uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...
uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...
uuauu 008 100210s2009 nyua fob 001 0 eng - McGraw-Hill ...
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010 $z 2010287045<br />
020 $z9780071701013 (set: print)<br />
020 $z9780071476232 (book: print)<br />
020 $z9780071703345 (CD)<br />
020 $a0071753133<br />
035 $a(Sirsi) a310132<br />
050 4$aTK7836$b.H366 2010<br />
082 04$a621.381$222<br />
100 1 $aHarman, George G.<br />
245 10$aWire bonding in microelectronics$h[electronic resource] /$cGeorge G. Harmon.<br />
250 $a3rd ed.<br />
260 $aNew York :$b<strong>McGraw</strong>-<strong>Hill</strong>,$c[2010]<br />
300 $a1 electronic text (xx, 426 p.) :$bill.<br />
490 1 $a<strong>McGraw</strong>-<strong>Hill</strong>'s AccessEngineering<br />
588 $aDescription based on cover image and table of contents, viewed on August 28, 2010.<br />
500 $aPrint version c2010.<br />
500 $aPrevious edition: 1997; first published as: Reliability and yield problems of wire bonding<br />
in microelectronics. 1989.<br />
504 $aIncludes bibliographical references and index.<br />
530 $aAlso issued in print and PDF versions.<br />
650 0$aWire bonding (Electronic packaging)$xProduction control.<br />
650 0$aElectronic packaging$xReliability.<br />
650 0$aElectronic packaging$xDefects.<br />
650 0$aSemiconductors$xFailures.<br />
655 0$aElectronic books.<br />
655 0$aInternet resources.<br />
700 1 $aHarman, George G.$tReliability and yield problems of wire bonding in microelectronics.<br />
740 42$aThe technical introduction to the third edition.<br />
740 02$aUltrasonic bonding systems and technologies, including a description of the ultrasonic wire<br />
bonding mechanism.<br />
740 02$aBonding wire metallurgy and characteristics that can affect bonding, reliability, or<br />
testing.<br />
740 02$aWire bond testing.<br />
740 02$aGold-aluminum intermetallic compounds and other metallic interface reactions in wire<br />
bonding.<br />
740 02$aIntroduction to plating, section a (gold) and section b (nickel-based) bond pad technology<br />
and reliability.<br />
740 02$aCleaning to improve bondability and reliability.<br />
740 02$aMechanical problems in wire bonding.<br />
740 02$aAdvanced and specialized wire bonding technologies: (including high yield, fine pitch,<br />
pcbs, soft substrates, extreme temperature wire bonding and specialized looping).<br />
740 32$aAn overview of the materials and material science of copper, low-k devices that affect<br />
bonding and packaging.<br />
740 02$aWire bonding process modeling and simulation.<br />
830 0$a<strong>McGraw</strong>-<strong>Hill</strong>'s AccessEngineering.<br />
856 40$uhttp://access<strong>eng</strong>ineeringlibrary.com/browse/wire-bonding-in-microelectronics-thirdedition$zSubscription<br />
required<br />
949 $aTK 7836 .H366$wLC$c1$i310132-1<strong>001</strong>$d1/2/2012$lMAIN$mMGH$q3$rY$sY$tWEB$u8/30/2010$xENG<br />
997 $a(c)2010 Cassidy Cataloguing Services, Inc.<br />
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<strong>001</strong> ccn00310133<br />
006 m f d<br />
007 cr cn ---<strong>uuauu</strong><br />
<strong>008</strong> 1<strong>008</strong>30s2010 <strong>nyua</strong> <strong>fob</strong> <strong>001</strong> 0 <strong>eng</strong> d<br />
010 $z 2009052957<br />
020 $z9780071701884 (print)<br />
020 $a0071753141<br />
035 $a(Sirsi) a310133<br />
050 4$aTS176$b.G86 2010<br />
082 04$a658.5$222<br />
100 1 $aGustavson, Richard E.<br />
245 10$aProduction systems <strong>eng</strong>ineering$h[electronic resource] :$bcost and performance optimization<br />
/$cRichard E. Gustavson.<br />
260 $aNew York :$b<strong>McGraw</strong>-<strong>Hill</strong>,$c[2010]<br />
300 $a1 electronic text (xix, 233 p.) :$bill.
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