Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 42. S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) — Keep-Out ZoneKeep Out Zone (Bottom Side View)Figure 43. S.E.C.C.2 Packaged Processor Substrate (CPUID=068xh) — Keep-Out ZoneKeep Out Zone (Front Side View).362 .363.440.448Keep Out Zone (Bottom Side View)66 Datasheet
S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 44. Intel ® Pentium ® III Processor Markings (S.E.C.C.2 Package)"""""""""" """ "" """" " """""" " " """"""" """ """"""" " "" " """"" " " " """"" "" """ " """ " "" " """ " """""""" """FDNOTE:Please refer to the Pentium ® IIIProcessor Specification Updatefor this information.Table 30. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)Code LetterACDFDescriptionLogoTrademarkLogoDynamic Mark Area – with 2-D matrix5.3 S.E.C.C.2 Structural Mechanical SpecificationThe intention of the structural specification for S.E.C.C.2 is to ensure that the package will not beexposed to excessive stresses that could adversely affect device reliability. Figure 45 illustrates thedeflection specification for deflections away from the heatsink. Figure 46 illustrates the deflectionspecification in the direction of the heatsink.The heatsink attach solution must not induce permanent stress into the S.E.C.C.2 substrate with theexception of a uniform load to maintain the heatsink to the processor thermal interface. Figure 47and Table 31 define the pressure specification.Figure 45. Substrate Deflection away from HeatsinkProcessor Substrate5 cycles maximum0.025F/2 F/2Datasheet 67
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Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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