Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

Boxed Processor SpecificationsFigure 53. Top View Air Space Requirements for the Intel ® Boxed ProcessorTable 38. Intel ® Boxed Processor Fan Heatsink Spatial DimensionsFig. Ref.LabelRefers toFigure Dimensions (Inches) Min Typ MaxA 51S.E.C.C.2 Fan Heatsink Depth (off processorsubstrate)1.48B 51 S.E.C.C.2 Fan Heatsink Height Above Baseboard 0.4C 52 S.E.C.C.2 Fan Heatsink Height 2.2D 52 S.E.C.C.2 Fan Heatsink Width (plastic shroud only) 4.9E 52S.E.C.C.2 Power Cable Connector Location fromEdge of Fan Heatsink Shroud1.4 1.45F 53 Airflow keep-out zones from end of fan heatsink 0.40G 53 Airflow keep-out zones from face of fan heatsink 0.206.2.2 Intel ® Boxed Processor Fan Heatsink WeightThe boxed processor fan heatsink will not weigh more than 225 grams. See Section 4.0 andSection 5.0 for details on the processor weight and heatsink requirements.6.2.3 Intel ® Boxed Processor Retention MechanismThe boxed processor requires processor retention mechanism(s) to secure the processor in the242-contact slot connector. S.E.C.C.2 processors must use either retention mechanisms describedin AP-826, Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages(Document Number 243748) or Universal Retention Mechanisms that accept S.E.C.C., S.E.P.P.and S.E.C.C.2 packaged processors. The boxed processor will not ship with a retentionmechanism. Baseboards designed for use by system integrators must include retentionmechanisms that support the S.E.C.C.2 package and the appropriate installation instructions.90 Datasheet