Remote Health Monitoring for Asset Management

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Table of Contents List of Figures ................................................................................................................................. ii Executive Summary ........................................................................................................................ 1 1 Introduction ............................................................................................................................. 2 2 Background .............................................................................................................................. 3 3 Project Instrumentation............................................................................................................ 5 Sensors ........................................................................................................................................ 5 Array Design and Manufacture ................................................................................................... 8 Software .................................................................................................................................... 15 4 Laboratory Testing ................................................................................................................ 16 Test Design ................................................................................................................................ 16 Results ....................................................................................................................................... 18 5 Field Implementation of Technology .................................................................................... 27 Sensor Array Manufacturing ..................................................................................................... 27 Laboratory testing of sensor array ............................................................................................. 29 Site Selection ............................................................................................................................. 33 Software .................................................................................................................................... 34 Prototype Pile ............................................................................................................................ 35 Results of Pile Installation ......................................................................................................... 38 Web Data ................................................................................................................................... 44 6 Conclusions ........................................................................................................................... 47 Recommendations ..................................................................................................................... 47 Implementation Plan ................................................................................................................. 48 REFERENCES ............................................................................................................................. 49 i
List of Figures Figure 2.1. Photograph of the Skoharie Creek Bridge collapse, 1987. ........................................... 3 Figure 3.1. DS2480B usage layout. ................................................................................................ 7 Figure 3.2. Photograph of sensor and pin layout of DS18S20. ....................................................... 7 Figure 3.3. AutoCAD drawing used for printing circuit boards. .................................................... 9 Figure 3.4. Setup for exposing circuit boards. .............................................................................. 10 Figure 3.5. Photonegative used for exposure. ............................................................................... 11 Figure 3.6. Exposed boards in the chemical bath. ........................................................................ 11 Figure 3.7. Excess copper being removed from the printed circuit boards. ................................ 12 Figure 3.8. Photograph of small test sensor array with 2 sensors. ................................................ 13 Figure 3.9. Photograph of the milling operation to level epoxy. .................................................. 13 Figure 3.10. Small sensor array test setup. ................................................................................... 14 Figure 3.11. Diagram of the 48 in. sensor array, showing individual sensor locations and addresses. ...................................................................................................................................... 15 Figure 3.12. Pouring epoxy into large test array. .......................................................................... 15 Figure 4.1. Schematic diagram of test set-up showing heaters, sensor array and sand/water interface. ........................................................................................................................................ 16 Figure 4.2. Both sides of large test pile, showing heater and array locations. .............................. 17 Figure 4.3. Image of sensor array and water filled test pile. ......................................................... 18 Figure 4.4. Front panel of Labview program. ............................................................................... 19 Figure 4.5. Sensor array measurement during heating to50°C and cooling. ................................ 20 Figure 4.6. Sensor array output during 1-day, 55 degree Celsius test. ......................................... 21 Figure 4.7. Temperature gradient in the test pile during heating. ................................................ 22 Figure 4.8. Temperature gradient in the test pile during heating and cooling. ............................ 23 Figure 4.9. Thermocouple and DS18S20 readings during cooling and heating. ......................... 24 Figure 4.10. Thermal gradient along the length of the test pile during cold water test. .............. 25 Figure 4.11. Results of monitoring the sensor array over a 5 day period. .................................... 26 Figure 5.1. Schematic diagram of sensor configuration in armor channel. .................................. 27 Figure 5.2. Photograph of the assembled sensor array showing plastic stand-offs, welded studs, sensors and conductive trunk lines. .............................................................................................. 28 Figure 5.3. Photographs of the array construction showing A) soldering connections in the armored channel, B) mixing the epoxy, C) placing the epoxy in armored channel and D) completed array. ............................................................................................................................ 29 Figure 5.4. Schematic diagram of laboratory test set-up. ............................................................. 30 Figure 5.5. Sensor array output during heating test. .................................................................... 31 Figure 5.6. Response of sensor 1, 6, 11, and 30 to applied heat from an infrared heater at location 1. ...................................................................................................................................... 31 Figure 5.7. Temperature distribution along the length of the array during laboratory testing. ... 32 Figure 5.8. 3-D graph showing sensor array behavior in the laboratory. .................................... 33 ii
Page 1 and 2: • • • • • • • • •
Page 3: FINAL REPORT RI07-002 Remote Health
Page 7 and 8: Executive Summary This project expl
Page 9 and 10: States as a means of technology tra
Page 11 and 12: where the soil / water interface ex
Page 13 and 14: from a sensor, the micro-controller
Page 15 and 16: solder connections, simplify manufa
Page 17 and 18: Figure 3.5. Photonegative used for
Page 19 and 20: temperature changes that could be m
Page 21 and 22: Figure 3.11. Diagram of the 48 in.
Page 23 and 24: Two ceramic heatplates were used to
Page 25 and 26: stores the data at a specified rate
Page 27 and 28: TEMPERATURE(°C) 60 50 40 30 20 10
Page 29 and 30: 45 109 TEMPERATURE (ºC) 40 35 30 2
Page 31 and 32: 50 TEMPERATURE ( F) 50 55 60 65 70
Page 33 and 34: 5 Field Implementation of Technolog
Page 35 and 36: the array after the epoxy has been
Page 37 and 38: 33 91 31 TEMPERATURE (ºC) 29 27 25
Page 39 and 40: Figure 5.8. 3-D graph showing senso
Page 41 and 42: interval. A time interval of 15 min
Page 43 and 44: 5.13, a portion of the pile is inst
Page 45 and 46: several days. Temperatures increase
Page 47 and 48: Where is the sample mean and n is
Page 49 and 50: The data can also be observed as a
Page 51 and 52: to select a different time period f
Page 53 and 54: 6 Conclusions This research has exp
Page 55 and 56:
REFERENCES 1. Richardson, E.P.-O.,
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