Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

S.E.C.C. and S.E.C.C.2 Mechanical Specifications5.4 Processor Package Materials InformationBoth the S.E.C.C. and S.E.C.C.2 processor packages are comprised of multiple pieces to make thecomplete assembly. This section provides the weight of each piece and the entire package. Table 32and Table 33 contain piece-part information of the S.E.C.C. and S.E.C.C.2 processor packages,respectively.Table 32. S.E.C.C. MaterialsS.E.C.C. Piece Piece Material Maximum Piece Weight (Grams)Extended Thermal Plate Aluminum 6063-T6 84.0Latch Arms GE Lexan 940-V0, 30% glass filled Less than 2.0 per latch armCover GE Lexan 940-V0 24.0Total Pentium III Processor 112.0Table 33. S.E.C.C.2 MaterialsS.E.C.C.2 Piece Piece Material Maximum Piece Weight (Grams)Cover GE Lexan 940-V0 18.0Total Pentium III Processor 54.05.5 Intel ® Pentium ® III Processor Signal ListingTable 34 and Table 35 provide the processor edge finger signal definitions. The signal locations onthe SC242 edge connector are to be used for signal routing, simulation, and component placementon the baseboard.Table 34 is the Pentium III processor substrate edge finger listing in order by pin number. Table 35is the Pentium III processor substrate edge connector listing in order by signal name.Datasheet 69