Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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S.E.C.C. and S.E.C.C.2 Mechanical Specifications5.0 S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsPentium III processors use either S.E.C.C. or S.E.C.C.2 package technology. Both package typescontain the processor core, L2 cache, and other passive components. The cartridges connect to thebaseboard through an edge connector. Mechanical specifications for the processor are given in thissection. See Section 1.1.1 for a complete terminology listing.5.1 S.E.C.C. Mechanical SpecificationsNote:S.E.C.C. package drawings and dimension details are provided in Figure 22 through Figure 31.Figure 22 shows multiple views of the Pentium III processor in an S.E.C.C. package; Figure 23through Figure 26 show the package dimensions; Figure 27 and Figure 28 show the extendedthermal plate dimensions; and Figure 29 and Figure 30 provide details of the processor substrateedge finger contacts. Figure 31 and Table 29 contain processor marking information. SeeSection 5.2 for S.E.C.C.2 mechanical specifications.The processor edge connector defined in this document is referred to as the “SC242 connector.”See the Slot 1 Connector Specification (Document Number 243397) for further details on theSC242 connector.For Figure 22 through Figure 44, the following apply:1. Unless otherwise specified, the following drawings are dimensioned in inches.2. All dimensions provided with tolerances are guaranteed to be met for all normal productionproduct.3. Figures and drawings labeled as “Reference Dimensions” are provided for informationalpurposes only. Reference Dimensions are extracted from the mechanical design database andare nominal dimensions with no tolerance information applied. Reference Dimensions areNOT checked as part of the processor manufacturing. Unless noted as such, dimensions inparentheses without tolerances are Reference Dimensions.4. Drawings are not to scale.Figure 22. S.E.C.C. Packaged Processor — Multiple ViewsTop ViewLeft LatchCoverRight LatchThermalPlateLeft Cover Side view Right RightSideRightThermal PlateSide ViewLeft54 Datasheet
S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 23. S.E.C.C. Packaged Processor — Extended Thermal Plate Side Dimensions3.805±.020(0.750)2.473±.016(1.500)2.070±.0202X .125±.0051.235±.0202X .342±.005These dimensions are from the bottomof the substrate edge fingers2X .365±.005 1.745±.005 1.877±.020005Figure 24. S.E.C.C. Packaged Processor — Bottom View DimensionsCover5.255±.006Thermal Plate2.181±.0153.243±.0155.341±.0105.505±.010Datasheet 55
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Intel ® Pentium ® III Processor f
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Intel Pentium III Processor for the SC242 at 450 MHz to 1.0 GHz

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