uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...

740 02$aArea array solder spheres, pastes, and fluxes.
740 02$aModern solder and solder paste.
740 02$aLead-free systems and process implications.
740 02$aElectrically conductive adhesives for surfacemount and flip chip processes: an alternative
to solder?
740 02$aNext-generation flip chip materials and processing.
740 02$aFlip chip assembly and underfilling.
740 02$aBGA and CSP rework: what is involved?
740 02$aBGA assembly reliability.
740 02$aDie attach and rework.
740 02$aLiquid encapsulation equipment and processes.
740 02$aMolding for area array packages.
740 02$aScreen printing and stenciling.
740 02$aCriteria for placement and processing of advanced packages.
740 02$aOvens in electronics.
740 02$aProcess development, control, and optimization.
740 02$aMetrics : the key to productivity.
740 02$aCost estimating for electronic assembly.
740 42$aThe future of electronic packaging.
740 42$aThe future of SMT process equipment.
830 0$aMcGraw-Hill's AccessEngineering.
856 40$uhttp://accessengineeringlibrary.com/browse/area-array-packaging-handbook-manufacturing-andassembly$zSubscription
required
949 $aTK 7870.15 .G54$wLC$c1$i213532-2001$d12/28/2011$lMAIN$mMGH$q7$rY$sY$tWEB$u4/18/2007$xENG
997 $a(c)2007 Cassidy Cataloguing Services, Inc.
000 02392cam 2200577 a 4500
001 ccn00213533
006 m f d
007 cr cn ---uuauu
008 070418s2001 nyua fobf 001 0 eng d
010 $z 00053295
020 $a0071450351
020 $z0070471789 (print)
035 $a(Sirsi) a213533
050 4$aTD767$b.M37 2001
082 04$a628.3/64/0973$221
100 1 $aMcFarland, Michael J.,$d1958-
245 10$aBiosolids engineering$h[electronic resource] /$cMichael J. McFarland.
260 $aNew York :$bMcGraw-Hill,$c[2001]
300 $a1 electronic text :$bill.
490 1 $aMcGraw-Hill's AccessEngineering
588 $aDescription based on cover image and table of contents, viewed on April 18, 2007.
500 $aPrint version c2001.
504 $aIncludes bibliographical references and index.
505 0 $uhttp://www.loc.gov/catdir/toc/mh021/00053295.html
530 $aAlso issued in print and PDF version.
545 0 $aContributor biographical information$uhttp://www.loc.gov/catdir/bios/mh041/00053295.html
650 0$aSewage sludge$zUnited States$xManagement.
650 0$aOrganic wastes$xRecycling.
650 0$aOrganic wastes$xManagement.
650 0$aSewage sludge$xRecycling.
650 0$aSewage sludge$xAnalysis.
650 0$aOrganic wastes as soil amendments.
650 0$aSewage disposal$xGovernment policy.
650 0$aSewage disposal plants$xStandards.
650 0$aSewage$xPurification.
650 0$aSewage disposal plants$xDesign and construction.
650 0$aSoil moisture.
655 0$aElectronic books.
655 0$aInternet resources.
740 02$aBiosolids management practices and regulatory requirements.
740 02$aBiosolids characteristics and production rates.
740 02$aBiosolids and sludge processing.
740 02$aControl of biosolids quality.
740 02$aTransport, storage, and facilities design.