 0$aInternet resources. 740 02$a
Page 73 and 74: 740 02$aThrough-silicon-via (TSV) i
Page 77 and 78: high-power laser sources as well as
Page 79 and 80: 505 0 $aPart I. Disassembly backgro
Page 81 and 82: 700 1 $aEvett, Jack B.,$d1942- 700
Page 83 and 84: 650 0$aBiomedical engineering. 650
Page 85 and 86: 245 10$aSchaums outlines signals an
Page 87 and 88: 650 0$aSystems engineering. 650 0$a
Page 89 and 90: 650 0$aElectric displacement$vOutli
Page 91 and 92: 650 0$aStructural frames$vOutlines,
Page 93 and 94: 949 $aQA 303 .A96 2009$wLC$c1$i3374
Page 95 and 96: 655 0$aElectronic books. 655 0$aInt
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Page 99 and 100: 740 02$aIntroduction to statistical
Page 101 and 102: 740 02$aRequirements engineering ar
Page 103 and 104: 740 02$aAlternating-current circuit
Page 105 and 106: 997 $a(c)2012 Cassidy Cataloguing S
Page 107 and 108: 035 $a(Sirsi) a345656 050 4$aQD257$
Page 109 and 110: 650 0$aComputer software$xQuality c
Page 111 and 112: 490 1 $aMcGraw-Hill's AccessEnginee
Page 113 and 114: 740 02$aWireless communications. 74
Page 115: 650 0$aBall grid array technology.
Page 119 and 120: 001 ccn00213537 006 m f d 007 cr cn
Page 121 and 122: 740 02$aMeasuring system performanc
Page 123 and 124: 650 0$aSurveying$vTables. 650 0$aMa
Page 125 and 126: 700 1 $aCunningham, Michael J. 700
Page 127 and 128: 020 $z9780071544528 (print) 035 $a(
Page 129 and 130: 650 0$aBuilding sites$xPower supply
Page 131 and 132: 740 02$aNetwork models. 740 02$aDat
Page 133 and 134: 490 1 $aMcGraw-Hill's AccessEnginee
Page 135 and 136: 740 02$aInternally ground parts. 74
Page 137 and 138: process variations -- ch. 9. Procur
Page 139 and 140: 245 10$aElectrical engineer's porta
Page 141 and 142: 300 $a1 electronic text :$bill. 490
Page 143 and 144: 500 $aPrint version c2006. 504 $aIn
Page 145 and 146: 700 1 $aErickson, Calvin. 700 1 $aR
Page 149 and 150: 650 0$aElectric connectors. 650 0$a
Page 151 and 152: 650 0$aWater chemistry. 650 0$aComp
Page 153 and 154: 655 0$aElectronic books. 655 0$aInt
Page 155 and 156: 740 02$aThinking globally--the comp
Page 157 and 158: 650 0$aStructural dynamics. 650 0$a
Page 159 and 160: 700 1 $aMalmodin, Jens. 700 1 $aTra
Page 161 and 162: 650 0$aEarthquakes$xSafety measures
Page 163 and 164: 740 02$aBrief insight of project ma
Page 165 and 166: 655 0$aInternet resources. 740 02$a
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500 $aPrint version c2003. 500 $aRe
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650 0$aPower-plants$xEquipment and
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000 03994cam 2201177 a 4500 001 ccn
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650 0$aSealing compounds$xTesting.
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740 02$aCost engineering. 740 02$aO
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740 02$aUOP thermal hydrodealkylati
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010 $z 2002511505 020 $a0071449493
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700 1 $aTheisen, Hilary. 700 1 $aSp
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700 1 $aDenney, Richard W., Jr. 700
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700 1 $aDearth, David R. 700 1 $aKe
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650 0$aHorizontal oil well drilling
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020 $z9780071622974 (print) 020 $a0
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740 02$aHydraulics of open channel
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000 09104cam 2202365 a 4500 001 ccn
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740 02$aHVAC subsystems. 740 02$aAi
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035 $a(Sirsi) a213700 050 4$aTP492$
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740 02$aQuantum well infrared photo
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700 1 $aFarquhar, Edward A. 700 1 $
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500 $aPrint version c2003. 504 $aIn
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740 02$aStep-by-step overviews of o
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650 0$aMetal-cutting. 650 0$aTurnin
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740 02$aAdaptive control. 740 02$aO
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650 0$aMasonry. 650 0$aMasonry$xHis
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650 0$aEngineering design$xData pro
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700 1 $aDavic, Nicholas D. 700 1 $a
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740 02$aCase study : staffing a new
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650 0$aMetals$xFinishing. 650 0$aSt
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740 02$aDigital control systems. 74
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740 02$aIndustrial robots. 740 02$a
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655 0$aInternet resources. 740 02$a
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856 40$uhttp://accessengineeringlib
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650 0$aBackhoes. 650 0$aConveying m
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700 1 $aFan, Timothy. 700 1 $aKaise
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740 02$aEquipment for distillation,
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035 $a(Sirsi) a214000 050 4$aTA1520
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700 1 $aBritton, Gordon. 700 1 $aDe
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650 0$aPlastics$xChemical resistanc
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300 $a1 electronic text :$bill. 490
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001 ccn00214049 006 m f d 007 cr cn
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008 070501s2004 nyuab fobf 001 0 en
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650 0$aMicroelectronic packaging. 6
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700 1 $aKaiser, David A. 700 1 $aKe
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545 0 $aContributor biographical in
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700 1 $aBoyadjis, Paul A. 700 1 $aC
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650 0$aIntegrated circuits. 650 0$a
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700 1 $aRamdani, Jamal. 700 1 $aVac
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740 02$aSignaling transport (SIGTRA
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082 04$a621.382$221 245 00$aSpread
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700 1 $aMalyszek, Jeffrey D. 740 02
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740 02$aSpectral changes and linear
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700 1 $aChang, Hsun-Hsien. 700 1 $a
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505 0 $aFrequency bands, propagatio
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740 02$aSpectrum analysis. 740 02$a
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650 0$aPhase modulation. 650 0$aRad
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700 1 $aLebron, Ramon C. 700 1 $aCr
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740 02$aSubstitution and analog mea
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245 00$aStandard handbook of machin
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830 0$aMcGraw-Hill's AccessEngineer
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710 2 $aEnvirex Products. 710 2 $aS
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020 $z0071354719 (print) 035 $a(Sir
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650 0$aBuilding laws$zUnited States
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650 0$aLasers$xHistory. 650 0$aOpti
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008 070430s2003 nyua fobf 001 0 eng
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650 0$aLanduse, Urban. 650 0$aHuman
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588 $aDescription based on cover im
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650 0$aWater-supply$xSecurity measu
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650 0$aAbstract data types (Compute
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588 $aDescription based on cover im
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545 0 $aContributor biographical in
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949 $aTK 6570 .M6 L375$wLC$c1$i2141
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035 $a(Sirsi) a214198 050 4$aTA666$
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analysis of components -- ch. 19. S
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700 1 $aCarlson, C. L. 700 1 $aKiss
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949 $aTJ 151 .M37$wLC$c1$i214215-20
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740 02$aPrinciples of color vision.
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700 1 $aSoni, M. P. 700 1 $aPatel,
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650 0$aElectric wiring, Interior. 6
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000 07168cam 22020771a 4500 001 ccn
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740 02$aUltra wideband arrays. 740
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740 02$aArrays of folded unipoles.
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020 $z0071470751 (print) 020 $z9780
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740 02$aIdentification of ageing pr
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740 02$aRecognizing the forms of co
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700 1 $aTaylor, Tim. 700 1 $aMarch,
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007 cr cn ---uuauu 008 081008s2008
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740 02$aManaging the global design
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504 $aIncludes bibliographical refe
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020 $z0071548661 (print) 020 $a0071
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740 02$aRigid pipe products. 740 02
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740 02$aAlignment of a pair of sequ
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530 $aAlso issued in print and PDF
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050 4$aTP157$b.L475 2008 082 04$a62
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740 02$aIntroduction to solar power
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504 $aIncludes bibliographical refe
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245 10$aSolid waste analysis and mi
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700 1 $aKim, Y. Richard. 700 1 $aBa
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700 1 $aWaite, Gabi Nindl. 700 1 $a
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