Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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4.0 Thermal Specifications and Design Considerations......................................................... 494.1 Thermal Specifications........................................................................................ 504.1.1 Thermal Diode........................................................................................ 535.0 S.E.C.C. and S.E.C.C.2 Mechanical Specifications......................................................... 545.1 S.E.C.C. Mechanical Specifications.................................................................... 545.2 S.E.C.C.2 Mechanical Specification.................................................................... 615.3 S.E.C.C.2 Structural Mechanical Specification ................................................... 675.4 Processor Package Materials Information .......................................................... 695.5 Intel ® Pentium ® III Processor Signal Listing........................................................ 695.6 Intel ® Pentium ® III Processor Core Pad to Substrate Via Assignments .............. 765.6.1 Processor Core Pad Via Assignments (CPUID=067xh)......................... 765.6.2 Processor Core Signal Assignments (CPUID=067xh) ........................... 765.6.3 Processor Core Pad Via Assignments (CPUID=068xh)......................... 876.0 Boxed Processor Specifications....................................................................................... 886.1 Introduction .........................................................................................................886.2 Fan Heatsink Mechanical Specifications............................................................. 886.2.1 Intel ® Boxed Processor Fan Heatsink Dimensions ................................ 886.2.2 Intel ® Boxed Processor Fan Heatsink Weight........................................ 906.2.3 Intel ® Boxed Processor Retention Mechanism....................................... 906.3 Fan Heatsink Electrical Requirements ................................................................ 916.3.1 Fan Heatsink Power Supply................................................................... 916.4 Fan Heatsink Thermal Specifications..................................................................926.4.1 Intel ® Boxed Processor Cooling Requirements...................................... 927.0 Intel ® Pentium ® III Processor Signal Description ............................................................. 937.1 Alphabetical Signals Reference .......................................................................... 937.2 Signal Summaries ............................................................................................. 1004 Datasheet
Figures1 Second Level (L2) Cache Implementation ...........................................................92 AGTL+ Bus Topology..........................................................................................143 Stop Clock State Machine ...................................................................................144 BSEL[1:0] Example for a 100 MHz System Design (100 MHz ProcessorInstalled)..............................................................................................................225 BSEL[1:0] Example for a 100/133 MHz Capable System(100 MHz Processor Installed) ............................................................................236 BSEL[1:0] Example for a 100/133 MHz Capable System(133 MHz Processor Installed) ............................................................................237 BCLK, PICCLK, and TCK Generic Clock Waveform...........................................378 System Bus Valid Delay Timings ........................................................................389 System Bus Setup and Hold Timings..................................................................3810 System Bus Reset and Configuration Timings....................................................3811 Power-On Reset and Configuration Timings.......................................................3912 Test Timings (TAP Connection) ..........................................................................3913 Test Reset Timings .............................................................................................3914 BCLK and PICCLK Generic Clock Waveform .....................................................4015 Maximum Acceptable AGTL+ and Non-AGTL+ Overshoot/UndershootWaveform ............................................................................................................4616 Low to High AGTL+ and Non-AGTL+ Receiver Ringback Tolerance .................4817 Signal Overshoot/Undershoot, Settling Limit, and Ringback...............................4818 S.E.C.Cartridge — 3-Dimensional View..............................................................4919 S.E.C.Cartridge 2 — Substrate View ..................................................................5020 Processor Functional Die Layout (CPUID=0686h)..............................................5221 Processor Functional Die Layout (up to CPUID=0683h).....................................5222 S.E.C.C. Packaged Processor — Multiple Views................................................5423 S.E.C.C. Packaged Processor — Extended Thermal Plate SideDimensions..........................................................................................................5524 S.E.C.C. Packaged Processor — Bottom View Dimensions...............................5525 S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal Plate Lug,and Cover Lug Dimensions .................................................................................5626 S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal Plate,and Cover Detail Dimensions (Reference Dimensions Only)..............................5727 S.E.C.C. Packaged Processor — Extended Thermal Plate AttachmentDetail Dimensions ...............................................................................................5829 S.E.C.C. Packaged Processor Substrate — Edge Finger ContactDimensions..........................................................................................................5928 S.E.C.C. Packaged Processor — Extended Thermal Plate AttachmentDetail Dimensions, Continued .............................................................................5930 S.E.C.C. Packaged Processor Substrate — Edge Finger ContactDimensions, Detail A ...........................................................................................6031 Intel ® Pentium® III Processor Markings (S.E.C.C. Packaged Processor)...........6032 S.E.C.C.2 Packaged Processor — Multiple Views..............................................6133 S.E.C.C.2 Packaged Processor Assembly — Primary View...............................6234 S.E.C.C.2 Packaged Processor Assembly — Cover View with Dimensions ......6235 S.E.C.C.2 Packaged Processor Assembly — Heatsink Attach Boss Section.....6336 S.E.C.C.2 Packaged Processor Assembly — Side View ....................................6337 Detail View of Cover in the Vicinity of the Substrate Attach Features.................6338 S.E.C.C.2 Packaged Processor Substrate — Edge Finger ContactDimensions..........................................................................................................64Datasheet 5
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Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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