Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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39 S.E.C.C.2 Packaged Processor Substrate — Edge Finger ContactDimensions (Detail A) ......................................................................................... 6440 S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) —Keep-In Zones..................................................................................................... 6541 S.E.C.C.2 Packaged Processor Substrate (CPUID=068xh) —Keep-In Zones..................................................................................................... 6542 S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) —Keep-Out Zone.................................................................................................... 6643 S.E.C.C.2 Packaged Processor Substrate (CPUID=068xh) —Keep-Out Zone.................................................................................................... 6644 Intel ® Pentium® III Processor Markings (S.E.C.C.2 Package) ........................... 6745 Substrate Deflection away from Heatsink ........................................................... 6746 Substrate Deflection toward the Heatsink ........................................................... 6847 S.E.C.C.2 Packaged Processor Specifications................................................... 6848 Processor Core Pad Via Assignments ................................................................ 7649 Intel ® Pentium ® III Processor S.E.C.C. 2 Via Map.............................................. 8750 Boxed Intel ® Pentium ® III Processor in the S.E.C.C.2 Packaging(Fan Power Cable Not Shown) ........................................................................... 8851 Side View Space Requirements for the Intel ® Boxed Processor withS.E.C.C.2 Packaging .......................................................................................... 8952 Front View Space Requirements for the Intel ® Boxed Processor withS.E.C.C.2 Packaging .......................................................................................... 8953 Top View Air Space Requirements for the Intel ® Boxed Processor.................... 9054 Intel ® Boxed Processor Fan Heatsink Power Cable Connector Description....... 9155 Recommended Baseboard Power Header Placement Relative to FanPower Connector and Intel ® Pentium ® III Processor........................................... 92Tables1 Processor Identification....................................................................................... 112 Related Documents ............................................................................................123 Voltage Identification Definition........................................................................... 194 System Bus Signal Groups ................................................................................. 215 Frequency Select Truth Table for BSEL[1:0] ...................................................... 226 Absolute Maximum Ratings (CPUID=067xh)...................................................... 247 Absolute Maximum Ratings (CPUID=068xh)...................................................... 258 Voltage and Current Specifications..................................................................... 269 AGTL+ Signal Groups DC Specifications............................................................3110 Non-AGTL+ Signal Group DC Specifications...................................................... 3111 AGTL+ Bus Specifications .................................................................................. 3212 System Bus AC Specifications (Clock) at Processor Core Pins ......................... 3313 Valid System Bus, Core Frequency, and Cache Bus Frequencies.....................3414 System Bus AC Specifications (AGTL+ Signal Group) at the ProcessorCore Pins ............................................................................................................ 3515 System Bus AC Specifications (CMOS Signal Group) at the ProcessorCore Pins ............................................................................................................ 3516 System Bus AC Specifications (Reset Conditions) ............................................. 3517 System Bus AC Specifications (APIC Clock and APIC I/O) at the ProcessorCore Pins ............................................................................................................ 366 Datasheet
18 System Bus AC Specifications (TAP Connection) at the ProcessorCore Pins.............................................................................................................3619 BCLK, PICCLK, and PWRGOOD Signal Quality Specifications at theProcessor Core ...................................................................................................4020 100 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .....................4421 133 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .....................4522 33 MHz Non-AGTL+ Signal Group Overshoot/Undershoot Tolerance................4523 Signal Ringback Specifications for Signal Simulation .........................................4724 AGTL+ and Non-AGTL+ Signal Groups Ringback Tolerance Specifications......4725 Thermal Specifications for S.E.C.C. Packaged Processors................................5026 Thermal Specifications for S.E.C.C.2 Packaged Processors..............................5127 Thermal Diode Parameters .................................................................................5328 Thermal Diode Interface......................................................................................5329 Description Table for Processor Markings (S.E.C.C. Packaged Processor).......6130 Description Table for Processor Markings (S.E.C.C.2 Packaged Processor).....6731 S.E.C.C.2 Pressure Specifications......................................................................6832 S.E.C.C. Materials...............................................................................................6933 S.E.C.C.2 Materials.............................................................................................6934 Signal Listing in Order by Pin Number ................................................................7035 Signal Listing in Order by Signal Name...............................................................7336 Via Listing in Order by Signal Name ...................................................................7737 Via Listing in Order by VIA Location....................................................................8238 Intel ® Boxed Processor Fan Heatsink Spatial Dimensions .................................9039 Fan Heatsink Power and Signal Specifications...................................................9140 Baseboard Fan Power Connector Location ........................................................9241 Signal Description ...............................................................................................9342 Output Signals...................................................................................................10043 Input Signals......................................................................................................10044 Input/Output Signals (Single Driver)..................................................................10145 Input/Output Signals (Multiple Driver) ...............................................................101Datasheet 7
Page 1 and 2: Intel ® Pentium ® III Processor f
Page 3 and 4: Contents1.0 Introduction...........
Page 5: Figures1 Second Level (L2) Cache Im
Page 9 and 10: Introduction1.0 IntroductionThe Int
Page 11 and 12: Introduction1.1.2 Processor Naming
Page 13 and 14: Electrical Specifications2.0 Electr
Page 15 and 16: Electrical SpecificationsFor the pr
Page 17 and 18: Electrical Specifications2.2.7 Cloc
Page 19 and 20: Electrical SpecificationsTable 3.Vo
Page 21 and 22: Electrical SpecificationsTable 4.Sy
Page 23 and 24: Electrical SpecificationsFigure 5.
Page 25 and 26: Electrical SpecificationsTable 7.Ab
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Page 31 and 32: Electrical SpecificationsTable 9.AG
Page 33 and 34: Electrical SpecificationsThe timing
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Page 39 and 40: Electrical SpecificationsFigure 11.
Page 41 and 42: Signal Quality Specifications3.2 AG
Page 43 and 44: Signal Quality Specifications3.2.4
Page 45 and 46: Signal Quality SpecificationsTable
Page 47 and 48: Signal Quality SpecificationsTable
Page 49 and 50: Thermal Specifications and Design C
Page 55 and 56: S.E.C.C. and S.E.C.C.2 Mechanical S
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S.E.C.C. and S.E.C.C.2 Mechanical S
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Intel ® Pentium ® III Processor f
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Boxed Processor SpecificationsBaseb
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Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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