CHAMP Interconnection System

Product Facts
■ EMI shielded high density
and low profile I/O system
■ Contacts on 0.8mm
centerlines—offer 30%
linear PC board space
savings
■ Low profile right angle PC
connector, 5.0mm high—
a 50% reduction in height
■ Available in thru-hole,
surface mount, and hybrid
PC board lead
configuration—
combination of surface
mount and thru-hole leads
■ Depending on contact
design, durability cycles
range from 500 up to 2000
insertion cycles
■ Contact tips recessed for
ESD and damage protection
■ M2 threaded hardware for
panel mounting
■ PC board connectors available
in 50- and 68-position
receptacle assemblies, and
50-position plug assemblies
■ Cable plug connectors
accept 30 AWG [0.05mm2]
solid or stranded wire and
are available in 36-, 50- and
68-position assemblies
■ Contacts are insulation
displacement type (IDC) and
can be quickly terminated
by the CHAMPOMATOR 2.5
Semi-Automatic Termination
Machine
■ Metal-shell backshell kits
feature integral cable braid
termination and a choice of
squeeze-to-release latches or
jackscrew mating hardware
■ Enclosure cover for
backshell kit made of UL
94V-0 rated ABS
■ Die cast backshell with
integral cable braid termination
and strain relief for 68-
position offset cable plugs
■ Produced under a Quality
Management System
certified to ISO 9001
A copy of the
certificate is available
upon request.
CHAMP Interconnection System
CHAMP 0.8mm Centerline Connectors (SCSI-3, VHDCI)
The CHAMP 0.8mm High
Density Interconnection
System is designed for high
density, low profile (5.0mm),
shielded applications featuring
two rows of contacts on
0.8mm centerlines. Typical
applications include:
• Docking Connectors
• Shielded I/O Connectors
• Removable Floppy /
CD-ROM drives
• Network Bridges / Routers /
Hubs
• Multiple Low Profile and
High Density I/O’s
• Severely Limited
“Backpanel” I/O Area
• PC / File Server Controller
Cards
• Next Generation SCSI
I/O or VHDCI
The CHAMP 0.8mm 68-position
connector system was
developed to support the
VHDCI (Very High Density
Cable Interconnect) specification.
Multiple options are
available including single
and stacked right angle
receptacles and standard as
well as offset cable plugs.
Contacts on 0.8mm centerlines
provide 30% linear
board space savings, and
5.0mm low profile housing
provide approximately 50%
reduction in height when
compared to other interconnection
systems.
Cable plug connectors
accept 30 AWG [0.05mm2]
solid or stranded wire, and
feature insulation displacement
crimp (IDC) terminations.
Incorporated in the
design are precision insert
molded contacts with tips
recessed for ESD and damage
protection.
Backshell kits offer additional
protection and are composed
of: a) Hermaphroditic
metal shells with integral
cable braid termination and
strain relief, b) Choice of
squeeze-to-release latches
or jackscrew mating hardware,
c) Backshell covers
made of UL 94V-0 rated
ABS/PC complete the cable
connector assembly, d) die
cast backshell with integral
cable braid termination and
strain relief for 68-position
offset cable plugs.
Application tooling for the
cable plug connectors consists
of the CHAMPOMATOR
2.5 semi-automatic termination
machine, and a bench
mounted arbor press and
die set for terminating and
installing the backshell kit.
Technical Documents
Product Specification
108-1471
Application Specification
114-6057
Test Report
501-335
CHAMP 0.8mm Centerline
Connector Systems
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Catalog 1-1773441-4 Dimensions are in inches and Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514
Issued 10-05 millimeters unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628
specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013
www.tycoelectronics.com are metric equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967
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