AWARDS

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Stelson;s fluid power research includes work on hydraulic hybrid vehicles and
hydrostatic transmissions for wind power. His research has been published in more
than 100 ;ournal articles and conference proceedings papers. He holds two - .S. patents.
An ASME member; Stelson is general chair of the 201; Dynamic Systems and Control
Conference; being held in Minneapolis in October. He was co-chair of the 201;
and 201; ASME; ; ath Symposium on Fluid Power and Motion Control; and chair of
the Program Committee for the 1; ; ; ;apan-- .S.A. Symposium on Flexible Automation.
He served as associate technical editor ;1; ; 2–2002; for the !9!!nal 90 ! an!0a-!!!3n1
!-3/n-/ an. !n13n//!3n1 ;originally the !9!!nal 90 !n13n//!3n1 09!!n.!!!!C;. He was also
associate editor for the !9!!nal 90 !Cna!3- !C!!/!!!! /a!!!/!/n!an. !9n!!9l ;200; –11;;
which presented him with two Rudolf Kalman ; est Paper awards ;1; ; ; ; 200; ;. Earlier
he received a 1 oung Engineer of the 1 ear Award from ASME;s Minnesota Chapter
;1; ; ; ;.
Stelson is a Fellow of the American Association for the Advancement of Science and
a member of Sigma 0 i; the Scientific Research Society. He served on the North American
Manufacturing Research Institution of SME;s Scientific Advisory Committee.
His other honors include Stanford - niversity;s Frederick Emmons Terman Scholastic
Award ;1; ; ; ;; an NSF fellowship ;1; ; ; –; ; ;; Outstanding Teacher awards from
- of M;s Institute of Technology ;1; ; ; ; 1; ; ; ;; an NSF Presidential 1 oung Investigator
Award ;1; ; ; ; and the American Society for Engineering Education;s Dow Outstanding
New Faculty Award ;1; ; ; ;.
Stelson earned three degrees in mechanical engineering; his bachelor;s from Stanford
- niversity; California; in 1; ; ; ; and his master;s and Sc.D. from the Massachusetts Institute
of Technology; Cambridge; in 1; ; ; and 1; ; 2; respectively.
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THE ALLAN KRA- S THERMAL MANA; EMENT MEDAL; established in 200; ;
recognizes individuals who have demonstrated outstanding achievements in thermal
management of electronic systems and their commitment to the field of thermal science
and engineering.
RA. I MAHA;AN; Ph.D.; senior principal engineer; Intel Corporation ;Chandler;
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Dr. Maha;an is a senior principal engineer in the path finding group; part of Intel
Corporation;s Assembly and Test Technology Development ;Chandler; Ariz.;. He is
responsible for setting technology directions for micro-electronics packaging and
assembly of silicon at future nodes as well as the technical direction for Intel- and consortia-funded
research in semiconductor packaging. He is Intel;s representative on the
Semiconductor Research Corporation;s ;SRC; technical advisory board.
Maha;an;s contributions include the development of analytical and experimental
methods for thermal management; the creation of widely deployed thermal solution
technologies for high-power density semiconductor devices; the setting of the direction
of thermal research that has led to a number of innovative ideas in the field; and the
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