26.01.2013 Views

Ties That Bind - Bay Area Council Economic Institute

Ties That Bind - Bay Area Council Economic Institute

Ties That Bind - Bay Area Council Economic Institute

SHOW MORE
SHOW LESS

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

118<br />

<strong>Ties</strong> <strong>That</strong> <strong>Bind</strong><br />

throughout China. APMG owns 10 joint ventures in Beijing, Shanghai, Shenyang, Harbin,<br />

Chongqing and Dalian. Some are VIP inpatient units within existing hospitals, while others are<br />

freestanding clinics. APMG’s primary specializations are neurosurgery and radiation oncology,<br />

treating tumors and cancers with high-end “gamma knife” technologies, but an important component<br />

of their facilities is also maintenance and management that meet Western standards.<br />

Among APMG’s Chinese partners are Shanghai Medical University; Beijing Neurological <strong>Institute</strong>;<br />

First Affiliated Hospital of Tsinghua University; Shanghai Huashan Hospital of Fudan University,<br />

Chongwen District Public Health Bureau of Beijing, Chinese Medical University’s Second<br />

Affiliated Hospital; and Harbin Medical University’s First Affiliated Hospital. Venture capital<br />

firms ChinaVest and Ajia Partners of Hong Kong have provided financing for the enterprise.<br />

China Grows Its Semiconductor Sector<br />

An earlier section of this report described the flow of Taiwanese engineering and science students<br />

to the U.S. during the 1970s, and the Taiwan government’s strategy to lure them back with<br />

venture and startup funding. In the process, Taiwanese engineers in Silicon Valley helped pioneer<br />

a new, more efficient and economic “fabless/foundry” business model for integrated circuit design<br />

and development.<br />

Chips have become ever smaller, faster, more complex, more specialized and more densely<br />

packed together on larger, 300-millimeter wafers to perform specific tasks. As they have, the cost<br />

of materials, fabrication and testing have all increased commensurately. An integrated device<br />

manufacturer (IDM) like Intel, Advanced Micro Devices or Texas Instruments, that makes its<br />

own chip designs may spend more than $3 billion to build a fabrication plant.<br />

Over the long term a typical 10:1 revenue-cost ratio still makes the effort worthwhile in many<br />

cases: A 0.25-micron chip design that costs $1 million to bring to market may earn $10 million,<br />

for example, while a higher-end, 90-nanometer design that costs $25 million might earn back<br />

$250 million. Customization has also opened new applications and markets for high-end designers,<br />

as basic chips have become increasingly commoditized. In addition, demand for higher-end<br />

chips has grown well beyond narrow specialty applications in a few technology-intensive industries<br />

to high-volume, mass markets like automobiles, personal computing, mobile phones and<br />

consumer electronics.<br />

The Fabless Alternative<br />

For startups and smaller boutique design firms as well as for larger, more vertically-integrated<br />

producers, managing up front costs is critical in maintaining margins and competitive advantage.<br />

As the Semiconductor Industry Association describes the current market:<br />

“Fabless companies focus on designing and marketing competitive products, while<br />

farming out wafer production to foundries. The foundries are able to invest the<br />

billions of dollars necessary to upgrade and grow their capacity by spreading the

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!